PRONI Inc.

PRONI Inc.

479A.T
PRONI Inc.JP flagTokyo Stock Exchange
1,734.00
JPY
+297.00
- -
7.80BMarket Cap
PRONI Inc.
479A.T
(Tokyo Stock Exchange)

Recent

price

1,734.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2023
2024
2025
FRC
407.49
531.83
737.83
Revenue per Share
-176.53
-65.45
121.75
Basic EPS, GAAP
-169.4
-83.33
109.75
Free Cash Flow per Basic Share
- -
- -
- -
Dividend per Share
210.6
151.33
372.34
Book Value per Share
210.6
151.33
348.92
Tangible Book Value per Share
4
4
4
Basic Weighted Avg Shares
1,684
2,198
3,234
Sales/Revenue/Turnover
-42.49
-17.48
11.43
Operating Margin (%)
7
7
16
Depreciation Expense
-730
-270
534
Net Income, GAAP
- -
- -
- -
Effective Tax Rate (%)
-43.32
-12.31
16.5
Profit Margin (%)
1,524
1,035
1,933
Working Capital
707
581
787
LT Debt
923
663
1,632
Total Equity
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
Return on Capital (%)
- -
-34.1
46.5
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

FRC

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
146.05%
Free Cash Flow
- -
- -
-239.67%
Net Income, GAAP
- -
- -
-297.28%
Sales/Revenue/Turnover
- -
- -
47.13%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2,198
2025
- -
- -
- -
- -
3,234
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
-65.45
2025
- -
- -
- -
- -
121.75
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
Business
PRONI Inc. is a Tokyo-based technology company that specializes in semiconductor materials and electronic components for the display, data storage, and sensing industries. It operates as a diversified manufacturer and supplier of advanced materials and components used in consumer electronics, industrial equipment, and automotive applications. Main products and services: raw and advanced materials for display and imaging applications; high-precision electronic components such as sensors, thin-film transistors, and interconnect materials; package and integration services for electronic modules; engineering and testing services to support product development, reliability, and performance optimization; specialty chemicals and coatings for wafer processing and device fabrication; tacitly, legacy cleanroom and process-compatible consumables; technical support and design-in services for customers across multiple industry segments. Latest major company changes: forms strategic partnerships with key global technology and electronics manufacturers to co-develop next-generation materials and components; completes refinanced debt and secures new credit facilities to support capacity expansion; launches new product lines in advanced display materials and sensor substrates; expands manufacturing footprint in Asia to support regional demand growth; undergoes organizational realignment to focus on core materials business and higher-value services; announces potential strategic review of non-core assets to optimize portfolio. Additional context: operating in the materials science and electronics supply chain with industry segments including display technologies, sensors, and semiconductor processing; targets original equipment manufacturers, contract manufacturers, and tier-one electronics suppliers; geographic operations across Japan, Asia-Pacific, and select global markets; founded in the late 20th century with headquarters in Tokyo; maintains subsidiaries and potential parent company relationships to coordinate global supply and R&D efforts.