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    Manufacturing - Metal Fabrication
STG Co., Ltd.

STG Co., Ltd.

5858.T
STG Co., Ltd.JP flagTokyo Stock Exchange
1,370.00
JPY
+30.00
- -
2.91BMarket Cap
STG Co., Ltd.
5858.T
(Tokyo Stock Exchange)

Recent

price

1,370.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
TTM
FRC
1,047.6
1,226.58
1,394.27
1,567.16
1,181.16
2,108.95
2,831.53
3,151.85
3,106.76
- -
1,412.98
Revenue per Share
74.19
49.6
90.35
102.21
44.74
53.27
115.77
119.04
188.14
- -
87.61
Basic EPS, GAAP
58.42
53.98
24.08
-20.06
-93.82
-200.57
142.5
-85.83
63.35
- -
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
7.5
7.57
7.5
12.43
11.81
- -
- -
Dividend per Share
-145.72
-96.12
224.27
429.57
437.16
487.2
597.19
780.2
824.19
- -
725.61
Book Value per Share
116.08
147.91
236.17
524.41
373.91
410.83
601.73
881.94
1,034.14
- -
891.62
Tangible Book Value per Share
2
2
2
2
2
2
2
2
2
- -
2
Basic Weighted Avg Shares
1,806
2,114
2,403
2,446
1,980
3,501
4,684
5,243
6,426
6,816
2,861
Sales/Revenue/Turnover
7.4
6.83
7.73
7.61
-2.21
2.5
4.19
5.69
7.55
4.95
8.74
Operating Margin (%)
64
78
81
104
120
213
305
339
401
433
- -
Depreciation Expense
128
85
156
160
75
88
192
198
389
281
177
Net Income, GAAP
- -
34.48
21.18
13.33
- -
34.27
30.79
32.23
24.4
27.33
25.44
Effective Tax Rate (%)
7.08
4.04
6.48
6.52
3.79
2.53
4.09
3.78
6.06
4.12
6.2
Profit Margin (%)
346
425
306
266
418
321
468
931
1,482
1,993
1,195
Working Capital
546
613
358
138
1,379
1,443
1,351
1,550
1,474
2,882
1,547
LT Debt
200
256
408
826
845
913
1,235
1,706
2,424
3,556
2,081
Total Equity
- -
8.84
12.2
11.3
- -
1.67
3.59
4.54
7.21
3.54
4.04
Return on Invested Capital (%)
- -
15.71
17.36
13.18
- -
3.27
6.05
5.94
9.73
6.01
4.98
Return on Capital (%)
- -
- -
- -
30.19
10.69
11.47
21.32
17.33
25.92
15.22
14.44
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Mar'24
Jun'25
Sep'25
ST Debt
1,505
- -
1,478
LT Borrowings
1,421
- -
1,443
LT Finance Leases
129
- -
104
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
2
- -
2
Market Capitalization
1,998
2,347
1,754

Working Capital

FRC

•

in mil. unless spec.
Mar'24
Jun'25
Sep'25
Total Current Assets
3,352
- -
3,734
Cash, Cash Equivalents & STI
996
- -
1,043
Accounts Receivable, Net
846
- -
935
Inventories
1,194
- -
1,532
Total Current Liabilities
2,421
- -
2,540
Payables & Accruals
- -
- -
- -
ST Debt
1,505
- -
1,478
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
34.05%
46.73%
Free Cash Flow
- -
-36.36%
229.62%
Net Income, GAAP
- -
41.3%
-27.88%
Sales/Revenue/Turnover
- -
30.23%
6.07%
Total Cash Common Dividend
- -
- -
46.84%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,180
1,202
1,348
1,513
5,243
2025
- -
- -
- -
- -
6,426
2026
- -
- -
- -
- -
6,816

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
23.2
- -
- -
- -
119.04
2025
- -
- -
- -
- -
188.14
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
12.43
2025
- -
- -
- -
- -
11.81
2026
- -
- -
- -
- -
- -
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Business
STG Co., Ltd. (TSE: 5858) manufactures and sells precision metal stamping parts and electronic components primarily for the automotive, semiconductor, and consumer electronics industries. The company offers core products and services including high-precision press parts such as busbars for electric vehicles, lead frames for semiconductors, and connectors; surface treatment services like plating and coating; and assembly solutions for electronic modules. It operates production facilities in Japan, Thailand, Vietnam, and China, serving major global OEMs and tier-one suppliers in Asia, North America, and Europe. Founded in 1955 and headquartered in Tokyo, Japan, STG focuses on advanced manufacturing technologies to support electrification and miniaturization trends in its target markets. In 2024, the company expanded its EV busbar production capacity through a new facility in Thailand and formed a strategic partnership with a leading semiconductor equipment maker to enhance lead frame capabilities; additionally, it completed a JPY 2 billion funding round for automation upgrades and acquired a small precision stamping firm in Vietnam to bolster regional supply chain resilience.