1. People's Republic of China Stocks

  2. •

    Technology

  3. •

    Semiconductors
Hunan Goke Microelectronics Co.,Ltd.

Hunan Goke Microelectronics Co.,Ltd.

300672.SZ
Hunan Goke Microelectronics Co.,Ltd.CN flagShenzhen Stock Exchange
258.67
CNY
-5.93
- -
56.16BMarket Cap
Hunan Goke Microelectronics Co.,Ltd.
300672.SZ
(Shenzhen Stock Exchange)

Recent

price

258.67

P/E

ratio

- -

div

yld

- -

ROIC.AI

2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
- -
- -
3.05
3.66
2.7
2.25
3.02
4.05
12.87
19.67
19.48
9.14
8.25
8.6
Revenue per Share
- -
- -
0.35
0.38
0.35
0.32
0.38
0.39
1.63
0.83
0.44
0.45
-1.07
0.42
Basic EPS, GAAP
- -
- -
-1.22
-0.29
0.26
-1.08
0.84
-0.45
-1.47
1.63
1.54
-3.16
-1.55
-3.02
Free Cash Flow per Basic Share
- -
- -
0.01
- -
- -
0.13
0.16
0.25
0.46
0.55
0.45
0.48
0.45
0.44
Dividend per Share
- -
- -
1.16
1.39
1.7
1.66
2.33
2.61
3.78
4.06
3.5
3.57
2.12
3.35
Book Value per Share
- -
- -
4.88
4.75
5.7
3.25
3.72
3.8
4.87
18.45
13.88
12.91
10.53
12.56
Tangible Book Value per Share
- -
- -
120
134
153
178
180
180
180
183
217
216
217
217
Basic Weighted Avg Shares
85
181
367
489
412
400
543
731
2,322
3,605
4,231
1,978
1,791
1,868
Sales/Revenue/Turnover
1.22
13.04
6.12
7.28
2.77
8.06
20.04
13.38
14.92
4.64
1.62
3.66
-9.81
5.26
Operating Margin (%)
- -
4
12
18
27
40
45
60
127
194
217
283
301
- -
Depreciation Expense
10
40
42
51
53
56
68
71
293
152
96
97
-233
90
Net Income, GAAP
21.2
10.59
12.45
13.95
1.96
13.05
- -
- -
- -
- -
- -
- -
- -
51.33
Effective Tax Rate (%)
11.47
22.04
11.31
10.45
12.79
14.04
12.55
9.69
12.62
4.21
2.27
4.91
-13.02
4.84
Profit Margin (%)
76
50
447
501
680
289
478
298
270
1,270
935
2,096
1,512
1,981
Working Capital
- -
40
- -
- -
- -
- -
205
188
165
10
215
213
14
20
LT Debt
118
162
650
710
960
1,006
1,119
1,233
1,494
3,996
4,104
4,107
3,804
4,082
Total Equity
- -
12.77
4.56
4.48
1.34
2.62
- -
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
- -
38.79
31.63
25.73
27.46
20.45
- -
- -
- -
- -
- -
- -
- -
5.95
Return on Capital (%)
- -
42.68
32.94
31.4
23.63
20.22
19.09
15.94
50.86
21.32
12.78
12.68
-37.84
12.47
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
1,968
2,098
2,231
LT Borrowings
200
200
- -
LT Finance Leases
14
11
20
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
217
217
217
Market Capitalization
14,499
14,955
18,440

Working Capital

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
5,248
5,295
5,088
Cash, Cash Equivalents & STI
1,556
1,823
1,713
Accounts Receivable, Net
544
524
558
Inventories
1,065
1,021
905
Total Current Liabilities
3,152
3,085
3,107
Payables & Accruals
- -
- -
- -
ST Debt
1,968
2,098
2,231
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
25.47%
36.8%
-7.37%
Free Cash Flow
-152.73%
-65.42%
-50.71%
Net Income, GAAP
-5.21%
-22.06%
-340.12%
Sales/Revenue/Turnover
31.25%
45.52%
-9.44%
Total Cash Common Dividend
- -
20.56%
-6.34%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
343
508
351
776
1,978
2025
305
436
619
- -
1,791
2026
633
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.19
- -
- -
- -
0.45
2025
0.24
- -
- -
- -
-1.07
2026
0.25
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
- -
- -
- -
0.48
2025
0.03
- -
- -
- -
0.45
2026
0.04
- -
- -
- -
- -
Similar Companies
Archer Materials Limited (AXE.AX)
Aixtron Se (AIXA.DE)
OmniVision Integrated Circuits Group, Inc. (0501.HK)
WISeKey International Holding AG (0RF1.L)
TCL Technology Group Corporation (000100.SZ)
Jiangxi Lianchuang Optoelectronic Science & Tech Co., Ltd. Class A (600363.SS)
Business
Hunan Goke Microelectronics Co., Ltd. (300672.SZ) is a China-based fabless semiconductor company engaged in the research, development, design, and sales of integrated circuit chips and related solutions. The company offers a comprehensive portfolio of products including UHD display and decoding chips such as 4K/8K ultra-high-definition decoding chips and H.264/H.265 high-definition video encoding chips; smart vision processing chips and end-side artificial intelligence chips; solid-state storage controller chips and SSD controllers; live broadcast satellite high-definition decoding chips; pan-screen commercial display chips; wireless LAN chips; automotive SerDes chips; satellite navigation and positioning chips; and Internet of Things solutions. These products serve applications in smart set-top boxes, intelligent surveillance, smart monitoring, data storage, automotive electronics, and consumer electronics, targeting domestic and international clients including leading mobile communication terminal enterprises in China. Founded in 2008 and headquartered in Changsha, Hunan Province, the company maintains subsidiary offices and R&D centers in Chengdu, Shanghai, Shenzhen, Beijing, Changzhou, Jinan, Hangzhou, and international locations including Taipei and Silicon Valley, USA. Hunan Goke Microelectronics operates primarily in the semiconductors industry, focusing on segments such as ultrahigh-definition smart displays, smart vision, artificial intelligence, data storage, satellite positioning, and automotive electronics, with a strong emphasis on independent intellectual property and over 20% of annual sales revenue invested in R&D. In recent developments, the company announced in June 2025 plans to acquire 94.366% equity in Semiconductor Manufacturing International Corporation Ningbo (SMIC Ningbo) through a combination of share issuance and cash payments, along with raising matching funds for cash compensation, project construction, and working capital replenishment; this strategic move aims to integrate design and manufacturing capabilities, enhance production of high-end filters, MEMS, and analog chips, enter the radio frequency front-end market with BAW filters (domestic localization rate under 5%), and achieve supply chain autonomy amid a wave of semiconductor mergers. The transaction involves counterparties such as Ningbo Yongxin, SMIC Holdings, and National Big Fund Phase I, positioning Hunan Goke as a dual-drive entity in digital chip design and analog chip manufacturing while shortening product development cycles and improving cost control. No other major acquisitions, partnerships, funding rounds, or product launches were reported in the last 1-2 years.