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LB Semicon, Inc.

LB Semicon, Inc.

061970.KQ
LB Semicon, Inc.KR flagKOSDAQ
3,800.00
KRW
-320.00
- -
230.87BMarket Cap
LB Semicon, Inc.
061970.KQ
(KOSDAQ)

Recent

price

3,800.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
2,145.94
2,054
3,086.62
2,204.6
2,292.46
2,447.75
3,102.23
3,009.05
6,295.4
8,917.68
10,113.61
11,331.98
11,977.32
9,528.87
10,304.53
8,640.82
8,710.39
Revenue per Share
499
17.23
277
3
-80
-187
309
182
349
744
618
743
918
-347
-507
-2,717
-2,407.14
Basic EPS, GAAP
-179.13
-1,234.75
-546.48
-700.95
201.62
614.07
790.58
168.05
-315.62
-254.69
-301.17
-1,112.65
-907.05
62.98
-2,404.24
-825.14
-329.7
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
50
50
49.98
- -
- -
- -
- -
Dividend per Share
1,118.14
1,035.05
1,286.17
1,113.31
1,214.76
1,043.05
1,327.84
1,466.33
1,836.1
2,592.84
3,151.25
3,853.36
4,772.34
4,405.03
3,888.07
577.35
738.44
Book Value per Share
1,162.21
1,863.18
2,107.3
1,767.69
1,978.33
1,809.44
2,096.98
2,195.05
3,089.15
3,989.53
4,537.63
7,282.53
8,397.71
7,912.81
7,587.39
4,807.25
4,869.46
Tangible Book Value per Share
35
43
43
51
44
44
44
44
44
44
44
44
44
44
44
56
57
Basic Weighted Avg Shares
74,744
87,535
133,895
112,441
100,261
106,907
135,669
131,823
275,662
390,436
442,790
496,237
524,605
416,871
450,865
479,782
497,221
Sales/Revenue/Turnover
26.1
8.88
15.91
2.35
-1.97
0.06
13.11
7.78
9.96
12.92
9.66
8.91
10.83
-3.05
-4.17
-8.3
-5.66
Operating Margin (%)
6,634
10,060
13,030
25,399
26,738
25,604
26,464
28,162
39,377
53,958
58,052
76,639
89,258
96,655
96,456
95,838
86,042
Depreciation Expense
17,380
734
12,016
153
-3,499
-8,167
13,513
7,973
15,282
32,574
27,057
32,537
40,208
-15,181
-22,183
-150,861
-137,409
Net Income, GAAP
- -
- -
19.25
- -
- -
- -
17.36
15.83
23.94
20.43
17.62
8.63
16.95
- -
- -
- -
16.94
Effective Tax Rate (%)
23.25
0.84
8.97
0.14
-3.49
-7.64
9.96
6.05
5.54
8.34
6.11
6.56
7.66
-3.64
-4.92
-31.44
-27.64
Profit Margin (%)
-8,164
1,283
-510
-1,898
-20,994
-30,413
-23,639
-12,745
-46,038
-65,155
-40,376
13,699
-9,019
-43,147
-104,347
-104,169
-100,414
Working Capital
25,152
37,947
57,591
84,789
60,463
51,444
38,655
37,120
72,757
95,071
106,150
142,067
166,847
148,176
150,038
96,363
85,778
LT Debt
40,582
80,110
92,502
92,981
89,307
81,735
94,249
100,417
152,212
189,296
218,265
335,446
381,149
366,148
346,236
270,041
281,379
Total Equity
- -
- -
9.8
- -
- -
- -
7.49
4.28
7.92
11.34
8.33
7.6
7.26
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
11.53
- -
- -
- -
10.45
6.58
7.1
10.76
7.25
6.75
7.51
- -
- -
- -
-13.44
Return on Capital (%)
62.45
1.77
24.06
0.27
-6.37
-16.55
26.08
13.04
21.13
33.6
21.52
21.22
21.29
-7.56
-12.23
-149.24
-124.31
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
253,503
239,639
235,981
LT Borrowings
106,533
93,856
83,485
LT Finance Leases
2,628
2,507
2,294
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
57
58
58
Market Capitalization
284,030
239,169
226,622

Working Capital

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
189,004
211,080
220,893
Cash, Cash Equivalents & STI
19,367
57,972
33,973
Accounts Receivable, Net
74,527
70,935
99,030
Inventories
65,127
57,911
54,078
Total Current Liabilities
327,653
315,249
321,307
Payables & Accruals
- -
- -
- -
ST Debt
253,503
239,639
235,981
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
14.9%
7.18%
-22.01%
Free Cash Flow
-416.91%
-766.1%
-56.45%
Net Income, GAAP
41.37%
106.46%
580.07%
Sales/Revenue/Turnover
20%
2.36%
6.41%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
102,824
123,227
119,364
105,451
450,865
2025
116,812
115,688
125,550
121,731
479,782
2026
134,252
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-37
-33
-155
- -
-507
2025
-63
-189.07
-41.9
- -
-2,717
2026
175
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
LB Semicon Inc. (KOSDAQ: 061970) manufactures and provides outsourced semiconductor assembly and test (OSAT) services, specializing in flip-chip wafer bumping, probe testing, back-end processing, and wafer-level chip scale packaging (WLCSP) for display driver ICs (DDI), CMOS image sensors (CIS), power management ICs (PMIC), and other chips used in electronic devices such as TVs, monitors, mobile phones, and AI data centers; core offerings include gold bumped wafers for chip-on-glass (COG), chip-on-film (COF), and chip-on-plastic (COP) packages; solder bumps and Cu pillar bumps for flip-chip applications; Au redistribution layer (RDL) for I/O pad repositioning; thick Cu products; chip probe testing; and comprehensive back-end services encompassing laminating, back grinding, laser marking and grooving, sawing (SAW), plasma cleaning, automated visual inspection (AVI), UV irradiation, pick-and-place, visual inspection, packing, back side coating, foil mounting, and tape-and-reel. The company operates production facilities and sales offices in South Korea (Pyeongtaek-si and Anseong-si, Gyeonggi-do), the United States (San Jose, California), Singapore, and Taiwan (Hsinchu County). Founded in February 2000 and headquartered at 138 Cheongbuksandan-ro, Cheongbuk-myeon, Pyeongtaek-si, Gyeonggi-do, South Korea, LB Semicon listed on KOSDAQ in January 2011 and employs approximately 1,530 people with 2024 revenue of KRW 4,509 billion. Recent developments include the acquisition of the remaining 51.22% stake in subsidiary LB Lusem Co., Ltd. for KRW 56.6 billion in October 2024 to strengthen integrated packaging capabilities; a collaboration with SK keyfoundry announced in July 2025 to co-develop direct RDL technology on 8-inch wafers, enhancing next-generation semiconductor packaging reliability; and plans with LB Lusem, announced in December 2024, to launch turn-key packaging for AI data center power management chips featuring back grinding back metal (BGBM), RDL, ENIG, Taiko grinding, and MOSFET processing starting mid-2025 at initial capacity of 1,000 wafers per month, alongside development of embedded substrate power supplies with partners in Japan and the US.