1. Taiwan, Province of China Stocks

  2. •

    Technology

  3. •

    Semiconductors
Xintec Inc.

Xintec Inc.

3374.TWO
Xintec Inc.TW flagTaipei Exchange
275.50
TWD
+21.00
- -
74.76BMarket Cap
Xintec Inc.
3374.TWO
(Taipei Exchange)

Recent

price

275.50

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
17.06
16.47
13.29
18.01
20.8
18.65
14.56
15.07
17.41
17.17
26.82
28.25
28.49
23.54
26.02
26.69
26.71
Revenue per Share
2.18
0.57
-0.38
1.22
2.65
0.56
-2.36
-2.71
-4.99
0.67
6.37
6.92
7.31
5.07
6.15
4.99
4.99
Basic EPS, GAAP
3.18
-5
0.99
-1.37
-2.76
1.16
-1.62
-2.63
1.88
2.05
4.96
8.21
8.12
3.75
2.27
-4.04
-4.05
Free Cash Flow per Basic Share
0.1
0.97
0.1
0.1
0.55
1.09
0.5
- -
- -
- -
- -
2.5
3
3
2
2.5
- -
Dividend per Share
14.71
13.96
13.36
15.19
16.48
15.34
12.02
9.33
5.21
10.68
16.95
20.74
24.38
25.72
29.41
31.26
31.29
Book Value per Share
17.25
16.34
15.89
17.11
19.25
22.06
18.7
16.06
11.3
12.06
18.31
22.77
27.12
29.24
33.45
35.9
35.94
Tangible Book Value per Share
232
235
236
236
237
262
269
271
271
271
271
271
271
271
271
271
271
Basic Weighted Avg Shares
3,962
3,867
3,139
4,257
4,934
4,878
3,921
4,078
4,714
4,653
7,278
7,667
7,732
6,387
7,060
7,239
7,239
Sales/Revenue/Turnover
14.47
6.43
-3.07
8.94
13.69
4.81
-18.2
-17.64
-27.67
5.02
24.22
28.8
31.8
26.7
27.98
21.98
21.98
Operating Margin (%)
676
749
766
903
1,316
1,284
1,221
1,051
950
836
838
861
792
667
602
980
980
Depreciation Expense
505
134
-90
289
629
147
-637
-733
-1,352
182
1,727
1,877
1,984
1,376
1,670
1,354
1,354
Net Income, GAAP
10
14.42
- -
17.17
4.74
31.49
- -
- -
- -
- -
- -
14.63
20.68
21.41
18.96
13.51
13.51
Effective Tax Rate (%)
12.75
3.48
-2.87
6.79
12.74
3.01
-16.24
-17.98
-28.68
3.91
23.74
24.48
25.66
21.54
23.65
18.7
18.7
Profit Margin (%)
420
412
606
-97
275
179
809
1,107
1,047
913
1,165
2,481
3,765
3,916
4,756
3,838
3,838
Working Capital
329
1,588
1,359
1,912
2,388
1,049
2,078
2,362
1,988
1,447
426
216
178
173
1,322
2,310
2,310
LT Debt
4,006
3,937
3,836
4,115
4,654
5,852
5,105
4,404
3,098
3,291
5,015
6,216
7,390
7,954
9,091
9,758
9,758
Total Equity
11.56
4.2
- -
5.46
9.43
2.2
- -
- -
- -
4.68
33.51
30.57
26.72
16.33
16.78
11.98
11.98
Return on Invested Capital (%)
13.22
3.2
- -
6.04
10.77
2.73
- -
- -
- -
5.52
36.17
33.67
31.27
19.67
20.25
13.63
13.63
Return on Capital (%)
15.96
4.02
-2.81
8.57
16.76
3.71
-17.57
-25.46
-68.73
8.45
46.09
36.7
32.4
20.24
22.32
16.45
16.45
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Jun'25
Sep'25
Dec'25
ST Debt
40
40
39
LT Borrowings
1,563
2,008
2,210
LT Finance Leases
117
109
100
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
271
271
271
Market Capitalization
39,941
38,887
37,668

Working Capital

FRC

•

in mil. unless spec.
Jun'25
Sep'25
Dec'25
Total Current Assets
6,062
5,933
6,392
Cash, Cash Equivalents & STI
4,675
3,892
4,361
Accounts Receivable, Net
1,018
1,634
1,548
Inventories
193
203
193
Total Current Liabilities
3,512
2,625
2,553
Payables & Accruals
- -
- -
- -
ST Debt
40
40
39
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
7.46%
14.42%
7.33%
Free Cash Flow
-50.92%
-61.39%
-278.16%
Net Income, GAAP
28.76%
-2.78%
-18.94%
Sales/Revenue/Turnover
5.7%
0.38%
2.53%
Total Cash Common Dividend
- -
- -
25%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
1,315
1,408
1,882
1,782
6,387
2024
1,444
1,642
2,166
1,808
7,060
2025
1,545
1,537
2,090
2,066
7,239

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
0.84
0.73
1.89
- -
5.07
2024
1.2
1.2
2.07
- -
6.15
2025
1.26
0.24
1.59
- -
4.99

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
3
2024
- -
- -
- -
- -
2
2025
- -
- -
- -
- -
2.5
Similar Companies
Prosperity Dielectrics Co., Ltd. (6173.TWO)
Hangzhou First Applied Material Co., Ltd. (603806.SS)
Xi'an Peri Power Semiconductor Converting Technology Co.,Ltd. (300831.SZ)
Chunghwa Precision Test Tech. Co., Ltd. (6510.TWO)
BaaS Innovation Co., Ltd. (3555.TWO)
Alphawave IP Group plc (AWEVF)
Business
Xintec Inc. (3374.TWO), founded in 1998 and headquartered in Taoyuan City, Taiwan, operates as a leading provider of advanced wafer-level chip scale packaging (WLCSP) and related semiconductor packaging services in Asia, the United States, and Europe. The company offers wafer-level chip scale packaging for image and environmental sensors; wafer-level post passivation interconnection for fingerprint, actuator sensors, micro-electromechanical systems (MEMS) components, power, analog, and RF devices; optical sensor chip scale packaging including side-wall interconnect, through silicon via redistribution layer (TSV RDL) interconnects, glass bonding with or without cavity, and various filters; frontside illuminated (FSI), backside illuminated (BSI), and stacked wafer reconstruction for mobile, automotive, and consumer applications; MEMS sensor packaging featuring wafer thinning, partial dicing, via-last TSV, dry etching for cavities, 3D I/O redistribution, and dual-side connections; specialty wafer reconstruction with glass lids for automotive uses; 12-inch wafer-level testing services; and customized advanced packaging solutions such as ultra-thin WLP, Cu TSV processes, and system-in-wafer-level CSP (System-in-WLCSP) for AR/VR, medical optical sensors, and heterogeneous integration. Its products serve consumer electronics including tablets, notebooks, and computers; automotive image sensors; industrial and medical applications; and emerging sectors like wearables and 3D sensing components. Recent developments include double-digit revenue growth to NT$7.06 billion in 2024 from image sensor packaging and 12-inch wafer testing, with net income after tax rising 21.4% to NT$1.67 billion; expansion of 12-inch capabilities at the new Zhongyuan Road facility starting contributions in 2025 alongside final product testing services; investments in wafer-level molding systems, Through-Molding Via (TMV), and chip-to-wafer (C2W) bonding for System-in-WLCSP; mass production ramp-up of automotive CIS CSP projects; and acceleration of R&D in sensor-related wafer-level system-in-package (SiP) for future growth, including TSMC representative changes in late 2024.