Bystronic AG
0QW1.L
London Stock Exchange193.64
CHF
-1.57
- -
Bystronic AG
0QW1.L
(London Stock Exchange)
Recent
price
193.64
P/E
ratio
- -
div
yld
- -
ROIC.AI
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
•
in mil. unless spec.- Similar Companies
- Business
- Bystronic AG (SIX: BYS) provides high-performance solutions for sheet metal processing, specializing in the automation of cutting and bending process chains through intelligent connectivity of laser systems, press brakes, automation, software, and services worldwide. The company offers laser cutting systems including flatbed and tube lasers with fiber laser technology; bending solutions such as press brakes; automation equipment for material handling and loading/unloading; and Bysoft software suites for production planning, nesting, and digitalization; complemented by comprehensive service packages including up to five-year warranties on fiber laser sources. Bystronic operates through regional segments covering EMEA, Americas, China, and APAC, with sales and service subsidiaries in more than 30 countries and agents elsewhere, targeting manufacturers in industries from general fabrication to automotive and aerospace. Founded in 1964 as Bystronic Maschinen AG and headquartered in Niederönz, Switzerland, the company maintains key production and development sites in Sulgen (Switzerland), Gotha (Germany), Cazzago San Martino and San Giuliano Milanese (Italy), Tianjin, Shanghai, and Shenzhen (China), and Hoffman Estates (USA), employing over 3,200 people globally. In November 2025, Bystronic signed an agreement to acquire the "Tools for Materials Processing" business unit from Coherent Inc., a US-based entity with approximately 400 employees and US$100 million in revenue headquartered in southern Germany, to expand into growth markets like medical devices, semiconductors, and micromaterial processing applications including marking, labeling, and drilling, while gaining rights to the Rofin laser technology brand under a new "Bystronic Rofin" unit; the transaction awaits regulatory approvals and closure in coming months.