Microelectronics Technology Inc.

Microelectronics Technology Inc.

2314.TW
Microelectronics Technology Inc.TW flagTaiwan Stock Exchange
16.60
TWD
+0.30
- -
4.18BMarket Cap
Microelectronics Technology Inc.
2314.TW
(Taiwan Stock Exchange)

Recent

price

16.60

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
58.46
174.87
114.91
33.05
30.41
73.59
36.94
33.84
34.31
24.97
17.01
40.49
45.08
33.37
15.74
- -
9.14
Revenue per Share
-1.14
-46.5
-15.61
-4.43
-2.59
0.48
0.8
0.72
0.22
0.01
-0.41
-4.64
-4.89
-6.17
-10.8
- -
-3.53
Basic EPS, GAAP
-7.38
-51.12
-5.63
-0.02
-2.36
-1.23
0.79
-1.02
0.55
0.59
-0.35
-16.64
-6.06
-2.88
0.43
- -
-0.65
Free Cash Flow per Basic Share
0.01
- -
- -
- -
- -
- -
- -
0.11
0.2
0.2
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
30.4
60.39
22.98
5.83
3.24
15.82
10.63
10.86
10.53
9.83
9.31
17.74
13.79
8.79
-2.35
- -
-4.82
Book Value per Share
27.56
49.9
40.76
9.65
7.84
19.7
9.82
11.06
10.58
10.13
9.11
17.15
17.74
15.66
4.7
- -
-0.92
Tangible Book Value per Share
139
38
66
206
206
86
206
223
232
232
232
97
99
101
106
- -
184
Basic Weighted Avg Shares
8,112
6,678
7,561
6,808
6,263
6,323
7,597
7,551
7,969
5,799
3,950
3,930
4,482
3,354
1,670
1,678
1,678
Sales/Revenue/Turnover
-2.29
-23.33
-13.9
-12.44
-6.64
-1.69
2.8
2.49
0.67
0.22
-3.46
-11.82
-9.22
-15.25
-51.23
-44.25
-44.25
Operating Margin (%)
293
361
388
374
288
210
139
114
96
138
163
193
217
232
221
189
189
Depreciation Expense
-158
-1,776
-1,027
-912
-534
41
164
161
52
2
-95
-450
-486
-620
-1,146
-649
-649
Net Income, GAAP
- -
- -
- -
- -
- -
46.01
26.89
19.6
36.2
84
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
-1.95
-26.59
-13.59
-13.4
-8.52
0.65
2.16
2.13
0.65
0.03
-2.42
-11.45
-10.85
-18.48
-68.63
-38.67
-38.67
Profit Margin (%)
2,827
1,162
1,350
580
168
596
1,486
1,610
1,549
1,466
1,563
1,282
1,176
720
-205
-725
-725
Working Capital
481
810
214
71
- -
- -
387
- -
- -
279
779
1,026
937
577
556
427
427
LT Debt
4,505
2,625
3,302
2,412
1,966
2,010
2,327
2,770
2,760
2,655
2,420
1,962
2,078
1,882
814
135
135
Total Equity
- -
- -
- -
- -
- -
-1.6
4.74
4.63
1.02
0.06
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
2.4
6.27
5.66
2.12
0.18
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
-3.68
-54.44
-53.8
-67.24
-57.12
4.04
9.27
6.97
2.14
0.07
-4.29
-23.17
-31.45
-54.97
- -
- -
- -
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Jun'25
Sep'25
Dec'25
ST Debt
1,298
1,249
1,257
LT Borrowings
333
359
300
LT Finance Leases
209
148
127
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
252
45
45
Market Capitalization
4,969
4,385
4,161

Working Capital

FRC

in mil. unless spec.
Jun'25
Sep'25
Dec'25
Total Current Assets
1,774
1,895
1,859
Cash, Cash Equivalents & STI
178
197
125
Accounts Receivable, Net
208
347
552
Inventories
1,257
1,222
1,020
Total Current Liabilities
2,224
2,456
2,584
Payables & Accruals
- -
- -
- -
ST Debt
1,298
1,249
1,257
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-14.08%
-32.51%
-83.35%
Free Cash Flow
49.3%
259.32%
-358.66%
Net Income, GAAP
-518.22%
89.74%
-43.38%
Sales/Revenue/Turnover
-9.54%
-12.27%
0.49%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
1,204
1,038
671
440
3,354
2024
431
501
353
385
1,670
2025
248
321
439
671
1,678

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
-626.75
-1.16
-2.04
- -
-6.17
2024
-1.7
-0.76
-2.59
- -
-10.8
2025
-0.89
-0.41
-3.85
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
Business
Microelectronics Technology Inc. specializes in the design, manufacture, and sale of microwave and satellite communication products, including satellite communication systems such as low noise block downconverters (LNBs), very small aperture terminals (VSATs), and outdoor transceivers for satellite networks. The company also produces telecommunication systems and devices including digital microwave radios, LTE/5G NR remote radio heads for cellular network backhaul, radio frequency identification (RFID) readers and modules, and mobile transceiver base station modules and subsystems. Its products serve applications in direct broadcasting satellite, private networks, telephony, distance education, telemedicine, video conferencing, disaster recovery, transportation, and supply chain tracking. The company operates manufacturing facilities in Taiwan and China with R&D centers in the United States and Denmark, targeting global markets across the United States, Mainland China, Taiwan, and internationally. Founded in 1983 and headquartered in Hsinchu, Taiwan, Microelectronics Technology Inc. is part of the Foxconn Technology Group. Recent major developments include the successful development and production of LEO Ka-Band outdoor transceivers for the Telesat Lightspeed™ satellite network, marking MTI's advancement in next-generation satellite communication technology. The company is also actively engaged in strategic partnerships and government-funded programs, such as collaborations with Rakuten Mobile and EchoStar to advance energy-efficient Open RAN macro radios and 5G ORAN technologies, supported by significant funding from the U.S. National Telecommunications and Information Administration (NTIA) under the NOFO2 wireless innovation initiative. These partnerships aim to position MTI strategically in the evolving 5G wireless network and satellite communications industry, emphasizing innovation in energy efficiency and global connectivity. Additionally, in 2024, MTI expanded its capabilities in wireless communication technologies through a partnership with Mobicom under the NTIA wireless innovation program. Microelectronics Technology Inc. maintains a diversified portfolio in wireless systems, including satellite communications, microwave radios, RFID technologies, and mobile base station equipment, aligned with its core RF and microwave technology competencies. The recent focus on LEO satellite transceivers and Open RAN advancements highlight the company’s strategic shift towards supporting next-generation, energy-efficient connectivity solutions for global telecommunications infrastructure.