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Shanghai Sinyang Semiconductor Materials Co., Ltd.

Shanghai Sinyang Semiconductor Materials Co., Ltd.

300236.SZ
Shanghai Sinyang Semiconductor Materials Co., Ltd.CN flagShenzhen Stock Exchange
110.00
CNY
+0.21
- -
34.47BMarket Cap
Shanghai Sinyang Semiconductor Materials Co., Ltd.
300236.SZ
(Shenzhen Stock Exchange)

Recent

price

110.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.85
0.83
0.71
0.95
1.36
1.63
1.44
1.62
1.93
2.21
2.39
3.3
3.83
3.92
4.75
6.21
5.49
Revenue per Share
0.23
0.22
0.2
0.2
0.25
0.19
0.19
0.25
0.02
0.73
0.91
0.3
0.17
0.54
0.57
0.96
0.8
Basic EPS, GAAP
0.23
-0.05
-0.03
-0.12
-0.06
-0.1
0.14
0.23
-0.07
-0.02
- -
-0.77
-0.77
-0.2
0.05
0.02
-0.78
Free Cash Flow per Basic Share
0.1
0.09
0.11
0.08
0.08
0.01
0.05
0.07
0.09
0.05
0.15
0.26
0.23
0.22
0.25
0.3
0.3
Dividend per Share
0.66
0.79
0.76
0.94
0.92
1.61
1.46
1.6
1.53
2.49
3.19
3.14
3.58
3.93
4.36
5.66
4.52
Book Value per Share
0.7
1.92
1.8
2.62
2.33
3.08
3.66
3.78
3.9
5
16.13
15.96
13.01
13.31
14.33
15.43
14.23
Tangible Book Value per Share
154
180
203
221
277
227
287
291
291
289
291
308
312
310
311
312
312
Basic Weighted Avg Shares
131
150
143
209
376
368
414
472
560
641
694
1,016
1,196
1,212
1,475
1,937
1,711
Sales/Revenue/Turnover
29.69
24.93
11.81
11.84
20.28
14.75
15.75
18
11.24
6.24
10.43
9.8
11.12
12.6
14.04
16.47
14.74
Operating Margin (%)
5
5
6
8
15
18
20
22
23
24
28
47
56
73
89
131
- -
Depreciation Expense
36
39
40
44
68
42
54
72
7
210
266
94
53
167
176
301
250
Net Income, GAAP
11.64
12.02
9.59
12.68
14.91
14.54
10.58
14.28
- -
19.84
16.46
10.45
- -
10.11
8.67
2.36
9.34
Effective Tax Rate (%)
27.32
25.98
27.75
21.15
18.13
11.49
13.15
15.33
1.19
32.81
38.29
9.22
4.45
13.76
11.91
15.53
14.62
Profit Margin (%)
74
303
315
408
354
273
631
662
572
573
265
1,382
1,209
1,229
1,122
1,194
1,065
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
- -
33
21
188
215
292
169
77
120
LT Debt
118
356
376
795
857
907
1,256
1,304
1,276
1,516
4,766
4,995
4,155
4,228
4,570
5,163
4,630
Total Equity
28.38
13.54
4.16
3.65
7.78
5
5.1
5.61
- -
2.21
1.81
1.69
- -
2.87
3.92
5.8
4.78
Return on Invested Capital (%)
34.66
30.93
22.03
23.21
27.74
11.87
12.19
15.21
- -
31.89
25.73
8.4
- -
9.92
10.56
14.88
13.88
Return on Capital (%)
38.87
32.02
26.76
24.35
29.54
13.67
13.89
16.41
1.46
36.07
32.21
9.89
5.12
14.32
13.67
19.28
19.1
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
210
257
436
LT Borrowings
163
222
117
LT Finance Leases
6
6
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
313
313
313
Market Capitalization
11,567
11,021
12,087

Working Capital

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
1,920
2,031
2,105
Cash, Cash Equivalents & STI
709
716
762
Accounts Receivable, Net
603
633
659
Inventories
326
334
392
Total Current Liabilities
798
862
1,041
Payables & Accruals
- -
- -
- -
ST Debt
210
257
436
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
28.42%
2.16%
12.99%
Free Cash Flow
36,240.95%
72,580.36%
-57.03%
Net Income, GAAP
323.89%
36.39%
71.12%
Sales/Revenue/Turnover
18.62%
23.69%
31.28%
Total Cash Common Dividend
104.88%
21.96%
21.6%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
297
363
406
408
1,475
2025
434
463
543
- -
1,937
2026
577
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.06
- -
- -
- -
0.57
2025
0.16
- -
- -
- -
0.96
2026
0.33
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
- -
- -
- -
0.25
2025
0.01
- -
- -
- -
0.3
2026
0.01
- -
- -
- -
- -
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Business
Shanghai Sinyang Semiconductor Materials Co., Ltd. Shanghai Sinyang Semiconductor Materials Co., Ltd. (300236.SZ) engages in the research, development, production, sales, and service of electronic chemicals, key process materials, supporting equipment, and integrated solutions for the semiconductor industry, with a focus on integrated circuit manufacturing, advanced packaging, and surface treatment applications. Founded in 1999 and headquartered in Shanghai, China, at No. 3600 Sixian Road, Songjiang District, the company offers core products including electroplating solutions and additives for IC manufacturing and advanced packaging; high-end photoresist series and ArF photoresist products for IC manufacturing; chemical mechanical polishing liquids; etching liquids; electronic chemicals for semiconductor packaging such as pre-treatment chemicals, post-treatment chemicals, chemical degreasers, and acid copper additives; ancillary equipment like automatic immersion systems, high-pressure water spray units, automatic hanging plating lines, high-speed electroplating lines, wafer wet process equipment, and diamond dicing knives; as well as fluorocarbon coating series and environmentally friendly functional coatings for professional coating solutions. The company primarily serves semiconductor manufacturers, packaging and testing facilities, and aerospace electronic component producers, with operations centered in China and targeting domestic gaps in cutting-edge semiconductor materials. Recent developments include Wang Fuxiang's acquisition of an additional 5% minority stake in the company, expansion of ArF photoresist production capacity from 100 tons to a planned 500 tons over three years with samples under validation at domestic wafer manufacturers, and strong growth in its integrated circuit materials division revenue exceeding 998 million RMB in 2024, up over 40% from 2023.