- Business
- All Ring Tech Co., Ltd. (6187.TWO) designs, manufactures and assembles automation equipment primarily for semiconductor, passive components and LED manufacturing processes; its core products encompass semiconductor dispensing equipment series including wafer level underfill dispensing machines, underfill dispensing machines and general dispensing machines; bonding series comprising FPC, PSA, optical and ACF mounters; AOI machines for microchip insertion, solder balling, six sides inspection, wafer AOI and image measurement; loader/unloader systems, ball mount machines and glue coating/heat sink attach machines; as well as cutting machines, rotary plating, coil winding, resistor stacking, resistor granulating, PC rolling and power inductor dispensers; LED sorting, rotary tower sorting, packaging, rolling and dispensing machines; and CSP cleaving machines. The company, founded in 1996 and headquartered in Kaohsiung Science Park, Taiwan, operates facilities across Asia including a plant in Kunshan, China, and an office in Shenzhen, China, serving customers in Taiwan, China and international markets with customized automation solutions, software development, mechanical engineering and technology testing services. In recent developments, All Ring Tech's board approved the acquisition of a plant in Zhunan, Miaoli, Taiwan, and plans to extend financing to its U.S. subsidiary All Ring Tech USA LLC as of November 2025; the company continues to receive supplier awards from key clients including ASE in April 2025, TSMC and Hua Tai Electronics, alongside significant revenue growth to NT$6.31 billion and net income of NT$1.61 billion in the latest trailing twelve months.