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Shenzhen Techwinsemi Technology Co., Ltd.

Shenzhen Techwinsemi Technology Co., Ltd.

001309.SZ
Shenzhen Techwinsemi Technology Co., Ltd.CN flagShenzhen Stock Exchange
935.00
CNY
+53.09
- -
212.10BMarket Cap
Shenzhen Techwinsemi Technology Co., Ltd.
001309.SZ
(Shenzhen Stock Exchange)

Recent

price

935.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
1.39
4.93
4.21
5.48
7.08
6.69
8.63
23.14
48.28
30.09
Revenue per Share
0.05
0.2
0.24
0.51
0.64
0.38
0.12
1.7
3.08
-0.7
Basic EPS, GAAP
-0.14
-0.1
-0.97
-0.61
-0.31
-2.54
-5.43
-6.73
-12.24
-0.67
Free Cash Flow per Basic Share
- -
0.01
0.01
0.06
0.12
0.07
0.22
0.52
0.82
0.53
Dividend per Share
0.16
0.38
0.62
1.03
1.61
1.84
1.8
3.54
6.09
2.53
Book Value per Share
0.18
0.66
2.25
2.94
3.63
6.1
5.43
11.93
14.5
10.42
Tangible Book Value per Share
159
152
153
152
153
178
206
206
223
223
Basic Weighted Avg Shares
220
750
646
835
1,080
1,191
1,776
4,773
10,789
6,705
Sales/Revenue/Turnover
5.49
7.57
8.38
12.95
12.8
8.13
6.46
11.1
9.51
0.56
Operating Margin (%)
- -
1
1
2
13
22
39
47
67
- -
Depreciation Expense
7
30
37
77
98
67
25
351
688
-155
Net Income, GAAP
13.53
10.43
22.63
16.43
10.81
- -
- -
7.38
3.8
- -
Effective Tax Rate (%)
3.39
4.06
5.69
9.24
9.09
5.67
1.41
7.35
6.38
-2.31
Profit Margin (%)
24
90
331
400
449
931
949
2,936
3,447
2,914
Working Capital
- -
2
2
38
28
134
187
882
1,069
1,123
LT Debt
29
100
345
448
554
1,093
1,123
2,482
3,269
2,344
Total Equity
- -
60.65
16.56
17.05
15.8
- -
- -
11.84
13.62
- -
Return on Invested Capital (%)
- -
59.46
47.44
34.38
24.2
- -
- -
15.27
15.41
- -
Return on Capital (%)
- -
72.73
48.16
61.19
48.71
23.56
7.17
63.67
65.84
-23.1
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
2,027
2,312
2,511
LT Borrowings
786
1,265
1,034
LT Finance Leases
96
92
90
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
226
226
226
Market Capitalization
12,818
20,720
18,839

Working Capital

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
6,069
6,572
6,592
Cash, Cash Equivalents & STI
916
1,116
867
Accounts Receivable, Net
397
575
587
Inventories
4,436
4,395
4,643
Total Current Liabilities
3,132
3,220
3,678
Payables & Accruals
- -
- -
- -
ST Debt
2,027
2,312
2,511
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
55.28%
31.74%
Free Cash Flow
- -
218.33%
97.15%
Net Income, GAAP
- -
266.35%
96.35%
Sales/Revenue/Turnover
- -
76.72%
126.07%
Total Cash Common Dividend
- -
103.73%
72.31%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
811
1,365
1,421
1,176
4,773
2025
1,252
2,857
4,130
- -
10,789
2026
7,538
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.95
- -
- -
- -
1.7
2025
-0.31
- -
- -
- -
3.08
2026
14.88
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.07
- -
- -
- -
0.52
2025
0.12
- -
- -
- -
0.82
2026
0.62
- -
- -
- -
- -
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Business
Shenzhen Techwinsemi Technology Co., Ltd. (001309.SZ) develops, manufactures and sells storage control chips and modules, including solid-state drives, embedded storage products such as eMMC, DDR modules, portable storage solutions, flash memory main control chips, fixed hard disks, memory card and storage disk modules, and related application solutions; the company provides storage products for mobile terminals, Internet of Things devices, personal computers, data centers, security monitoring, in-car electronics, industrial control, automotive electronics, new energy vehicles, mobile devices and security systems, marketed under the CUSU brand primarily in China and internationally. Founded in 2008 and headquartered in Shenzhen, Guangdong Province, China, at Building 1, Block A, Shenzhen New Generation Industrial Park, the company operates as a national high-tech enterprise and specialized "Little Giant" with approximately 884 employees, recognized for its R&D in integrated circuit design and industrial applications across consumer, enterprise and embedded storage segments. Recent developments include listing on the Shenzhen Stock Exchange main board, establishment of embedded storage and enterprise storage series, launch of the consumer-grade CUSU brand, creation of new intelligent manufacturing base, Beijing and Hangzhou R&D bases, and release of China's first 4K LDPC-supported SD6.0 controller, positioning it for growth in AI-driven storage demand.