HG Semiconductor Limited

HG Semiconductor Limited

6908.HK
HG Semiconductor LimitedHK flagHong Kong Stock Exchange
0.38
HKD
- -
- -
350.46MMarket Cap
HG Semiconductor Limited
6908.HK
(Hong Kong Stock Exchange)

Recent

price

0.38

P/E

ratio

- -

div

yld

- -

ROIC.AI

2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.26
0.38
0.45
0.28
0.49
0.58
0.29
0.25
0.15
0.13
0.09
0.11
0.58
Revenue per Share
0.01
0.02
0.02
0.03
0.06
0.04
0.01
-0.89
-0.17
-0.23
-0.2
-0.12
0.04
Basic EPS, GAAP
-0.04
0.06
-0.03
-0.06
0.11
-0.07
-0.07
-0.14
-0.28
-0.2
-0.1
-0.08
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
0.07
0.07
0.1
0.01
0.15
0.18
0.01
-0.73
-0.78
-0.78
-0.76
-0.77
0.18
Book Value per Share
0.1
0.17
0.35
0.29
0.36
0.4
0.41
1.08
0.91
1.08
0.73
0.55
0.4
Tangible Book Value per Share
417
312
313
417
417
417
417
505
592
664
796
925
417
Basic Weighted Avg Shares
110
119
142
117
204
243
122
126
88
89
75
98
243
Sales/Revenue/Turnover
10.59
11.58
9.64
11.43
14.21
9.4
5.63
-57.46
-114.36
-103.37
-197.06
-130.28
9.4
Operating Margin (%)
2
2
3
4
4
5
7
9
13
19
17
23
- -
Depreciation Expense
5
8
6
13
24
17
5
-447
-101
-151
-157
-113
17
Net Income, GAAP
31.25
37.19
54.75
4.9
17.7
25.13
28.64
- -
- -
- -
- -
- -
25.13
Effective Tax Rate (%)
4.91
6.52
4.15
10.99
11.73
7.1
3.74
-354.24
-115.73
-170.12
-208.31
-115.48
7.1
Profit Margin (%)
23
36
96
104
130
136
136
276
189
284
203
181
136
Working Capital
- -
- -
- -
- -
- -
2
1
18
11
5
4
4
2
LT Debt
42
53
115
126
150
168
172
609
610
721
578
505
168
Total Equity
- -
12.97
6.37
9.91
17.16
10.03
2.58
- -
- -
- -
- -
- -
10.03
Return on Invested Capital (%)
- -
23.06
16.38
53.46
73.06
22.81
9.19
- -
- -
- -
- -
- -
22.81
Return on Capital (%)
- -
30.99
22.25
75.89
73.06
25.1
11.49
-10,492.57
- -
- -
- -
- -
25.1
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Jun'19
Sep'19
Dec'19
ST Debt
7
- -
15
LT Borrowings
- -
- -
- -
LT Finance Leases
2
- -
2
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
417
- -
417
Market Capitalization
249
311
253

Working Capital

FRC

in mil. unless spec.
Jun'19
Sep'19
Dec'19
Total Current Assets
167
- -
212
Cash, Cash Equivalents & STI
58
- -
43
Accounts Receivable, Net
72
- -
132
Inventories
21
- -
23
Total Current Liabilities
38
- -
76
Payables & Accruals
- -
- -
- -
ST Debt
7
- -
15
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
39.87%
47.94%
-12.64%
Free Cash Flow
-18.83%
39.94%
-11.35%
Net Income, GAAP
-986.58%
-1,988.97%
-28.01%
Sales/Revenue/Turnover
3.48%
-2.23%
29.86%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
89
2024
- -
- -
- -
- -
75
2025
- -
- -
- -
- -
98

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
-0.23
2024
- -
- -
- -
- -
-0.2
2025
- -
- -
- -
- -
-0.12

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
Business
HG Semiconductor Limited operates as an investment holding company, primarily involved in the design, development, manufacturing, and distribution of semiconductor products. The company focuses on light-emitting diode (LED) components, including various LED beads and related lighting goods. Concurrently, it has strategically expanded into advanced third-generation semiconductor technologies, particularly Gallium Nitride (GaN)-based components and fast charging solutions. These offerings cater to a diverse array of sectors, spanning consumer electronics, automotive applications, data centers, and renewable energy, alongside traditional customers in LED module and LCD panel manufacturing. The firm also offers subcontracting services within the semiconductor industry. Formerly known as HongGuang Lighting Holdings Company Limited, the entity adopted the name HG Semiconductor Limited in September 2021, reflecting its strategic pivot towards cutting-edge semiconductor materials. Headquartered in Zhuhai, People's Republic of China, the company was established in 2010.