QPL International Holdings Limited

QPL International Holdings Limited

0243.HK
QPL International Holdings LimitedHK flagHong Kong Stock Exchange
0.44
HKD
+0.03
- -
152.46MMarket Cap
QPL International Holdings Limited
0243.HK
(Hong Kong Stock Exchange)

Recent

price

0.44

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
FRC
20.35
22.14
17.46
13.58
16.43
15.91
9.36
1.49
1.68
1.5
1.46
1.96
2.27
1.21
0.91
1.04
Revenue per Share
1.47
-0.82
-0.41
-0.38
0.1
-2.84
-0.36
-0.29
-1.12
-0.24
-0.36
-0.06
0.05
-0.13
-0.21
- -
Basic EPS, GAAP
1.11
-1.36
0.85
-4.95
-11.19
-12.36
-9.5
-2.14
-1.12
-0.16
0.21
-0.09
-0.37
0.1
- -
0.04
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
3.84
-11.37
-11.72
-7.99
-7.99
-10.46
-2.1
-0.64
-1.76
-2.01
-2.37
0.01
0.01
-2.45
-2.37
-2.38
Book Value per Share
6.29
5.4
5
4.86
4.7
1.73
24.43
3.69
2.68
2.49
2.13
2.08
1.91
1.5
1.12
1.12
Tangible Book Value per Share
16
16
16
16
16
16
31
188
188
188
188
188
215
258
289
289
Basic Weighted Avg Shares
325
354
279
217
263
262
287
281
316
283
275
368
488
313
263
301
Sales/Revenue/Turnover
9.92
-2.86
-1.32
28
27.58
20.99
21.15
-2.16
-12.79
-13.05
-13.32
-2.86
-2.3
-5.02
-13.37
1.19
Operating Margin (%)
9
11
13
13
13
13
5
2
7
11
28
19
22
22
13
10
Depreciation Expense
24
-13
-6
-6
2
-47
-11
-55
-211
-45
-68
-12
10
-34
-61
-1
Net Income, GAAP
6.1
- -
- -
- -
38.68
- -
- -
- -
- -
- -
- -
- -
6.7
- -
- -
- -
Effective Tax Rate (%)
7.24
-3.72
-2.32
-2.82
0.63
-17.82
-3.83
-19.65
-66.94
-16.06
-24.82
-3.31
2.07
-10.97
-23.37
-0.35
Profit Margin (%)
53
28
21
17
16
-5
741
667
341
307
266
265
268
256
201
205
Working Capital
- -
- -
- -
- -
- -
- -
1
1
- -
- -
27
28
7
- -
2
2
LT Debt
101
86
80
78
75
28
749
694
503
468
400
392
410
387
324
323
Total Equity
27.14
- -
- -
- -
40.93
- -
- -
- -
- -
- -
- -
- -
-2.03
- -
- -
- -
Return on Invested Capital (%)
28.32
- -
- -
- -
-2.19
- -
- -
- -
- -
- -
- -
- -
9.5
- -
- -
- -
Return on Capital (%)
38.49
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
488.49
- -
- -
- -
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

FRC

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
245.57%
-3.93%
-0.42%
Free Cash Flow
-115.14%
-173.02%
-873.54%
Net Income, GAAP
-14.38%
-144.79%
-98.27%
Sales/Revenue/Turnover
3.58%
5.89%
14.75%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
263
2025
- -
- -
- -
- -
301
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
-0.21
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
Business
QPL International Holdings Limited is a Hong Kong-based multinational company principally engaged in the manufacturing and sale of integrated circuit leadframes, heatsinks, stiffeners, and related semiconductor products. Founded in 1982 with headquarters in Hong Kong, the company operates manufacturing facilities in mainland China and maintains sales offices across the United States and the Asia-Pacific region. Its core product offerings include a range of leadframe products tailored for the semiconductor industry, such as FC (Flip Chip), QFN (Quad Flat No-Lead), DFN (Dual Flat No-Lead), SOIC (Small Outline Integrated Circuit), QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), PDIP (Plastic Dual In-Line Package), PLCC (Plastic Leaded Chip Carrier), and TSOP (Thin Small Outline Package). QPL provides customized solutions including enhanced cooling designs, special order quantities, inventory management services, and rapid operating time reductions to support uninterrupted production lines. The company continuously invests in advanced manufacturing technologies and quality management systems, including laser painting machines, automatic engraving, high-speed electroplating, and laser inspection systems to improve product quality and efficiency. QPL focuses on developing approved technologies such as pre-plated leadframes, nickel-palladium plating products, TBGA reinforcement bars, and radiator products to maintain competitive advantages in the semiconductor supply chain. Within the last two years, QPL International Holdings completed a successful private placement raising HK$8.9 million to finance machinery and production line upgrades aimed at enhancing operational efficiency in its PRC manufacturing facilities. The company reported a 15% revenue increase to HK$301.5 million for the fiscal year ending April 2025, with a significant narrowing of net loss to HK$1.06 million reflecting operational improvements. Additionally, QPL completed a share sale placement issuing 57.7 million shares at HK$0.16 each to strengthen working capital and support its strategic development. These moves are part of QPL’s ongoing efforts to reinforce its market position and expand capabilities in the integrated circuit components sector. QPL operates primarily in the semiconductor manufacturing supply chain industry, targeting electronic device manufacturers requiring high-precision leadframe components. It functions through wholly owned subsidiaries and maintains a broad geographic market presence, primarily in China, the US, and Asia-Pacific. The company’s strategic focus remains on technological upgrades, quality product offerings, and service customization to meet the evolving demands of semiconductor manufacturers worldwide. Overall, QPL International Holdings Limited presents itself as a specialized integrated circuit leadframe supplier deeply embedded in global semiconductor markets, with recent capital raises and production enhancements underscoring its commitment to growth and operational efficiency improvements.