- Business
- HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor back-end process equipment worldwide. The company offers an extensive range of products including dual TC bonders, HBM 6-side inspection systems, micro SAW equipment, vision placement equipment, meta grinders, EMI shield vision attach and detach equipment, EMI shield vision placement equipment, EMI shield tape mounter, EMI shield tape laser cutting equipment, EMI shield tape demounter, vision inspection equipment, converlay attach equipment, laser marking equipment, laser ablation equipment, laser cutting equipment, pick and place systems, strip mounters, singulation systems, flip chip binders, molding systems, trim and form systems, and PCB equipment; it also provides solutions for photovoltaic and LED applications such as PV brick IR inspection and PV wafer inspection equipment. Founded in 1980 and headquartered in Incheon, South Korea, HANMI Semiconductor operates primarily in the semiconductor equipment industry, serving major chip producers globally with a focus on advanced packaging and assembly technologies.
In recent developments, the company signed an approximately 8 billion won equipment supply contract with ASE Technology Holding in May 2025 for flip-chip bonders and secured ongoing partnerships in HBM production equipment. HANMI Semiconductor showcased new HBM4-compatible equipment including TC Bonder 4, 2.5D Big Die TC Bonder, and Big Die FC Bonder at SEDEX 2025 in October, amid reports of thawing relations with Samsung Electronics for potential HBM4 collaboration, and announced plans to build a new TC Bonder plant in Incheon. These initiatives reflect strategic expansions in high-bandwidth memory manufacturing and global supply chain strengthening.