Hua Hong Semiconductor Limited

Hua Hong Semiconductor Limited

1347.HK
Hua Hong Semiconductor LimitedHK flagHong Kong Stock Exchange
192.00
HKD
+25.70
- -
333.62BMarket Cap
Hua Hong Semiconductor Limited
1347.HK
(Hong Kong Stock Exchange)

Recent

price

192.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.57
0.78
0.63
0.7
0.78
0.87
0.73
0.74
1.25
1.9
1.55
1.17
1.38
- -
Revenue per Share
0.06
0.11
0.11
0.12
0.14
0.17
0.13
0.08
0.2
0.35
0.19
0.03
0.03
- -
Basic EPS, GAAP
0.14
0.17
- -
0.04
0.11
0.04
-0.59
-0.63
-1.05
-0.95
-0.18
-1.35
-0.67
- -
Free Cash Flow per Basic Share
- -
- -
- -
0.03
0.04
0.04
0.04
- -
- -
- -
- -
0.02
- -
- -
Dividend per Share
-1.13
0.53
0.54
0.62
0.71
1.18
1.06
1.53
1.53
1.61
3.34
3.07
3.09
3.08
Book Value per Share
0.98
1.67
1.41
1.41
1.61
2.46
2.34
2.52
2.76
3.1
5.35
5.17
5.25
5.14
Tangible Book Value per Share
1,034
853
1,034
1,034
1,034
1,071
1,286
1,293
1,300
1,303
1,478
1,717
1,738
1,721
Basic Weighted Avg Shares
585
665
650
721
808
930
933
961
1,631
2,475
2,286
2,004
2,402
- -
Sales/Revenue/Turnover
8.76
16.21
15.4
17.35
19.32
19.96
12.6
-2.35
15.32
23.98
9.65
-5.91
-3.35
- -
Operating Margin (%)
106
84
78
84
104
119
129
206
318
457
500
556
742
- -
Depreciation Expense
62
93
113
129
145
183
162
99
261
450
280
58
55
- -
Net Income, GAAP
12.66
22.95
10.14
16.06
15.78
16.04
14.64
27.7
22.05
18.04
27.17
- -
- -
- -
Effective Tax Rate (%)
10.58
14.01
17.31
17.86
17.97
19.69
17.4
10.34
16.03
18.17
12.25
2.9
2.28
- -
Profit Margin (%)
280
571
520
477
517
1,445
1,021
741
1,311
1,693
5,597
4,270
4,750
3,934
Working Capital
265
183
138
91
32
26
38
536
1,411
1,496
1,926
1,935
2,803
1,949
LT Debt
1,056
1,465
1,491
1,489
1,695
2,704
3,083
3,354
3,685
4,135
8,015
8,907
9,164
8,874
Total Equity
- -
5.21
5.23
6.38
7.7
6.81
3.39
-0.46
4.18
8.47
1.97
- -
- -
- -
Return on Invested Capital (%)
- -
-253.36
16.37
17.98
18.91
13.7
8.36
5.95
7.75
11.03
7.29
- -
- -
- -
Return on Capital (%)
- -
- -
22.19
21.55
21.2
18.38
12.39
5.96
13.19
22.03
7.97
1.14
1.03
4.97
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Mar'25
Jun'25
ST Debt
- -
347
LT Borrowings
- -
1,934
LT Finance Leases
- -
15
Preferred Equity and Hybrid Capital
- -
- -
Shares Outstanding
- -
1,727
Market Capitalization
6,857
7,605

Working Capital

FRC

in mil. unless spec.
Mar'25
Jun'25
Total Current Assets
- -
5,345
Cash, Cash Equivalents & STI
- -
3,847
Accounts Receivable, Net
- -
213
Inventories
- -
735
Total Current Liabilities
- -
1,411
Payables & Accruals
- -
- -
ST Debt
- -
347
Deferred Revenue
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
22.6%
25.98%
2.89%
Free Cash Flow
-21.6%
140.98%
-49.84%
Net Income, GAAP
11.56%
22.49%
-5.55%
Sales/Revenue/Turnover
16.27%
24.26%
19.86%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2,004
2025
- -
- -
- -
- -
2,402
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.03
2025
- -
- -
- -
- -
0.03
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.02
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
Business
Hua Hong Semiconductor Limited is a leading pure-play semiconductor foundry headquartered in Shanghai, China, specializing in the manufacture and sale of advanced integrated circuit products. The company’s core product portfolio includes embedded non-volatile memory; standalone non-volatile memory such as NOR flash and EEPROM; power discrete devices; analog and power management platforms; specialty logic RF processes; and image sensors. Additionally, Hua Hong offers comprehensive foundry services encompassing design services, including design methodologies and flow support, ASIC design, internet protocol development, multi-project wafer services, mask marking, backend testing, mass production, product engineering, and backside processing services. Its products serve multiple end markets, including consumer electronics, industrial control, automotive electronics, Internet of Things (IoT), communications, computing, and power management applications. Founded in 1997, the company operates globally with sales and production presence in China, North America, Asia, Europe, and Japan. In recent strategic developments, Hua Hong Semiconductor is actively pursuing consolidation and capacity expansion within the semiconductor sector. In 2025, the company announced plans to acquire a controlling stake in Shanghai Huali Microelectronics Corporation, a sister company, aligning with the Chinese government’s industry consolidation initiatives. This acquisition is intended to reduce overlap, enhance production efficiency, and strengthen Hua Hong’s capacity in the 40/55/65-nanometer process nodes. Hua Hong is also advancing its technology roadmap with plans to ramp up production capacity at its new 12-inch wafer fab and to enter the 28-nanometer technology node by 2027, positioning itself for growth in automotive and other high-reliability markets. The company has invested over $1 billion in upgrading facilities and technology, reinforcing its production capabilities. Recent quarterly performance reflects revenue growth with a record $635 million in Q3 2025, supported by strategic efforts to align capacity and demand amid evolving market dynamics. Hua Hong Semiconductor operates primarily in the semiconductor foundry industry segment, focusing on specialty technology manufacturing for advanced nodes. It targets customers across diversified sectors requiring reliable semiconductor components, including automotive manufacturers, industrial electronics firms, consumer product companies, and communication device makers. The firm’s strategic initiatives include capacity expansion via acquisitions and organic growth, coupled with ongoing research and development investments of approximately 15% of revenue to enhance technology innovation and process capabilities amid competitive industry demands. The company remains a key player in China’s semiconductor ecosystem as the nation’s second-largest contract chip manufacturer, emphasizing operational excellence and innovation to capture growing demand in high-tech and automotive electronics sectors. Its recent alliance through acquiring Huali Microelectronics and continued technology upgrades illustrate Hua Hong’s commitment to strengthening market position and adapting to global semiconductor trends while headquartered in Shanghai and serving an international customer base.