- Business
- Disco Corporation (6146.T), founded in 1937 and headquartered in Ota-ku, Tokyo, Japan, manufactures and sells precision cutting, grinding, and polishing machines; dicing saws; laser saws; grinders; polishers; wafer mounters; die separators; surface planers; waterjet saws; and related accessory equipment for the semiconductor and electronic components industries worldwide, with primary operations in Japan, Asia, Europe, and the Americas. The company also provides precision processing tools including dicing blades, grinding wheels, dry polishing wheels, and diamond abrasives; maintenance, disassembly, and recycling services for its equipment; training programs; dicing and grinding processing services; and leases precision machines while trading used equipment. In March 2025, Disco Corporation acquired fixed assets comprising land and buildings in Ota-ku, Tokyo, for approximately JPY 50 billion to bolster its research and development capabilities amid rising semiconductor demand; earlier in 2025, it collaborated with Xanadu on advanced wafer processing technologies for photonic quantum computing.