1. Taiwan, Province of China Stocks

  2. •

    Technology

  3. •

    Semiconductors
Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries, Ltd.

6271.TW
Tong Hsing Electronic Industries, Ltd.TW flagTaiwan Stock Exchange
250.00
TWD
+0.50
- -
52.26BMarket Cap
Tong Hsing Electronic Industries, Ltd.
6271.TW
(Taiwan Stock Exchange)

Recent

price

250.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
51.9
46.99
48.7
55.06
57.9
53.97
55.96
53.19
50.72
38.41
47.28
59.73
63.11
55.41
57.84
- -
57.24
Revenue per Share
6.68
7.23
9.15
11
10.49
7.23
7.12
6.69
6.93
3.84
6.74
11.91
14.09
5.5
8.2
- -
7.49
Basic EPS, GAAP
0.82
-2.35
2.68
12.36
6.6
0.69
9.33
16.8
5.96
-1.41
3.55
9.51
5.16
-1.74
-3.59
- -
-4.5
Free Cash Flow per Basic Share
3.18
4.26
4.48
5.66
7.92
6.79
6.79
6.71
6.79
5.13
2.69
4.24
7.21
5.98
2.4
- -
- -
Dividend per Share
20.53
21.11
24.27
32.99
29.47
29.29
28.79
28.03
27.95
19.81
21.89
27.21
33.32
33.61
39.02
- -
38.43
Book Value per Share
45.71
59.03
60.19
65.39
69.04
69.92
70.08
71.13
71.04
52.25
58.51
62.41
72.11
77.33
84.41
- -
84.14
Tangible Book Value per Share
118
133
143
144
144
144
144
146
146
193
215
232
223
209
209
- -
208
Basic Weighted Avg Shares
6,127
6,258
6,985
7,929
8,338
7,772
8,058
7,746
7,414
7,431
10,178
13,860
14,072
11,585
12,091
11,543
11,927
Sales/Revenue/Turnover
17.87
17.84
21.03
22.38
20.57
15.59
15.31
15
15.54
12.1
19.55
24.8
25.41
12.25
14.4
13.91
14.04
Operating Margin (%)
352
476
692
886
1,021
1,098
1,127
1,012
880
750
1,036
1,590
1,451
1,417
1,737
1,375
1,615
Depreciation Expense
789
963
1,313
1,583
1,511
1,041
1,025
974
1,014
742
1,451
2,765
3,141
1,151
1,714
1,597
1,561
Net Income, GAAP
16.7
16.63
11.38
15.05
16.07
18.83
16.2
11.45
18.6
21.26
21.53
18.25
19.24
17.53
10.61
12.25
5.9
Effective Tax Rate (%)
12.87
15.39
18.8
19.97
18.12
13.4
12.72
12.57
13.67
9.99
14.25
19.95
22.32
9.93
14.17
13.84
13.09
Profit Margin (%)
2,569
4,184
4,135
4,918
8,681
7,853
5,941
6,080
6,334
4,730
4,161
4,797
7,959
5,653
6,300
7,030
7,268
Working Capital
65
65
65
194
3,443
2,888
628
65
- -
119
96
148
5,301
5,349
3,568
3,184
3,736
LT Debt
5,509
7,962
8,731
9,518
10,027
10,137
10,147
10,414
10,449
10,177
21,210
22,983
24,524
24,441
25,833
26,735
25,688
Total Equity
18.54
13.03
14.94
15.4
11.73
7.02
7.46
8.16
8.45
6.67
9.57
12.23
10.65
3.87
5.08
4.51
5.12
Return on Invested Capital (%)
33.03
33.34
38.64
34.44
22.71
13.59
13.84
15.89
21.88
18.02
31.62
47.06
32.76
9.82
14.01
12.7
12.96
Return on Capital (%)
36.58
36.79
41.73
38.47
33.59
24.61
24.51
23.68
24.82
18.74
33.95
50.15
45.71
15.92
22.57
18.66
20.51
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
1,623
1,620
1,461
LT Borrowings
3,432
4,623
3,591
LT Finance Leases
136
132
146
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
209
209
209
Market Capitalization
29,059
23,101
22,296

Working Capital

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
11,188
12,895
12,376
Cash, Cash Equivalents & STI
7,038
8,751
8,674
Accounts Receivable, Net
2,095
2,169
2,029
Inventories
1,733
1,730
1,503
Total Current Liabilities
4,888
5,510
5,108
Payables & Accruals
- -
- -
- -
ST Debt
1,623
1,620
1,461
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
13.28%
4.78%
3.49%
Free Cash Flow
46.29%
-57.62%
-402.82%
Net Income, GAAP
14.92%
16.6%
-6.8%
Sales/Revenue/Turnover
5.26%
3.98%
-4.53%
Total Cash Common Dividend
- -
15.26%
25%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
2,900
2,844
2,667
3,174
11,585
2024
2,971
3,069
3,068
2,984
12,091
2025
2,909
2,967
2,818
- -
11,543

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
1.78
0.06
1.34
- -
5.5
2024
1.74
2.11
2.53
- -
8.2
2025
2.79
0.34
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
5.98
2024
- -
- -
- -
- -
2.4
2025
- -
- -
- -
- -
- -
Similar Companies
FIZIKA Scientific and Production Association Open Joint-Stock Company (NPOF.ME)
ETREND Hightech Corp. (3567.TWO)
SÜSS MicroTec SE (0Q3C.L)
Hycon Technology Corporation (6457.TWO)
indie Semiconductor, Inc. (INDI)
Silex Systems Limited (SILXY)
Business
Tong Hsing Electronic Industries, Ltd. (6271.TW) manufactures thick film substrates and customized semiconductor micro-module packaging products for applications in wireless communications, MEMS, image sensors, optoelectronic semiconductor components, LEDs, solar cells, automotive electronics, computer peripherals, medical electronics, and networking equipment. The company offers direct plated copper substrates utilizing sputtering and photolithography for high-density circuits; active metal brazing; thick film printed circuit substrates; power semiconductors; CMOS imaging products including wafer probing testing, reconstruction, packaging, and image testing; high-frequency wireless communication modules; hybrid integrated circuit modules; biomedical products; and packaging services such as wafer probing, backgrinding, reconstruction, assembly, automated inspection, and finished module testing. Founded in 1974 and headquartered in Yingge, New Taipei City, Taiwan, Tong Hsing operates a subsidiary in the Philippines established in 1994 and listed on the Taiwan Stock Exchange in 2007, with products distributed to the Americas, Europe, and other markets. In recent developments, the company completed a merger with Kingpak Technology Inc. in 2019, held a beam erection ceremony for its new Bade Plant in Taoyuan City in August 2021 to expand production capacity, elected new board members and appointed a new general manager at its June 2022 annual general meeting, and in November 2024 supported LED lighting installations in rural schools across New Taipei, Taoyuan, and Hsinchu as part of its ongoing charitable initiatives.