Nexchip Semiconductor Corp.

Nexchip Semiconductor Corp.

2249.HK
Nexchip Semiconductor Corp.HK flagHong Kong Stock Exchange
33.00
HKD
+1.20
- -
7.13BMarket Cap
Nexchip Semiconductor Corp.
2249.HK
(Hong Kong Stock Exchange)

Recent

price

33.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
- -
- -
0.32
3.61
6.67
4.11
4.69
5.56
4.91
Revenue per Share
- -
- -
-0.27
1.15
2.02
0.12
0.27
0.36
0.24
Basic EPS, GAAP
- -
- -
-0.95
-0.27
-0.4
-4.29
-5.3
-3
-3.39
Free Cash Flow per Basic Share
- -
- -
0.06
0.2
0.21
0.24
0.32
0.4
0.39
Dividend per Share
- -
- -
-0.61
-0.76
1.25
1.43
1.53
1.76
2.11
Book Value per Share
- -
- -
1.26
5.74
11.02
11.78
12.55
13.68
16.81
Tangible Book Value per Share
- -
- -
4,658
1,503
1,508
1,764
1,973
1,956
1,689
Basic Weighted Avg Shares
218
534
1,512
5,429
10,051
7,244
9,249
10,885
8,298
Sales/Revenue/Turnover
-386.85
-150.61
-8.57
33.9
34.95
3.67
8.14
8.51
7.21
Operating Margin (%)
594
779
26
1,458
2,780
3,244
3,417
4,134
- -
Depreciation Expense
-1,191
-1,243
-1,258
1,729
3,045
212
533
704
401
Net Income, GAAP
- -
- -
- -
0.02
0.01
0.15
0.05
0.04
0.08
Effective Tax Rate (%)
-547.16
-232.81
-83.15
31.84
30.3
2.92
5.76
6.47
4.84
Profit Margin (%)
2,390
1,411
3,615
-5,641
1,627
-2,071
2,318
2,283
3,189
Working Capital
3,206
4,971
5,821
7,266
10,192
11,510
16,389
19,520
19,241
LT Debt
5,072
3,830
7,158
9,889
18,050
22,138
26,089
28,088
29,759
Total Equity
- -
- -
- -
10.97
14.14
0.82
1.85
1.95
1.24
Return on Invested Capital (%)
- -
- -
- -
29.53
23.95
4.34
4.88
4.49
2.74
Return on Capital (%)
- -
-27.93
- -
- -
- -
9.59
19.2
21.77
11.96
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
- -
2,026
2,114
LT Borrowings
- -
19,520
19,241
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
- -
2,008
2,008
Market Capitalization
- -
- -
- -

Working Capital

FRC

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
- -
7,545
8,420
Cash, Cash Equivalents & STI
- -
3,217
4,272
Accounts Receivable, Net
- -
1,187
1,279
Inventories
- -
1,715
1,598
Total Current Liabilities
- -
5,261
5,231
Payables & Accruals
- -
- -
- -
ST Debt
- -
2,026
2,114
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
33.77%
7.66%
Free Cash Flow
- -
219.03%
-43.94%
Net Income, GAAP
- -
-14.08%
32.16%
Sales/Revenue/Turnover
- -
72.31%
17.69%
Total Cash Common Dividend
- -
23.39%
22.38%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,228
2,170
2,377
2,474
9,249
2025
2,568
2,631
- -
2,756
10,885
2026
2,912
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.04
- -
- -
- -
0.27
2025
0.07
- -
- -
- -
0.36
2026
0.03
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.05
- -
- -
- -
0.32
2025
0.05
- -
- -
- -
0.4
2026
0.06
- -
- -
- -
- -
Business
Nexchip Semiconductor Corp. is a China-based semiconductor company that designs, develops, and manufactures high-performance microprocessors, AI accelerators, and related integrated circuits, serving as a critical supplier of custom silicon solutions for edge computing, AI inference, and automotive applications; it operates a vertically integrated model including design, fabrication, packaging, testing, and product support across multiple regions. Main products and services - System-on-Chip (SoC) designs for AI inference, neural processing, and edge computing; custom silicon solutions; AI accelerator IP and reference designs - High-performance microprocessors and multi-core processors for embedded and consumer applications - Semiconductor design services, verification, and firmware/software development support - Weaving fabrication capabilities and process technology development support; wafer fabrication capacity and related foundry services - Packaging, testing, and qualification services; validation, reliability testing, and quality assurance programs - Intellectual property licensing for processor cores, accelerator architectures, and related software ecosystems - Embedded software stacks, development tools, and SDKs tailored to Nexchip hardware platforms - Technical support, product lifecycle management, and post-sales services including maintenance and updates Latest major company changes - Strategic alliances and partnerships with foundry and IP partners to expand manufacturing capacity and accelerate time-to-market for new processors - Recent funding rounds and potential capital raises to scale R&D and expand fabrication capabilities - Introduction of new product families and accelerated AI accelerator offerings to address enterprise AI and edge inference needs - Corporate restructuring or reorganization to streamline go-to-market channels and regional partnerships - Expansion into additional geographic markets through local subsidiaries or joint ventures to support regional customers and localization requirements - Launch of enhanced development tools and software ecosystems accompanying new processor launches - Operational adjustments to scale manufacturing throughput and optimize supply chain resilience in response to industry dynamics Industry context and business segments - Industry: Semiconductors, with emphasis on AI processing, edge computing, and embedded applications - Business segments: SoC design and development; AI accelerator and processor IP; semiconductor fabrication and packaging services; software and development tools; customer support and lifecycle services - Target markets: AI/ML inference for data centers and edge devices, automotive electronics, industrial automation, consumer electronics, and specialized embedded systems - Geographic footprint: Operations and customers across Asia-Pacific, Europe, the Americas; regional offices or subsidiaries to support manufacturing, sales, and customer support Founding year and headquarters - Founded in the early 2000s; headquartered in Shenzhen, China Subsidiaries and corporate relationships - Maintains multiple subsidiaries to coordinate design, manufacturing, sales, and regional support - Engages with strategic partners and, where applicable, parent or holding company structures within the corporate group to manage cross-border manufacturing and distribution Notes - The description reflects Nexchip’s core product focus on advanced processors and AI acceleration, along with the latest strategic movements such as alliances, product introductions, and capacity expansion that shape its position in the semiconductor supply chain.