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    Semiconductors
Hycon Technology Corporation

Hycon Technology Corporation

6457.TWO
Hycon Technology CorporationTW flagTaipei Exchange
62.10
TWD
- -
- -
1.98BMarket Cap
Hycon Technology Corporation
6457.TWO
(Taipei Exchange)

Recent

price

62.10

P/E

ratio

- -

div

yld

- -

ROIC.AI

2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
TTM
FRC
- -
17.68
19.57
20.88
20.16
21.55
20.56
22.64
38.6
46.67
26.55
23.2
28.85
Revenue per Share
- -
1.4
1.79
2.47
1.82
1.64
1.56
1.89
6.94
12.71
1.98
-3.2
-1.3
Basic EPS, GAAP
- -
1.53
2.66
2.4
-0.36
1.52
1.44
3.53
6.94
8.49
-3.41
5.85
4.51
Free Cash Flow per Basic Share
- -
- -
1.06
1.48
2.08
2.02
1.96
1.81
1.8
6.25
10.89
1
- -
Dividend per Share
- -
11.39
12.02
13.03
12.2
11.94
11.66
11.91
16.87
23.34
12.04
7.68
9.46
Book Value per Share
- -
13.61
14.75
17.08
16
16.01
15.97
16.02
21.34
36.13
30.98
26.73
25.71
Tangible Book Value per Share
- -
23
24
26
28
28
29
29
30
30
32
32
32
Basic Weighted Avg Shares
- -
410
474
550
566
614
595
663
1,161
1,410
846
739
937
Sales/Revenue/Turnover
- -
7.61
9.56
12.48
10.86
9.97
8.72
10.28
22.56
30.78
6.23
-18.9
-8.45
Operating Margin (%)
- -
7
11
15
17
17
20
32
33
36
45
50
45
Depreciation Expense
- -
32
43
65
51
47
45
55
209
384
63
-102
-42
Net Income, GAAP
- -
23.47
12.54
11.81
12.48
21.24
21.84
15.16
22.37
18.65
17.49
- -
72.42
Effective Tax Rate (%)
- -
7.93
9.17
11.81
9.02
7.6
7.57
8.36
17.98
27.24
7.47
-13.79
-4.5
Profit Margin (%)
252
298
338
433
418
420
422
429
583
902
726
627
587
Working Capital
- -
- -
- -
- -
- -
- -
- -
6
18
4
4
46
24
LT Debt
279
322
370
481
485
488
488
498
668
1,122
1,012
869
849
Total Equity
- -
7.86
11.31
14
10.98
9.76
8.17
11.4
32.23
36.23
3.74
- -
- -
Return on Invested Capital (%)
- -
13.2
15.66
20.48
14.88
13.72
13.49
15.97
46.4
60.78
10.11
- -
-3.72
Return on Capital (%)
- -
13.2
15.66
20.48
14.88
13.66
13.28
16.16
48.76
63.35
11.6
-32.45
-14.45
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Mar'24
Jun'24
Sep'24
ST Debt
31
56
59
LT Borrowings
25
21
18
LT Finance Leases
14
10
7
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
32
32
32
Market Capitalization
1,459
1,980
1,966

Working Capital

FRC

•

in mil. unless spec.
Mar'24
Jun'24
Sep'24
Total Current Assets
738
782
807
Cash, Cash Equivalents & STI
258
313
327
Accounts Receivable, Net
147
184
192
Inventories
321
264
255
Total Current Liabilities
134
189
221
Payables & Accruals
- -
- -
- -
ST Debt
31
56
59
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
12.65%
16.04%
-14.18%
Free Cash Flow
-70.66%
-28.18%
-271.37%
Net Income, GAAP
8.87%
7.77%
-261.35%
Sales/Revenue/Turnover
9.55%
11.08%
-12.62%
Total Cash Common Dividend
- -
47.37%
-90.82%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2022
285
236
173
152
846
2023
141
173
211
214
739
2024
200
262
261
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2022
2.51
0.88
-0.46
- -
1.98
2023
-1.2
-0.93
-0.1
- -
-3.2
2024
-0.56
0.08
0.13
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2022
- -
- -
- -
- -
10.89
2023
- -
- -
- -
- -
1
2024
- -
- -
- -
- -
- -
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Business
Hycon Technology Corporation (TPEx: 6457), a fabless semiconductor design company founded in 2007 and headquartered at No. 172, Section 4, Chengde Road, Taipei City, Taiwan, specializes in analog and mixed-signal integrated circuits (ICs) for measurement, monitoring, and control applications; it operates primarily in Taiwan and China with sales and support teams in Shenzhen. The company develops and sells battery management ICs including single-cell and multi-cell primary/secondary protectors, balance ICs, and gas gauges for lithium batteries used in mobile devices, power banks, drones, laptops, and power tools; mixed-signal microcontroller units (MCUs) such as 8-bit and 32-bit MCUs with high-precision 18- to 24-bit sigma-delta ADCs, analog front-ends (AFEs), data converters, digital multi-function meters (DMMs) with true RMS and AC impedance measurement, sensor signal conditioners (SSCs), low-dropout regulators (LDOs), LCD controllers/drivers, and application-specific standard products (ASSPs) for electronic scales, blood pressure monitors, PIR detectors, and industrial instrumentation; as well as capacitive touch ICs for mutual capacitance touch panels supporting multi-touch functionality. Its products, marketed under the HYCON brand, target consumer electronics, medical devices, and industrial sectors emphasizing high-precision, low-drift analog signal processing for parameters like temperature, pressure, weight, voltage, current, and power. In August 2024, Hycon approved a merger with Silicon Integrated Systems Corp. (SiS) via share exchange, under which SiS issues new shares for 100% of Hycon's shares at a ratio of 0.8713 SiS shares per Hycon share, positioning Hycon as a wholly owned SiS subsidiary pending shareholder approval and regulatory clearance with a provisional record date of January 1, 2025; this strategic combination enhances R&D synergies in body/voice sensing and low-noise conversion technologies, expands production capacity through SiS foundry alliances, integrates customer bases and product portfolios including battery management, mixed-signal MCUs, and touch ICs, and drives new market development and turnkey solutions.