1. Taiwan, Province of China Stocks

  2. •

    Technology

  3. •

    Semiconductors
ChipMOS TECHNOLOGIES Inc.

ChipMOS TECHNOLOGIES Inc.

8150.TW
ChipMOS TECHNOLOGIES Inc.TW flagTaiwan Stock Exchange
106.50
TWD
-2.50
- -
74.06BMarket Cap
ChipMOS TECHNOLOGIES Inc.
8150.TW
(Taiwan Stock Exchange)

Recent

price

106.50

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
25.46
26.82
27.06
28.54
25.26
21.39
24.9
22.95
27.97
31.64
37.7
32.34
29.37
31.21
33.69
36.12
Revenue per Share
0.51
1.62
3.25
4.6
2.86
1.99
3.88
1.65
3.45
3.27
6.79
4.73
2.71
1.98
0.78
1.25
Basic EPS, GAAP
2.42
3.2
3.51
3.4
1.3
-0.91
-0.73
-0.03
0.75
2.72
1.98
5.39
4.86
1.18
0.2
2.7
Free Cash Flow per Basic Share
0.2
- -
0.59
0.67
1.13
2.09
0.36
0.32
1.2
1.8
2.2
4.3
2.3
1.8
1.23
- -
Dividend per Share
14.37
15.82
18.3
20.95
19.6
10.62
16.21
13.82
16.4
17.43
21.73
21.7
21.63
21.61
20.88
21.87
Book Value per Share
19.49
22.13
25.09
28.51
28.21
18.9
25.15
22.38
26.86
28.49
33.21
33.88
34.05
34.38
33.76
35.08
Tangible Book Value per Share
715
717
715
730
746
860
721
805
727
727
727
727
727
727
710
701
Basic Weighted Avg Shares
18,211
19,221
19,362
20,829
18,837
18,388
17,941
18,480
20,338
23,011
27,400
23,517
21,356
22,696
23,933
25,336
Sales/Revenue/Turnover
2.86
7.31
10.98
17.11
13.94
10.6
8.73
10.79
11.7
14.97
20.08
13.68
8.94
5.61
4.77
6.1
Operating Margin (%)
5,786
4,635
3,295
2,909
3,022
3,231
2,899
3,377
3,732
4,176
4,634
4,752
4,779
4,856
5,101
1,246
Depreciation Expense
362
1,164
2,323
3,356
2,130
1,707
2,797
1,326
2,509
2,379
4,937
3,440
1,968
1,440
551
879
Net Income, GAAP
17.95
9.67
19.36
22.03
32.88
10.42
35.92
25.62
17
19.99
18.2
14.6
13.26
12.6
6.79
18.12
Effective Tax Rate (%)
1.99
6.05
12
16.11
11.31
9.28
15.59
7.17
12.33
10.34
18.02
14.63
9.21
6.34
2.3
3.47
Profit Margin (%)
7,024
8,930
9,631
12,166
11,722
12,206
7,258
6,648
6,743
6,630
7,114
11,863
17,722
14,904
14,666
14,353
Working Capital
8,484
6,740
3,889
4,560
4,986
9,717
7,517
9,042
8,962
7,723
10,048
13,204
13,462
11,254
10,608
9,963
LT Debt
13,952
15,858
17,947
20,806
21,034
16,248
18,121
18,021
19,531
20,716
24,142
24,639
24,763
25,003
23,987
24,607
Total Equity
- -
5.19
6.74
10.07
6.01
6.2
3.57
5.17
6.8
9.26
13.62
7.22
4.08
2.73
2.64
6.22
Return on Invested Capital (%)
- -
5.65
9.02
12.52
9.84
9.66
13.82
6.65
12.44
11.69
20.95
12.4
7.05
5.38
2.68
6.51
Return on Capital (%)
- -
10.77
19.02
23.65
14.24
14.38
26.88
11.62
21.76
19.34
34.69
21.79
12.49
9.16
3.6
11.46
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
5,631
5,719
5,856
LT Borrowings
9,151
9,868
9,181
LT Finance Leases
758
740
782
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
697
700
695
Market Capitalization
21,211
33,438
37,600

Working Capital

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
23,067
25,147
24,339
Cash, Cash Equivalents & STI
13,089
14,978
12,485
Accounts Receivable, Net
6,100
6,043
6,643
Inventories
3,301
3,357
4,519
Total Current Liabilities
9,324
10,481
9,986
Payables & Accruals
3,590
4,647
3,916
ST Debt
5,631
5,719
5,856
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
1.87%
3.2%
-4.06%
Free Cash Flow
-233.36%
-4.71%
-83.1%
Net Income, GAAP
2.12%
-10.84%
-61.75%
Sales/Revenue/Turnover
2.88%
1.49%
5.45%
Total Cash Common Dividend
33.35%
3.22%
-33.33%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
6,068
5,400
- -
22,696
2025
5,532
203
6,144
12,053
23,933
2026
6,936
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.41
0.35
- -
1.98
2025
0.24
- -
0.5
1.05
0.78
2026
0.72
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1.8
2025
- -
- -
- -
- -
1.23
2026
- -
- -
- -
- -
- -
Similar Companies
Suzhou Novosense Microelectronics Co., Ltd. (2676.HK)
NeoMagic Corporation (NMGC)
Applied Materials, Inc. (AMAT)
Winbond Electronics Corporation (2344.TW)
Advanced Systems Automation Limited (WJ9.SI)
Hangzhou Changchuan Technology Co.,Ltd (300604.SZ)
Business
ChipMOS TECHNOLOGIES INC. (TWSE: 8150) provides outsourced semiconductor assembly and test services, specializing in back-end processing for liquid crystal display drivers, high-density memory, and mixed-signal semiconductors. The company offers comprehensive testing services including wafer probing, final test, and system-level test; assembly services encompassing leadframe-based and organic substrate-based packaging such as flip chip, wirebonding, wafer-level chip scale packaging, chip-on-film, and chip-on-glass; bumping services featuring gold bumping for display driver interconnects; and turnkey solutions from package design to drop-shipment. Its products serve diverse end markets including consumer electronics, personal computers, communications equipment, office automation, drones, virtual reality, and assisted reality, with operations centered in Taiwan's Hsinchu Science Park for testing, Southern Taiwan Science Park for packaging, and Chupei, Hsinchu for bumping. Founded in 1997 and headquartered in Hsinchu City, Taiwan, ChipMOS maintains state-of-the-art facilities and collaborates closely with fabless companies, integrated device manufacturers, and foundries worldwide. Recent developments include a NT$525 million share repurchase program announced in September 2025 with tranche updates through October 2025; divestiture by its subsidiary ChipMOS BVI of a 45% stake in Unimos Microelectronics (Shanghai) Co., Ltd. in December 2023 for RMB 979.3 million; and revenue growth in second-quarter 2025 to NT$5.74 billion driven by rising memory demand and market price increases, alongside monitoring of U.S. tariff impacts.