- Business
- Unisem (M) Berhad specializes in the manufacturing and provision of semiconductor devices, delivering a broad spectrum of assembly and testing services. The company provides a fully integrated suite of solutions, encompassing advanced wafer processing, such as bumping, probing, and grinding, alongside sophisticated wafer-level chip-scale packaging and radio frequency capabilities. Unisem offers a diverse selection of integrated circuit packages, including leadframe and substrate options, as well as comprehensive testing for analog, digital, and mixed-signal components. Beyond core packaging and testing, Unisem extends its offerings to critical test-related services like reliability evaluation, thermal and electrical characterization, and logistics such as dry packing and tape and reel processes. The company also delivers end-to-end turnkey services, managing everything from initial design and assembly to final testing, failure analysis, warehousing, and direct drop-shipment, supporting electronics enterprises globally. Serving a clientele that predominantly includes fabless companies and integrated device manufacturers, Unisem maintains a significant market presence across North America, Asia, and Europe, with North America identified as a key revenue-generating region. Headquartered in Kuala Lumpur, Malaysia, the company was established in 1989 and operates major manufacturing facilities in Ipoh and the newly expanding Gopeng plant in Malaysia, as well as in Chengdu, People's Republic of China. Unisem (M) Berhad operates as a subsidiary of Huatian Technology (Malaysia) Sdn. Bhd. The company recently announced a third interim dividend for the financial year ending 2025 and anticipates continued growth into 2026, driven by demand in artificial intelligence and peripheral technologies.