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STMicroelectronics N.V.

STMicroelectronics N.V.

STMMI.MI
STMicroelectronics N.V.IT flagItalian Stock Exchange
67.76
EUR
+2.93
- -
60.22BMarket Cap
STMicroelectronics N.V.
STMMI.MI
(Italian Stock Exchange)

Recent

price

67.76

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
11.72
11.08
9.61
9.05
8.35
7.87
7.91
9.43
10.75
10.65
11.42
14.1
17.81
19.13
14.74
13.51
13.4
Revenue per Share
0.94
0.74
-1.31
-0.56
0.14
0.12
0.19
0.91
1.43
1.15
1.24
2.21
4.37
4.66
1.73
0.19
0.25
Basic EPS, GAAP
0.7
-0.57
0.07
-0.29
0.17
0.32
0.44
0.34
0.59
0.69
0.82
1.24
1.73
1.61
-0.24
-0.06
-0.06
Free Cash Flow per Basic Share
0.24
0.37
0.4
0.39
0.4
0.4
0.28
0.24
0.24
0.24
0.19
0.23
0.23
0.25
0.32
0.37
0.35
Dividend per Share
4.98
5.31
3.52
2.5
2.23
1.92
1.8
2.41
3.5
4.35
5.32
7.05
10.9
15.08
16.24
16.3
15.46
Book Value per Share
7.6
7.16
6.8
6.06
5.39
5.08
4.86
5.8
6.77
7.41
8.64
9.42
13.31
17.91
18.94
20.13
18.1
Tangible Book Value per Share
883
878
884
893
887
877
881
885
899
897
895
905
906
904
900
874
924
Basic Weighted Avg Shares
10,346
9,735
8,493
8,082
7,404
6,897
6,973
8,347
9,664
9,556
10,219
12,761
16,128
17,286
13,269
11,800
12,378
Sales/Revenue/Turnover
5.72
1.38
-8.23
-2.72
3.7
2.23
4.52
12.65
14.69
12.94
13.34
17.87
26.54
26.36
11.26
2.74
3.17
Operating Margin (%)
1,240
1,279
1,107
910
811
736
696
650
791
854
923
1,045
1,216
1,561
1,760
1,854
1,880
Depreciation Expense
830
650
-1,158
-500
128
104
165
802
1,287
1,032
1,106
2,000
3,960
4,211
1,557
166
234
Net Income, GAAP
21.56
53.87
- -
- -
- -
- -
15.42
15.01
6.91
13.12
12.55
14.16
11.59
11.36
16.67
55
47.6
Effective Tax Rate (%)
8.02
6.68
-13.63
-6.19
1.73
1.51
2.37
9.61
13.32
10.8
10.82
15.67
24.55
24.36
11.73
1.41
1.89
Profit Margin (%)
3,478
3,011
2,947
2,814
3,285
3,120
2,799
3,079
3,734
4,193
4,557
4,879
5,968
8,077
7,961
7,920
7,559
Working Capital
1,050
826
671
928
1,599
1,421
1,334
1,583
1,764
2,051
1,968
2,544
2,683
2,898
2,123
2,004
2,411
LT Debt
8,497
7,996
6,364
5,717
5,055
4,693
4,596
5,467
6,424
7,111
8,506
9,273
12,758
16,852
17,679
18,225
18,171
Total Equity
4.36
0.62
- -
- -
- -
- -
4.25
13.39
16.83
12
11.39
16.61
27.09
22.45
6.05
0.7
0.97
Return on Invested Capital (%)
15.61
17.03
- -
- -
- -
- -
6.01
23.97
29.53
18.95
16.59
24.14
36
28.55
9.27
1.01
1.42
Return on Capital (%)
20.06
14.35
-29.79
-18.7
6.09
5.69
10.09
43.14
48.77
29.27
25.54
35.92
48.74
35.84
11.03
1.15
1.62
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
311
350
372
LT Borrowings
1,910
1,835
2,250
LT Finance Leases
155
169
161
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
892
889
889
Market Capitalization
24,955
24,454
30,516

Working Capital

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
10,831
11,271
10,827
Cash, Cash Equivalents & STI
4,776
4,922
4,571
Accounts Receivable, Net
1,620
1,745
1,820
Inventories
3,167
3,136
3,173
Total Current Liabilities
3,361
3,351
3,268
Payables & Accruals
2,094
2,024
1,883
ST Debt
311
350
372
Deferred Revenue
83
83
52

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
15.14%
17.34%
3.09%
Free Cash Flow
2.1%
-21.11%
-75.93%
Net Income, GAAP
52.53%
6.56%
-89.34%
Sales/Revenue/Turnover
6.65%
4.83%
-11.07%
Total Cash Common Dividend
0.67%
14.25%
11.46%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3,465
3,232
3,251
3,322
13,269
2025
2,517
2,766
3,187
3,330
11,800
2026
3,095
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.57
0.39
0.39
0.38
1.73
2025
0.06
-0.01
- -
-0.03
0.19
2026
0.04
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.05
0.08
0.09
0.1
0.32
2025
0.08
0.09
- -
0.09
0.37
2026
0.08
- -
- -
- -
- -
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Business
STMicroelectronics N.V. (STM) designs, develops, manufactures and markets a broad range of semiconductor integrated circuits and discrete devices worldwide, serving the automotive, industrial, personal electronics, communications and cloud-connected applications sectors; its core offerings encompass microcontrollers such as the STM8 and STM32 families, MEMS and sensors including accelerometers, pressure sensors and motion detectors, analog and smart power products like power discretes, drivers and converters, application processors, digital consumer ICs, secure elements, connectivity solutions for Internet of Things, electrically erasable programmable read-only memories, application-specific integrated circuits for analog, digital and mixed-signal applications, as well as products for power management, signal conditioning, protection and energy efficiency in industrial automation, electric vehicles, wearables, smart home devices and data centers. The company operates through three main segments: Automotive and Discrete Group, which provides dedicated automotive ICs, power transistors and discretes; Analog, MEMS and Sensors Group, offering low-power analog ICs, touch screen controllers, power conversion and IoT connectivity; and Microcontrollers and Digital ICs Group, focusing on general purpose and secure microcontrollers. Founded in 1987 through the merger of Italian SGS Microelettronica and French Thomson Semiconducteurs, STM maintains its headquarters in Geneva, Switzerland, with the holding company incorporated in the Netherlands; it conducts manufacturing, design and R&D across Europe, North America, Asia Pacific including facilities in China, India and Singapore, and serves customers globally through sales in Europe, the Middle East, Africa, the Americas and Asia. In July 2025, STM agreed to acquire NXP Semiconductors' MEMS sensor business for up to $950 million in cash, adding complementary automotive safety, monitoring, pressure and accelerometer technologies along with skilled R&D teams to bolster its sensors portfolio across automotive, industrial and consumer markets, with the transaction expected to close in the first half of 2026. Earlier in 2025, the company launched the PIC100 data center photonics chip in collaboration with Amazon Web Services to support high-speed 800Gbps and 1.6Tbps optical interconnects for AI workloads, introduced the industry's first 18nm microcontroller for high-performance applications and the largest MCU model zoo with AI models to accelerate physical AI deployment, and initiated a multi-year program announced in late 2024 to reshape its global manufacturing footprint by doubling capacity to 4,000 wafers per week by 2027 through investments in 300mm silicon and 200mm silicon carbide fabs, AI-driven automation and efficiency upgrades at legacy sites while prioritizing sustainability and competitiveness as an integrated device manufacturer.