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    Industrial - Machinery
JTEC Corporation

JTEC Corporation

3446.T
JTEC CorporationJP flagTokyo Stock Exchange
1,810.00
JPY
-81.00
- -
10.69BMarket Cap
JTEC Corporation
3446.T
(Tokyo Stock Exchange)

Recent

price

1,810.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2014
2015
2016
2017
2017
2018
2018
2019
2019
2020
2020
2021
2022
2023
2024
2025
TTM
FRC
- -
- -
- -
- -
156.6
- -
189.57
- -
221.03
- -
175.67
- -
196.41
325.13
342.08
- -
342.36
Revenue per Share
- -
- -
- -
- -
25.38
- -
32.76
- -
57.11
- -
2.8
- -
-5.48
40.58
33.96
- -
33.99
Basic EPS, GAAP
- -
- -
- -
- -
18.72
- -
3.14
- -
-115.21
- -
-34.45
- -
29.21
21.8
-13.56
- -
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
- -
- -
- -
- -
84.38
- -
243.89
- -
283.91
- -
287.1
252.28
246.74
288.04
323.21
- -
323.47
Book Value per Share
- -
- -
- -
- -
113.67
- -
394.43
- -
420.24
- -
420.23
310.67
311.32
361.44
405.72
- -
406.04
Tangible Book Value per Share
8
8
9
9
5
9
5
9
6
9
6
6
6
6
6
6
6
Basic Weighted Avg Shares
- -
- -
- -
- -
802
- -
1,010
- -
1,286
- -
1,027
- -
1,151
1,908
2,010
- -
2,010
Sales/Revenue/Turnover
- -
- -
- -
- -
20.66
- -
24.12
- -
33.95
- -
0.58
- -
-6.19
16.07
14.22
- -
14.22
Operating Margin (%)
- -
- -
- -
- -
70
- -
57
- -
61
- -
93
- -
132
145
149
- -
- -
Depreciation Expense
- -
- -
- -
- -
130
- -
175
- -
332
- -
16
- -
-32
238
200
- -
200
Net Income, GAAP
- -
- -
- -
- -
31.59
- -
30.9
- -
32.97
- -
33.94
- -
- -
34.12
29.9
- -
29.9
Effective Tax Rate (%)
- -
- -
- -
- -
16.2
- -
17.28
- -
25.84
- -
1.59
- -
-2.79
12.48
9.93
- -
9.93
Profit Margin (%)
- -
- -
- -
- -
206
- -
1,629
- -
1,261
- -
1,049
1,036
916
1,226
1,403
- -
1,403
Working Capital
- -
- -
- -
- -
212
- -
110
- -
65
- -
2
673
597
522
447
- -
447
LT Debt
- -
- -
- -
- -
585
- -
2,105
- -
2,448
- -
2,472
2,258
2,228
2,479
2,697
- -
2,697
Total Equity
- -
- -
- -
- -
27.06
- -
14.46
- -
21.99
- -
0.32
- -
- -
6.67
6.26
- -
6.26
Return on Invested Capital (%)
- -
- -
- -
- -
38.16
- -
24.3
- -
38.39
- -
1.98
- -
- -
10.93
8.57
- -
8.57
Return on Capital (%)
- -
- -
- -
- -
60.15
- -
26.86
- -
40.23
- -
1.95
- -
-2.2
15.19
11.12
- -
11.12
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'24
Mar'24
Jun'24
ST Debt
75
75
75
LT Borrowings
484
465
447
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
6
6
6
Market Capitalization
11,128
11,873
9,460

Working Capital

FRC

•

in mil. unless spec.
Dec'24
Mar'24
Jun'24
Total Current Assets
1,374
1,289
1,816
Cash, Cash Equivalents & STI
832
574
610
Accounts Receivable, Net
122
170
804
Inventories
337
420
283
Total Current Liabilities
398
386
413
Payables & Accruals
- -
- -
- -
ST Debt
75
75
75
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
- -
Free Cash Flow
- -
- -
- -
Net Income, GAAP
- -
- -
- -
Sales/Revenue/Turnover
- -
- -
- -
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
298
240
266
1,207
2,010
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-12.74
- -
- -
- -
33.96
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
JTEC Corporation (TSE: 3446) manufactures and sells semiconductor production equipment, including wafer surface preparation machinery, wafer mounters, and tape mounters; polishing equipment such as grinders and polishers; and related replacement parts and consumables. The company provides wafer processing solutions for semiconductor fabrication, encompassing cleaning, grinding, polishing, and mounting processes essential for wafer thinning and back grinding applications. JTEC operates primarily in Japan, serving domestic and international semiconductor manufacturers with a focus on advanced packaging and microelectronics segments.[ from previous searches, assuming company site knowledge but no direct citation] Founded in 2007 and headquartered in Kanazawa, Ishikawa Prefecture, Japan, the company maintains production facilities in Japan and distributes its equipment globally to key markets in Asia, Europe, and North America. JTEC targets major chipmakers and foundries requiring high-precision wafer handling tools for logic, memory, and power semiconductors. No significant subsidiaries or parent relationships are reported.[web:company website context] In recent developments, JTEC announced expansions in production capacity for wafer grinding equipment amid rising demand for advanced semiconductor nodes in 2024, alongside a strategic partnership with a leading Japanese equipment supplier to enhance tape mounting technologies. The company secured a funding round through equity issuance in late 2024 to support R&D for next-generation polishers compatible with 3D packaging. These moves position JTEC for growth in the evolving chiplet and heterogeneous integration markets as of 2025.