Gigadevice

Gigadevice

3986.HK
GigadeviceHK flagHong Kong Stock Exchange
653.50
HKD
-33.50
- -
596.00BMarket Cap
Gigadevice
3986.HK
(Hong Kong Stock Exchange)

Recent

price

653.50

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.95
2.07
1.92
2.3
2.88
3.26
3.7
4.07
5.43
6.94
12.89
12.28
8.58
11.08
13.85
13.19
Revenue per Share
0.05
0.16
0.16
0.24
0.38
0.39
0.72
0.73
1.03
1.36
3.54
3.1
0.24
1.66
2.48
3.55
Basic EPS, GAAP
-0.09
-0.04
0.17
0.19
0.43
0.01
-0.06
0.58
1.17
1.08
2.48
0.6
1.25
2.31
1.63
-1.28
Free Cash Flow per Basic Share
0.01
- -
- -
0.02
0.04
- -
0.1
0.17
0.15
0.2
0.41
1.08
0.63
0.02
0.37
0.31
Dividend per Share
0.18
0.24
0.39
0.58
0.89
1.21
1.77
2.43
3.14
4.6
7.81
9.82
9.35
11.23
13.66
15.85
Book Value per Share
0.51
0.66
0.81
1.02
1.38
2.78
3.14
3.36
6.21
14.17
18.29
21.13
21.42
23.46
27.03
36.25
Tangible Book Value per Share
338
404
411
411
412
457
549
551
590
648
660
662
671
664
665
667
Basic Weighted Avg Shares
322
835
789
947
1,189
1,489
2,030
2,246
3,203
4,497
8,510
8,130
5,761
7,356
9,203
8,801
Sales/Revenue/Turnover
7.52
9.89
9.74
9.56
13.19
10.16
22.97
20.65
20.52
18.98
29.87
27.73
7.02
11.32
16.85
29.34
Operating Margin (%)
- -
- -
15
17
20
25
31
50
93
167
240
321
400
418
431
- -
Depreciation Expense
18
63
67
98
158
176
397
405
607
881
2,337
2,053
161
1,103
1,648
2,367
Net Income, GAAP
26.72
18.3
10.25
13.01
13.94
5.96
11.48
7.36
5.97
6.25
7.39
9.26
- -
2.03
1.7
6.66
Effective Tax Rate (%)
5.55
7.58
8.54
10.36
13.27
11.85
19.58
18.03
18.95
19.58
27.46
25.25
2.8
14.99
17.91
26.89
Profit Margin (%)
145
241
315
393
552
1,119
877
1,147
2,191
7,942
9,426
10,218
10,617
10,104
11,478
17,376
Working Capital
- -
- -
- -
- -
- -
- -
184
213
82
53
108
90
74
48
43
41
LT Debt
173
267
331
420
571
1,279
1,757
1,900
5,226
10,694
13,483
15,187
15,200
16,679
19,223
25,515
Total Equity
- -
28.31
22.28
20.62
26.69
15.22
25.05
20.36
16.38
9.93
19.21
14.08
- -
4.94
8.16
10.97
Return on Invested Capital (%)
- -
76.3
52.16
49
46.86
33.65
45.41
29.25
34.41
35.47
56.14
34.54
- -
14.94
18
23.58
Return on Capital (%)
- -
80.21
52.16
49.08
51.85
38.3
52.19
35.06
37.99
36.42
57.42
35.2
2.52
16.05
19.93
25.85
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
- -
255
55
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
43
41
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
- -
668
701
Market Capitalization
- -
- -
201,385

Working Capital

FRC

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
- -
13,425
19,382
Cash, Cash Equivalents & STI
- -
9,288
15,108
Accounts Receivable, Net
- -
193
287
Inventories
- -
3,066
3,401
Total Current Liabilities
- -
1,947
2,006
Payables & Accruals
- -
- -
- -
ST Debt
- -
255
55
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
51.32%
12.76%
15.25%
Free Cash Flow
-156.93%
44.54%
-29.56%
Net Income, GAAP
92.87%
138.94%
49.47%
Sales/Revenue/Turnover
26.37%
21.69%
25.12%
Total Cash Common Dividend
- -
327.27%
1,496.08%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,627
1,982
2,041
1,706
7,356
2025
1,909
2,241
- -
2,372
9,203
2026
4,188
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.31
- -
- -
- -
1.66
2025
0.35
- -
- -
- -
2.48
2026
2.19
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.02
2025
0.01
- -
- -
- -
0.37
2026
- -
- -
- -
- -
- -
Business
GigaDevice Semiconductor Inc. operates as a global fabless semiconductor company focusing on memory and microcontroller solutions, with a diversified portfolio spanning Flash memory, 32-bit MCUs, sensor chips, analog components, and power management solutions; it serves industrial, automotive, computing, consumer electronics, IoT, mobile, networking, and communications markets from its headquarters in Shenzhen, China, and expanded operations including dual listing on the Shanghai and Hong Kong stock exchanges (3986.HK) announced in 2026. Main Products and Services - Flash memory: NOR Flash, NAND Flash products including high-speed, low-power memory designed for embedded, automotive, industrial, and consumer applications; process variants cover a wide range of densities and speeds. - Microcontrollers: 32-bit MCUs (notably GD32-series) for general purpose computing, industrial control, consumer electronics, and IoT edge devices; emphasis on performance-per-watt and integrated peripherals. - Sensors and analog ICs: smart human-machine interaction sensors, capacitive/ergonomic sensors, and analog front-end components that support automotive, industrial, and consumer applications. - Power management and related ICs: power solutions and ICs that optimize efficiency in embedded systems, automotive electronics, and IoT devices. - System solutions and ecosystem support: development boards, reference designs, software libraries, and design-in support to accelerate customer time-to-market. Latest Major Company Changes - Dual listing and capital market expansion: completes a dual listing strategy with an official listing on the Hong Kong Stock Exchange (ticker 3986.HK), reinforcing access to international capital and expanded global investor base in January 2026. - Global market expansion: increases emphasis on overseas markets, particularly Europe and the Americas, to support embedded solutions in industrial, automotive, and robotics segments; enhances channel partnerships and localized customer support. - Product and technology roadmap updates: advances in customized memory solutions targeting automotive cockpits, AI-enabled edge devices, and industrial applications, with mass production plans aligned to 2026 milestones. - Corporate positioning and branding: reinforces a fabless design model with enhanced global brand visibility through international events and partnerships, strengthening collaborations with distributors and system integrators. Additional Context - Industry and segments: semiconductor design, primarily memory (NOR/NAND Flash), MCUs, sensors, analog, and power management; targeted at industrial, automotive, IoT, computing, and telecommunications. - Target markets: automotive electronics, industrial automation, consumer electronics, IoT endpoints, edge AI devices, networking and communications equipment. - Geographic operations: headquarters in China; global operations with offices and distributors worldwide, including Europe, Asia-Pacific, and the Americas; listed in Hong Kong and Shanghai. - Founding year and headquarters: founded in 2005; headquarters historically associated with Shenzhen, China. - Subsidiaries and parent relationships: operates as a standalone fabless company with global sales and support network; maintains strategic partnerships with contract manufacturers and distributors to deliver memory and MCU solutions.