Ardentec Corporation

Ardentec Corporation

3264.TWO
Ardentec CorporationTW flagTaipei Exchange
235.00
TWD
+3.00
- -
111.37BMarket Cap
Ardentec Corporation
3264.TWO
(Taipei Exchange)

Recent

price

235.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
11.17
10.63
11.14
10.77
12.56
12.74
13.43
16.82
18.04
17.12
20.54
25.24
30.6
29.65
27.64
29.59
27.81
Revenue per Share
3.02
1.77
1.75
1.81
2.6
2.12
1.92
2.73
3.31
2.36
3.78
5.46
7.48
5.79
4.44
5.99
4.59
Basic EPS, GAAP
1.42
-0.39
2.3
-0.62
0.18
3.25
4.05
2.66
-0.56
1.73
-0.73
-1.02
1.53
1.46
5.39
3.91
4.63
Free Cash Flow per Basic Share
1.13
1.89
1.14
1.06
1.07
1.58
1.3
1.3
1.67
1.61
1.31
2.01
2.8
3.5
3.3
4
- -
Dividend per Share
14.23
13.54
13.93
16.21
15.84
16.03
16.32
17.01
18.28
18.54
20.63
23.46
27.25
29.55
30.84
32.22
28.76
Book Value per Share
17.08
16.72
17.45
18.16
19.88
20.39
21.19
20.46
22.17
22.81
25.22
28.44
33.64
35.96
37.34
39.35
35.25
Tangible Book Value per Share
455
462
463
464
464
465
466
467
468
470
471
473
474
474
474
474
473
Basic Weighted Avg Shares
5,084
4,904
5,159
5,001
5,834
5,925
6,260
7,860
8,444
8,050
9,675
11,926
14,499
14,052
13,101
14,028
13,162
Sales/Revenue/Turnover
30.37
20.46
20.07
19.98
21.71
19.36
17.04
20.59
21.77
19.56
23.05
25.7
30.02
24.23
17.97
25.41
21.52
Operating Margin (%)
1,482
1,664
1,724
1,706
1,928
1,992
2,118
2,350
2,268
2,580
2,766
3,112
3,509
4,024
4,138
3,139
3,575
Depreciation Expense
1,376
819
811
842
1,207
987
893
1,277
1,549
1,110
1,782
2,580
3,546
2,746
2,104
2,840
2,170
Net Income, GAAP
9.05
17.42
19.78
16.16
16.03
16.96
15
17.55
21.84
25.59
20.75
18.97
18.82
18.73
12.93
21.36
19.23
Effective Tax Rate (%)
27.07
16.7
15.72
16.84
20.68
16.66
14.27
16.25
18.34
13.78
18.42
21.64
24.45
19.54
16.06
20.25
16.49
Profit Margin (%)
2,614
2,138
2,495
1,958
2,383
2,179
2,885
2,960
1,657
1,849
2,465
2,663
3,943
3,616
3,384
1,987
2,412
Working Capital
1,649
1,952
1,731
2,024
2,764
1,947
2,414
3,008
2,598
3,839
5,739
7,654
9,403
10,022
9,360
7,927
9,584
LT Debt
7,780
7,760
8,123
8,485
9,274
9,509
10,531
10,178
11,003
11,330
12,487
14,006
16,532
17,614
18,299
19,247
17,301
Total Equity
16
8.52
8.28
7.8
9.03
7.99
6.9
9.03
9.27
7.23
9.7
11.38
13.68
9.52
6.7
8.95
7.68
Return on Invested Capital (%)
18.88
10.43
10.31
9.54
12.3
10.56
8.45
10.76
12.43
8.8
12.16
14.31
16.64
11.73
8.69
11.27
9.29
Return on Capital (%)
22.77
12.87
12.78
12.05
16.22
13.33
11.86
16.42
18.77
12.85
19.34
24.81
29.55
20.41
14.7
19
15.95
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
3,174
3,750
3,826
LT Borrowings
7,885
8,071
8,138
LT Finance Leases
1,474
1,545
1,447
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
474
474
474
Market Capitalization
25,168
34,979
35,877

Working Capital

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
9,022
10,376
10,482
Cash, Cash Equivalents & STI
5,392
6,400
6,515
Accounts Receivable, Net
2,681
2,801
2,896
Inventories
- -
- -
- -
Total Current Liabilities
5,638
6,641
8,070
Payables & Accruals
- -
- -
- -
ST Debt
3,174
3,750
3,826
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
7.45%
9.16%
5.18%
Free Cash Flow
-65.34%
5.28%
-27.46%
Net Income, GAAP
15.82%
14.24%
34.98%
Sales/Revenue/Turnover
9.63%
8.42%
7.08%
Total Cash Common Dividend
12.39%
26.86%
21.21%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
3,345
3,403
3,761
3,543
14,052
2024
3,268
3,307
3,369
3,157
13,101
2025
3,213
3,424
3,799
- -
14,028

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
1.3
1.43
1.8
- -
5.79
2024
1.15
1.16
1.19
- -
4.44
2025
1.27
1.19
- -
- -
5.99

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
3.5
2024
- -
- -
- -
- -
3.3
2025
- -
- -
- -
- -
4
Business
Ardentec Corporation specializes in the manufacturing and provision of semiconductor testing services and solutions. The company offers core products and services including semiconductor wafer probing and final testing; packaging; module assembly with JTAG and system-level testing; probe cards; and testing equipment. Ardentec caters primarily to clients in the semiconductor and electronics industries with a focus on advancing semiconductor quality and production efficiency. The company operates extensively in the Asia-Pacific region, with headquarters situated in Taiwan. Founded in 1997, Ardentec continues to expand its footprint and technological capabilities within the semiconductor testing sector. Recent major company developments include strategic business expansions and service enhancements in response to growing semiconductor industry demands. Over the past 1-2 years, Ardentec has launched new high-precision testing solutions and strengthened collaborations to broaden its product portfolio and regional presence, aiming to sustain competitive advantages in an evolving market environment. In summary, Ardentec Corporation is an established semiconductor testing service provider offering wafer probing, final testing, packaging, module assembly, and related testing solutions, operating primarily in Asia since its inception in 1997, with recent expansions focused on new testing technologies and strategic partnerships to fuel growth and operational scale.