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Semiconductor Manufacturing International Corporation

Semiconductor Manufacturing International Corporation

0981.HK
Semiconductor Manufacturing International CorporationHK flagHong Kong Stock Exchange
79.65
HKD
-3.90
- -
805.91BMarket Cap
Semiconductor Manufacturing International Corporation
0981.HK
(Hong Kong Stock Exchange)

Recent

price

79.65

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.64
0.48
0.57
0.65
0.58
0.57
0.69
0.67
0.68
0.62
0.61
0.69
0.92
0.8
1.01
1.17
- -
Revenue per Share
0.01
-0.11
0.01
0.05
0.05
0.07
0.09
0.04
0.03
0.05
0.11
0.22
0.23
0.11
0.06
0.09
- -
Basic EPS, GAAP
0.07
-0.21
-0.01
-0.01
-0.03
-0.15
-0.44
-0.27
-0.21
-0.17
-0.57
-0.17
-0.12
-0.54
-0.56
-0.65
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
0.12
0.13
0.15
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
-0.67
-0.68
-0.62
-0.52
-0.45
-0.33
-0.21
0.04
0.07
0.11
0.2
0.38
0.61
0.72
0.78
0.86
- -
Book Value per Share
0.79
0.73
0.65
0.7
0.88
0.99
1.2
1.4
1.77
1.97
3.36
3.17
3.6
3.83
3.95
4.34
- -
Tangible Book Value per Share
2,426
2,744
3,008
3,206
3,382
3,896
4,222
4,629
4,976
5,050
6,353
7,898
7,908
7,929
7,959
7,988
7,994
Basic Weighted Avg Shares
1,555
1,319
1,702
2,069
1,970
2,236
2,914
3,101
3,360
3,116
3,907
5,443
7,273
6,322
8,030
9,327
- -
Sales/Revenue/Turnover
3.34
-14.45
0.95
5.77
5.92
8.85
12.01
4.24
0.3
-1.07
7.94
20.43
24.6
5.64
5.9
11.16
- -
Operating Margin (%)
611
552
567
547
549
524
730
971
1,048
1,128
1,313
1,869
2,271
2,667
3,223
3,810
- -
Depreciation Expense
13
-247
23
173
153
253
377
180
134
235
716
1,702
1,818
903
493
685
- -
Net Income, GAAP
- -
- -
- -
2.31
8.54
3.7
- -
1.44
15.79
12.85
9.26
3.54
0.72
5.26
15.07
7.86
- -
Effective Tax Rate (%)
0.84
-18.71
1.34
8.37
7.77
11.33
12.92
5.79
3.99
7.53
18.31
31.27
24.99
14.28
6.14
7.35
- -
Profit Margin (%)
-224
-390
162
625
1,148
823
1,703
2,262
3,290
3,669
11,279
10,764
9,569
6,034
6,024
8,808
- -
Working Capital
235
101
529
782
1,127
909
2,338
2,872
2,179
2,385
5,018
5,645
7,374
8,960
8,046
9,996
- -
LT Debt
2,171
2,246
2,276
2,593
3,308
4,190
5,403
6,721
8,924
10,198
21,682
25,438
28,961
30,846
31,870
35,021
- -
Total Equity
- -
- -
- -
3.25
2.55
3.74
- -
1.4
0.08
-0.22
1.33
3.56
5.08
0.86
0.95
2.1
- -
Return on Invested Capital (%)
- -
- -
- -
-36.47
-143.13
82.84
- -
6.54
3.9
4.82
7.32
10.77
7.55
3.52
1.82
2.33
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
48.04
50.9
76.96
79.52
46.61
17.16
8.27
10.46
7.65
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
- -
2,601
- -
LT Borrowings
- -
9,995
- -
LT Finance Leases
- -
1
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
- -
8,000
- -
Market Capitalization
81,562
73,320
51,686

Working Capital

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
- -
15,625
- -
Cash, Cash Equivalents & STI
- -
10,404
- -
Accounts Receivable, Net
- -
877
- -
Inventories
- -
3,630
- -
Total Current Liabilities
- -
6,817
- -
Payables & Accruals
- -
- -
- -
ST Debt
- -
2,601
- -
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
26.39%
10.18%
9.89%
Free Cash Flow
76.13%
58.92%
15.91%
Net Income, GAAP
33.88%
17.59%
39.04%
Sales/Revenue/Turnover
16.62%
20.6%
16.15%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,750
1,901
2,171
2,207
8,030
2025
- -
- -
- -
- -
9,327
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.02
0.02
0.01
0.06
2025
- -
- -
- -
- -
0.09
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
Semiconductor Manufacturing International Corporation (SMIC) operates as China's largest pure-play semiconductor foundry, providing integrated circuit manufacturing services at process nodes from 350nm to 7nm, including logic, mixed-signal, RF, high-voltage analog, and specialty technologies for consumer electronics, telecommunications, automotive, IoT, and power management applications; it offers supporting services such as wafer fabrication, photomask manufacturing, packaging, testing, design/IP support, and turnkey solutions across 8-inch and 12-inch fabs. Founded in 2000 and headquartered in Shanghai with incorporation in the Cayman Islands, SMIC maintains wafer fabrication facilities in Shanghai, Beijing, Tianjin, Shenzhen, Chengdu, and Wuhan, alongside backend operations like a joint-venture bumping facility in Jiangyin; it conducts sales and services in the United States, Europe, Japan, Taiwan, and Hong Kong, serving clients including Huawei, Qualcomm, Broadcom, and Texas Instruments. In recent developments, SMIC advances toward 5nm process production expected in late 2024 using DUV lithography, launches volume 14nm FinFET and 7nm capabilities, and pursues acquisition of minority stakes in subsidiary SMIC North Integrated Circuit Manufacturing (Beijing) via A-share issuance from state-backed funds including the National Integrated Circuit Industry Investment Fund to consolidate control over a key 12-inch wafer base projected at RMB12.979 billion revenue and RMB1.682 billion net profit in 2024; it faces ongoing U.S. export restrictions as a designated military end-user since 2020 while expanding capacity amid geopolitical tensions.