1. Taiwan, Province of China Stocks

  2. •

    Technology

  3. •

    Semiconductors
Alchip Technologies, Limited

Alchip Technologies, Limited

3661.TW
Alchip Technologies, LimitedTW flagTaiwan Stock Exchange
4,595.00
TWD
+20.00
- -
377.21BMarket Cap
Alchip Technologies, Limited
3661.TW
(Taiwan Stock Exchange)

Recent

price

4,595.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
75.5
49.48
49.58
47.95
83.75
60.71
60.21
70.19
56.53
71.99
115.4
149.37
192.25
416.8
655.81
382.18
382.49
Revenue per Share
7.95
1.23
0.41
2.1
3.77
2.07
-3.45
5.08
4.22
7.2
13.61
21.34
25.69
45.47
81.34
69.18
69.24
Basic EPS, GAAP
-5.01
0.04
1.85
-0.78
0.63
0.39
1.3
10.62
2.53
13.31
47.95
-19.55
-22.55
82.69
9.4
155.92
156.05
Free Cash Flow per Basic Share
- -
1.06
0.15
- -
0.17
0.63
0.48
- -
1.05
1.51
3.49
6.67
11.85
12.73
22.95
36.4
1.06
Dividend per Share
24.72
15.33
15.59
16.44
21.11
19.41
15.67
20.94
22.15
28.3
38.12
45.86
57.53
92.99
145.01
174.86
175.01
Book Value per Share
43.64
27.57
26.16
26.9
46.4
43.03
39.81
43.23
45.45
51.19
61.37
147.68
180.87
240.94
495.05
501.31
501.73
Tangible Book Value per Share
32
54
54
54
56
62
61
61
61
60
61
70
71
73
79
81
81
Basic Weighted Avg Shares
2,425
2,666
2,671
2,584
4,692
3,786
3,691
4,266
3,451
4,332
7,079
10,428
13,725
30,482
51,969
30,926
30,926
Sales/Revenue/Turnover
10.94
3.98
2.22
7.2
7.29
3.72
-5.68
7.5
9.33
10.85
13.97
17.58
17.63
13.58
13.07
17.44
17.44
Operating Margin (%)
195
288
336
345
647
697
608
501
786
929
1,093
1,532
2,058
2,021
2,644
3,061
3,061
Depreciation Expense
255
66
22
113
211
129
-211
309
257
434
835
1,490
1,834
3,325
6,446
5,598
5,598
Net Income, GAAP
6.38
19.62
37.01
25.66
29.49
23.36
- -
14
23.13
17.47
23.11
21.64
23.07
20.9
17.44
16.72
16.72
Effective Tax Rate (%)
10.53
2.49
0.82
4.38
4.5
3.41
-5.73
7.24
7.46
10.01
11.79
14.29
13.37
10.91
12.4
18.1
18.1
Profit Margin (%)
1,034
1,065
1,120
1,095
2,149
1,494
1,535
1,974
2,115
2,293
2,562
8,719
11,633
15,170
35,512
36,082
36,082
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
- -
74
72
50
70
151
132
210
210
LT Debt
1,489
1,554
1,505
1,656
2,779
2,827
2,558
2,714
2,921
3,302
3,888
10,348
13,002
18,034
39,477
40,824
40,824
Total Equity
36.28
5.53
2.44
8.74
10.73
3.48
- -
10.06
8.57
12.01
19.75
19.19
15.38
20.21
18.84
10.89
10.89
Return on Invested Capital (%)
941.22
8.22
2.7
13.12
20.46
9.06
- -
25.75
19.35
27.48
39.14
51.98
48.84
59.1
68.76
42.79
42.79
Return on Capital (%)
- -
8.2
2.62
13.11
20.42
10.77
-19.47
27.65
19.61
28.38
41.32
53.78
50.2
60.97
70.48
43.67
43.67
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Jun'25
Sep'25
Dec'25
ST Debt
61
94
115
LT Borrowings
- -
- -
- -
LT Finance Leases
126
222
210
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
81
81
81
Market Capitalization
249,070
280,158
283,797

Working Capital

FRC

•

in mil. unless spec.
Jun'25
Sep'25
Dec'25
Total Current Assets
43,865
45,135
53,057
Cash, Cash Equivalents & STI
35,697
38,915
38,882
Accounts Receivable, Net
1,952
2,851
3,011
Inventories
1,667
1,646
6,945
Total Current Liabilities
12,959
11,714
16,975
Payables & Accruals
- -
- -
- -
ST Debt
61
94
115
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
38.78%
70.56%
3.41%
Free Cash Flow
245.2%
180.43%
1,594%
Net Income, GAAP
-10.21%
52.71%
-13.15%
Sales/Revenue/Turnover
31.39%
46.2%
-40.49%
Total Cash Common Dividend
- -
73.3%
62.01%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
5,716
7,928
7,610
9,227
30,482
2024
10,490
13,582
14,826
13,071
51,969
2025
10,485
9,144
6,570
4,727
30,926

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
8.09
10.16
12.03
- -
45.47
2024
15.83
20.05
22.46
- -
81.34
2025
18.13
16.37
16.4
- -
69.18

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
12.73
2024
- -
- -
- -
- -
22.95
2025
- -
- -
- -
- -
36.4
Similar Companies
THine Electronics, Inc. (6769.T)
Keystone Microtech Corporation (6683.TWO)
Hua Hong Semiconductor Limited (1347.HK)
LEATEC Fine Ceramics Co., Ltd. (6127.TWO)
Trio-Tech International (TRT)
Shinko Electric Industries Co., Ltd. (6967.T)
Business
Alchip Technologies, Limited (3661.TW) is a fabless semiconductor company that researches, designs, and manufactures high-performance application specific integrated circuits (ASICs) and system-on-chip (SoC) solutions; it provides comprehensive services including non-recurring engineering (NRE) for ASIC/SoC frontend and physical backend design, low power and high performance solutions, design for testability, mass production management for wafer fabrication packaging and testing, chiplet technology platforms, 2.5D heterogeneous packaging, circuit design IP databases, mask production, and back-end services across advanced nodes from 180nm to 3nm and 2nm processes. The company serves markets in AI, high-performance computing (HPC), networking, storage, computing devices, 4K/HD-TVs, mobile phones, digital cameras, entertainment systems, surveillance, medical equipment, supercomputing, crypto-mining, and optical networking; its products support applications in consumer electronics, telecommunications equipment, and data center infrastructure for hyperscalers. Founded in 2003 and headquartered in Taipei, Taiwan, Alchip operates globally with facilities in the United States, Japan, Mainland China (Shanghai, Wuxi, Hefei, Jinan, Guangzhou), and additional sites in Taiwan; it maintains subsidiaries and focuses on segments including Japan, Taiwan, China, and international markets. Recent developments include a strategic partnership with Astera Labs in June 2025 to deliver validated AI rack-scale connectivity solutions integrating COSMOS software with custom ASICs for standards like CXL, Ethernet, NVLink Fusion, PCIe, and UALink; a November 2025 collaboration with d-Matrix on the world's first 3D DRAM solution for AI inference; joining Arm Total Design Ecosystem and TSMC's OIP 3DFabric Alliance with 3nm process support; partnerships with Ayar Labs for co-packaged optics in AI datacenters; introduction of a 2nm design platform and 3DIC test chip tape-out; and early adoption of NVIDIA NVLink Fusion design infrastructure, alongside record 2024 financials and strong 2025 quarterly results.