Bomin Electronics Co., Ltd.

Bomin Electronics Co., Ltd.

603936.SS
Bomin Electronics Co., Ltd.CN flagShanghai Stock Exchange
21.13
CNY
-1.65
- -
13.64BMarket Cap
Bomin Electronics Co., Ltd.
603936.SS
(Shanghai Stock Exchange)

Recent

price

21.13

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
3.02
3.39
4.19
4.29
4.6
4.13
5.37
5.13
6.09
6.18
6.95
5.73
4.89
5.26
5.46
5.06
Revenue per Share
0.21
0.3
0.3
0.28
0.25
0.16
0.2
0.33
0.46
0.55
0.48
0.16
-0.95
-0.38
0.01
-0.37
Basic EPS, GAAP
0.03
0.12
-0.4
-0.02
-0.63
-0.44
0.07
0.04
0.12
-0.52
-0.72
-1.16
-1.62
-1.5
-0.93
-1.65
Free Cash Flow per Basic Share
0.04
0.04
0.05
0.06
0.05
0.06
0.08
0.09
0.13
0.13
0.13
0.13
0.14
0.15
0.14
0.13
Dividend per Share
0.94
1.19
1.49
1.7
2.09
1.69
1.82
2.01
2.34
3.2
3.26
3.35
2.09
1.59
1.52
1.49
Book Value per Share
1.29
1.45
1.79
2.02
3.49
2.76
2.93
3.17
3.19
5.27
4.78
4.97
6.55
5.86
5.61
5.47
Tangible Book Value per Share
241
246
239
246
246
327
328
380
438
450
506
506
596
621
661
683
Basic Weighted Avg Shares
727
833
1,002
1,054
1,130
1,351
1,760
1,949
2,669
2,786
3,521
2,898
2,913
3,266
3,612
3,459
Sales/Revenue/Turnover
9.15
11.97
9.64
8.18
7.14
4.69
6.53
7.42
10.42
12.43
10.58
6.79
-0.99
-1.89
3.71
-2.46
Operating Margin (%)
31
39
52
65
82
90
106
128
145
155
195
232
258
301
347
- -
Depreciation Expense
51
73
71
69
61
53
65
125
202
248
243
81
-566
-236
7
-253
Net Income, GAAP
13.06
13.1
11.75
8.09
13.99
5.26
7.8
6.95
12.75
12.79
9.75
12.15
- -
- -
56.86
7.85
Effective Tax Rate (%)
7.06
8.78
7.1
6.57
5.39
3.95
3.71
6.4
7.55
8.89
6.9
2.79
-19.42
-7.22
0.18
-7.32
Profit Margin (%)
8
-77
-115
-211
95
-90
-97
-6
252
933
292
-7
808
247
-190
244
Working Capital
8
1
45
42
57
50
50
50
191
289
290
621
900
1,281
1,638
1,666
LT Debt
314
387
459
528
889
934
990
2,274
2,466
3,503
3,634
3,687
4,565
4,265
4,334
4,366
Total Equity
- -
18.49
14.5
11.18
7.32
5.09
8.33
6.63
8.15
8.01
7.43
3.42
- -
- -
0.78
- -
Return on Invested Capital (%)
- -
22.14
16.24
13.63
10.95
8.25
9.44
13.51
15.54
13.99
10.93
3.93
- -
- -
0.9
-1.38
Return on Capital (%)
- -
28.21
21.93
17.88
13.08
10.02
11.35
18.35
22.54
20.1
15.74
4.84
-38.48
-21.13
0.66
-22.07
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
1,497
1,424
1,492
LT Borrowings
1,274
1,590
1,665
LT Finance Leases
7
3
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
630
630
630
Market Capitalization
5,503
5,383
6,442

Working Capital

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
3,552
3,513
3,609
Cash, Cash Equivalents & STI
814
865
1,009
Accounts Receivable, Net
1,327
1,242
1,451
Inventories
541
568
584
Total Current Liabilities
3,305
3,168
3,365
Payables & Accruals
- -
- -
- -
ST Debt
1,497
1,424
1,492
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
21.52%
4.81%
1.62%
Free Cash Flow
-30.04%
28.65%
-34.08%
Net Income, GAAP
-84.32%
-205.74%
-102.8%
Sales/Revenue/Turnover
13.38%
6.39%
10.59%
Total Cash Common Dividend
23.95%
9.74%
-2.11%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
719
793
825
928
3,266
2025
823
882
1,020
- -
3,612
2026
818
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.04
- -
- -
- -
-0.38
2025
0.04
- -
- -
- -
0.01
2026
-0.02
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
- -
- -
- -
0.15
2025
0.03
- -
- -
- -
0.14
2026
0.04
- -
- -
- -
- -
Business
Bomin Electronics Co., Ltd. engages in the research, development, production, and sale of high-end printed circuit boards (PCBs), specializing in HDI (high density interconnect) boards, high multilayer boards, microwave high-frequency boards, heavy copper boards, metal base/core boards, flexible boards, rigid-flex boards, ceramic substrates, and passive devices. Its products serve a wide range of high-technology fields including communication apparatus, medical devices, detection systems, aerospace, household electronics, new energy vehicles, 5G communication, servers, MiniLED technology, industrial control, and other emerging tech markets. The company integrates comprehensive one-stop services around "PCB + components + solutions" and operates major production bases in Shenzhen, Meizhou, and Jiangsu, China. Founded in 1994 and headquartered in Meizhou, Bomin Electronics has advanced its manufacturing through digital intelligent factory projects focusing on high-level HDI and IC substrate boards, deploying cutting-edge equipment from Germany, Israel, and Taiwan to ensure product quality and innovation. In recent years, Bomin Electronics has undertaken significant strategic initiatives including the acquisition of an 86.85% stake in Meizhou Benchuang Electronics Co., Ltd. for approximately CNY 250 million in 2024, enhancing its market position and product portfolio. In August 2022, the company launched Phase II of a digital intelligent factory project aimed at expanding high-level HDI and SLP IC substrate production capabilities with a focus on markets such as 5G, big data, AI, and industrial Internet. It continues to invest in advanced manufacturing automation and testing technologies to maintain its competitive edge and meet evolving industry demands. The company actively participates in industry exhibitions and emphasizes high-reliability manufacturing, especially in high-frequency and high-speed technology segments. These developments aim to strengthen Bomin's footprint across both domestic and international high-tech sectors. Bomin Electronics serves diverse customers in telecommunications, aerospace, medical devices, automotive electronics, industrial control, and new energy sectors. Its comprehensive product range and innovation-driven approach position it as a key player in the global PCB market. The company remains focused on digital transformation, operational excellence, and strategic acquisitions to drive growth in an increasingly technology-centric industry environment.