SICC Co., Ltd.

SICC Co., Ltd.

2631.HK
SICC Co., Ltd.HK flagHong Kong Stock Exchange
86.15
HKD
+5.25
- -
4.73BMarket Cap
SICC Co., Ltd.
2631.HK
(Hong Kong Stock Exchange)

Recent

price

86.15

P/E

ratio

- -

div

yld

- -

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
- -
- -
1.1
1.26
0.97
3.01
4.15
3.31
3.87
Revenue per Share
- -
- -
-1.66
0.23
-0.41
-0.11
0.42
-0.47
0.21
Basic EPS, GAAP
- -
- -
-1.28
-0.58
-2.55
-3.33
-1.18
-0.39
-0.94
Free Cash Flow per Basic Share
- -
- -
0.06
- -
- -
- -
0.02
0.06
0.04
Dividend per Share
- -
- -
0.59
0.79
0.42
0.32
0.72
0.35
0.75
Book Value per Share
- -
- -
4.85
5.03
11.66
11.92
11.82
15.58
11.88
Tangible Book Value per Share
- -
- -
387
391
428
416
426
443
426
Basic Weighted Avg Shares
136
269
425
494
417
1,251
1,768
1,465
1,650
Sales/Revenue/Turnover
5.55
-56.92
-142.18
16.99
-53.91
-5.29
9.97
-5.3
5.18
Operating Margin (%)
52
80
107
132
146
223
349
364
- -
Depreciation Expense
-42
-201
-642
90
-176
-46
179
-208
88
Net Income, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
-30.95
-74.73
-151.03
18.21
-42.13
-3.66
10.13
-14.22
5.34
Profit Margin (%)
-663
-175
870
866
3,001
1,500
1,582
3,753
1,951
Working Capital
315
239
- -
1
3
15
86
357
315
LT Debt
-19
499
2,133
2,222
5,250
5,227
5,313
7,175
5,330
Total Equity
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
33.32
-71.91
-29.5
81.58
-90.56
31.91
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
614
660
629
LT Borrowings
86
265
315
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
430
430
430
Market Capitalization
- -
- -
- -

Working Capital

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
3,125
3,350
3,506
Cash, Cash Equivalents & STI
1,239
1,475
1,631
Accounts Receivable, Net
520
530
519
Inventories
1,022
1,033
1,051
Total Current Liabilities
1,543
1,553
1,555
Payables & Accruals
- -
- -
- -
ST Debt
614
660
629
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
35.34%
35.05%
Free Cash Flow
- -
45.39%
-65.6%
Net Income, GAAP
- -
-238.25%
-216.36%
Sales/Revenue/Turnover
- -
44.96%
-17.15%
Total Cash Common Dividend
- -
- -
276.24%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
426
486
369
487
1,768
2025
408
386
353
- -
1,465
2026
366
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.11
- -
- -
- -
0.42
2025
0.02
- -
- -
- -
-0.47
2026
-0.13
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.02
2025
0.01
- -
- -
- -
0.06
2026
0.01
- -
- -
- -
- -
Business
SICC Co., Ltd. engages in the research, development, manufacturing, and sale of silicon carbide semiconductor materials and substrates, with a focus on conductive and semi-insulating silicon carbide substrates for high-performance electronic applications. The company operates in China and internationally, exporting its products to global markets, including for use in microwave and power electronics, 5G communications, electric vehicles, renewable energy, data centers, and related infrastructure. SICC is headquartered in Jinan, Shandong Province, China, and was incorporated in 2010. The company’s product portfolio centers on silicon carbide substrates and related substrate materials, serving diversified industries such as automotive, telecommunications, energy, defense, and consumer electronics; it emphasizes industrialization of silicon carbide substrates for renewable energy and AI data center applications, and markets its materials under branded and non-branded categories to support customers’ device fabrication and power-electronics needs. Recent major developments include ongoing partnerships and strategic alliances within the silicon carbide ecosystem, expansions of production capacity and geographic reach, and continued product launches related to advanced substrate materials and related processing services aimed at strengthening its position in 5G, high-efficiency power electronics, and AI-driven applications. The company maintains a global footprint through overseas sales channels and collaborations with international distributors and customers, reinforcing its role as a supplier of wide-bandgap semiconductor materials to a broad set of industries and regions.