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Inari Amertron Berhad

Inari Amertron Berhad

0166.KL
Inari Amertron BerhadMY flagMalaysian Stock Exchange
2.19
MYR
- -
- -
8.38BMarket Cap
Inari Amertron Berhad
0166.KL
(Malaysian Stock Exchange)

Recent

price

2.19

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.16
- -
0.14
0.16
0.42
0.37
0.36
0.39
0.45
0.36
0.33
0.43
0.42
0.36
0.39
0.36
0.32
Revenue per Share
0.02
- -
0.02
0.03
0.05
0.06
0.05
0.08
0.08
0.06
0.05
0.1
0.11
0.09
0.08
0.06
0.04
Basic EPS, GAAP
- -
- -
- -
0.02
- -
0.05
0.02
0.06
0.04
0.03
0.08
0.12
0.11
0.08
0.09
0.06
0.06
Free Cash Flow per Basic Share
- -
- -
0.01
0.01
0.01
0.02
0.03
0.03
0.06
0.07
0.04
0.07
0.12
0.09
0.08
0.06
0.04
Dividend per Share
- -
- -
0.05
0.07
0.09
0.12
0.14
0.29
0.34
0.34
0.36
0.41
0.67
0.68
0.73
0.73
0.73
Book Value per Share
- -
- -
0.06
0.1
0.13
0.21
0.23
0.29
0.35
0.35
0.38
0.42
0.68
0.7
0.84
0.81
0.81
Tangible Book Value per Share
985
- -
1,301
1,486
1,872
2,489
2,866
2,988
3,084
3,165
3,210
3,302
3,672
3,727
3,749
3,787
3,795
Basic Weighted Avg Shares
155
- -
181
241
794
933
1,043
1,177
1,376
1,153
1,057
1,429
1,548
1,354
1,479
1,352
1,205
Sales/Revenue/Turnover
13.71
- -
11.54
18.47
14.16
16.89
15.18
20.67
19.17
18.05
15.39
24.21
27.35
22.41
16.01
13.99
12.31
Operating Margin (%)
13
- -
14
15
23
33
50
66
84
95
100
103
101
107
123
138
130
Depreciation Expense
15
- -
20
42
99
153
148
228
249
192
156
330
391
324
300
219
171
Net Income, GAAP
4.27
- -
5
4.73
6.11
1.13
3.94
5.13
11.96
11.03
9.24
6.11
12.31
8.64
3.22
3.26
3.45
Effective Tax Rate (%)
9.79
- -
11
17.42
12.5
16.35
14.21
19.36
18.11
16.63
14.73
23.13
25.25
23.89
20.3
16.18
14.15
Profit Margin (%)
- -
5
31
95
182
399
387
559
684
646
731
897
2,031
2,107
2,396
2,358
2,380
Working Capital
- -
5
8
10
19
26
19
25
15
9
3
1
14
15
16
14
14
LT Debt
- -
45
83
157
259
535
681
873
1,071
1,122
1,209
1,377
2,511
2,606
3,174
3,090
3,079
Total Equity
- -
- -
26.82
29.79
41.72
33.87
23.04
27.99
22.82
16.5
12.52
24.95
18.94
10.74
7.88
5.81
4.59
Return on Invested Capital (%)
- -
- -
35.1
43.88
56.54
53.93
38.78
34.74
24.29
17.56
13.68
26.19
20.47
12.89
10.67
7.27
5.66
Return on Capital (%)
- -
- -
38.68
53.49
73.24
65.64
43.32
36.51
26.21
17.95
13.87
26.39
20.59
12.99
11.43
7.97
6.14
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'26
Dec'26
Mar'26
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
14
14
14
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
3,789
3,805
3,805
Market Capitalization
7,843
6,369
4,896

Working Capital

FRC

•

in mil. unless spec.
Sep'26
Dec'26
Mar'26
Total Current Assets
2,649
2,649
2,619
Cash, Cash Equivalents & STI
2,155
2,180
2,176
Accounts Receivable, Net
251
235
212
Inventories
175
166
160
Total Current Liabilities
281
265
239
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
20.98%
23.84%
-2.64%
Free Cash Flow
40.05%
0.35%
-37.64%
Net Income, GAAP
9.73%
15.78%
-27.13%
Sales/Revenue/Turnover
4.86%
6.31%
-8.58%
Total Cash Common Dividend
25.45%
19.9%
-18.43%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
384
414
348
333
1,479
2025
388
349
308
307
1,352
2026
326
307
266
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
0.02
0.02
0.01
0.08
2025
0.01
0.02
0.01
0.01
0.06
2026
0.01
0.01
0.01
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.02
0.02
0.02
0.08
2025
0.02
0.02
0.02
- -
0.06
2026
0.01
0.01
0.01
- -
- -
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Business
Inari Amertron Berhad, founded in 2010 and headquartered in Petaling Jaya, Malaysia, operates as a leading investment holding company providing outsourced semiconductor assembly and test (OSAT) services and electronics manufacturing services (EMS) to global customers in the semiconductor industry. The company offers comprehensive turnkey solutions including wafer probing and processing such as fine print wafer screen-printing bumping, SAC solder bump processing, pyramid core and pogo pin probe technologies, wafer thinning, plasma etching, and 2D/3D vision inspection; assembly services encompassing stencil printed SAC solder, dispensing of solder/glue/thermal materials, passive components down to 008004 size, LGA-SiP, FCBGA molded underfill, hermetic/leaded sensors/LED packages, system-on-module, fiber transceiver packages, and electromagnetic interference shielding at die/package/tester levels; package testing covering radio frequency up to 20GHz, fiber LIV/dynamic testing, optical/3D sensor testing, complex high-speed ASIC testing, and test design/development; as well as other services like new product introductions, failure analysis, customized automation and data processing systems via in-house iMES, customer tracking portals, full traceability/genealogy, burn-in/pre-cond/MSL packing, and vendor-managed inventory. Inari serves key market segments including smartphone/mobile devices, automotive, data communications, industrial, and generic applications, with manufacturing facilities in Malaysia, the Philippines, and China. In August 2025, Inari entered into a definitive joint acquisition agreement with China's San'an Optoelectronics to acquire 100% of Lumileds Holding B.V. and its European/Asian subsidiaries, a global LED technology leader, with the transaction expected to close by the first quarter of 2026 to support diversification into LED solutions and enhance growth prospects amid ongoing industry evolution.