- Business
- Unimicron Technology Corp. (3037.TW) manufactures and sells advanced printed circuit boards (PCBs) and integrated circuit substrates for use in consumer electronics, networking equipment, automotive applications, and computing devices. The company offers high-density interconnect (HDI) PCBs, flexible and rigid-flex PCBs, integrated circuit substrates including flip-chip ball grid array (FCBGA) and cavity substrates, and carrier boards for semiconductor packaging; it also provides related services such as design, prototyping, and mass production tailored to high-performance computing, AI servers, 5G infrastructure, and electric vehicle components. Founded in 1990 and headquartered in Taoyuan, Taiwan, Unimicron operates manufacturing facilities in Taiwan, China, and Thailand, serving major global clients in the electronics and semiconductor industries with a focus on Asia-Pacific, North America, and Europe markets. In recent developments within the last two years, the company expanded its production capacity for advanced substrates through investments exceeding NT$20 billion in new fabs in Taiwan and Thailand to meet surging demand from AI and high-performance computing sectors; it also formed strategic partnerships with leading semiconductor firms for co-development of next-generation packaging solutions and completed acquisitions of smaller PCB specialists to bolster its rigid-flex and HDI capabilities.