1. Taiwan, Province of China Stocks

  2. •

    Technology

  3. •

    Computer Hardware
Chenbro Micom Co., Ltd.

Chenbro Micom Co., Ltd.

8210.TW
Chenbro Micom Co., Ltd.TW flagTaiwan Stock Exchange
1,195.00
TWD
+20.00
- -
148.82BMarket Cap
Chenbro Micom Co., Ltd.
8210.TW
(Taiwan Stock Exchange)

Recent

price

1,195.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
34.42
32.85
33.01
31.02
37.36
37.08
43.52
46.05
54.46
57.09
63.02
78.63
87.94
93.54
120.51
- -
135.43
Revenue per Share
3.55
3.7
3.98
2.85
4.52
4.22
5.01
3.8
5.37
7.62
8.16
5.62
8.32
9.03
16.05
- -
21.26
Basic EPS, GAAP
3.39
3.77
5.55
-2.23
4.38
1.9
2.84
1.2
6.5
8.41
-9.32
-13.09
-3.36
18.95
15.8
- -
16.11
Free Cash Flow per Basic Share
2.32
2.31
2.4
2.5
2.5
3
2.6
3
3
4
4.6
4.04
3.02
4.01
5.01
- -
- -
Dividend per Share
13.19
13.94
15.37
18.53
17.09
17.83
19.72
19.37
21.09
23.84
26.63
27.09
31.7
36.58
46.74
- -
68.35
Book Value per Share
14.22
17.03
18.28
19.15
21.6
22.53
23.78
24.32
26.34
29.31
32.89
34.69
40.94
45.8
59.77
- -
91.35
Tangible Book Value per Share
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
- -
121
Basic Weighted Avg Shares
4,116
3,946
3,966
3,724
4,473
4,439
5,210
5,514
6,521
6,835
7,545
9,423
10,558
11,247
14,517
22,001
16,337
Sales/Revenue/Turnover
12.86
12.07
14.49
11.3
14.58
13.36
14.94
12.39
12.64
16.51
12.78
9.37
10.91
12.9
17.26
21.7
21.29
Operating Margin (%)
140
130
122
126
135
137
115
140
191
201
222
338
377
298
346
387
287
Depreciation Expense
425
445
478
342
541
505
600
455
642
912
977
673
999
1,085
1,934
3,558
2,565
Net Income, GAAP
14.11
20.08
19.46
24.86
23.75
24.07
26.47
25.97
26.23
20.93
19.08
24.15
24.89
22.56
24.48
24.24
24.5
Effective Tax Rate (%)
10.32
11.27
12.06
9.18
12.1
11.37
11.52
8.26
9.85
13.34
12.95
7.14
9.46
9.65
13.32
16.17
15.7
Profit Margin (%)
936
1,280
1,521
1,185
1,411
1,436
1,328
1,267
1,259
1,670
613
1,448
2,235
2,905
3,953
5,670
5,670
Working Capital
- -
- -
- -
157
161
160
150
132
129
120
131
1,983
2,662
2,704
2,674
1,357
1,357
LT Debt
1,773
2,052
2,202
2,307
2,599
2,708
2,857
2,919
3,165
3,520
3,950
4,177
4,937
5,578
7,264
11,077
11,077
Total Equity
22.7
17.88
20.5
12.65
17.1
14.68
18.35
15.26
17.13
23.55
17.45
10.74
10.31
11.97
18.38
27.78
20.17
Return on Invested Capital (%)
24.98
25.22
26.29
15.51
21.92
21.08
24.08
17.24
22.87
30.79
27.28
12.91
14.15
14.03
22.49
33.84
24.5
Return on Capital (%)
27.94
27.34
27.16
16.79
25.35
24.15
26.7
19.46
26.52
33.91
32.33
20.91
28.32
26.46
38.56
51.29
36.97
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Jun'25
Sep'25
Dec'25
ST Debt
1,268
- -
1,598
LT Borrowings
2,459
- -
1,332
LT Finance Leases
27
- -
25
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
121
122
125
Market Capitalization
58,733
71,410
121,228

Working Capital

FRC

•

in mil. unless spec.
Jun'25
Sep'25
Dec'25
Total Current Assets
12,887
- -
16,583
Cash, Cash Equivalents & STI
5,275
- -
5,912
Accounts Receivable, Net
4,650
- -
6,424
Inventories
2,685
- -
3,925
Total Current Liabilities
9,235
- -
10,914
Payables & Accruals
- -
- -
- -
ST Debt
1,268
- -
1,598
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
15.92%
23.93%
52.49%
Free Cash Flow
-45.34%
-141.05%
10.2%
Net Income, GAAP
27.3%
37.63%
84.03%
Sales/Revenue/Turnover
18.07%
24.82%
51.55%
Total Cash Common Dividend
- -
14.27%
50.5%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
1,647
2,514
2,357
4,729
11,247
2024
2,773
3,607
4,272
3,865
14,517
2025
4,154
5,443
- -
6,740
22,001

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
0.23
2.07
2.08
- -
9.03
2024
3.03
3.77
5.34
- -
16.05
2025
5.53
6.87
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
4.01
2024
- -
- -
- -
- -
5.01
2025
- -
- -
- -
- -
- -
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Business
Chenbro Micom Co., Ltd. engages in the research and development, design, manufacture, processing, and trading of computer peripherals and system expendables globally, with operations in the United States, China, Taiwan, Singapore, Malaysia, and other international markets. The company specializes in manufacturing barebone servers; rackmount, tower server, and PC chassis products; and storage expansion kits. It also provides OEM, ODM, and JDM services, and is involved in software design activities related to computer products and peripherals. Founded in 1983 and headquartered in New Taipei City, Taiwan, Chenbro serves industries focused on cloud computing, 5G, artificial intelligence (AI), and AIoT through integrated enclosure solutions. Recently, Chenbro has expanded its global manufacturing footprint with a new production plant in Senai Airport City, Malaysia, marking its maiden investment in the ASEAN region to serve Southeast Asia more effectively. This expansion aligns with its strategy to support increasing demand for AI and ICT infrastructure and to diversify its manufacturing base amid geopolitical challenges. In 2024, Chenbro reported a 29% revenue increase to approximately NT$145.2 billion (US$4.41 billion), driven by robust demand for AI server enclosures. The company has also co-developed cloud server products and advanced AI server enclosure solutions in collaboration with leading technology partners from the U.S. and Taiwan, highlighting its commitment to innovation in high-speed computing and storage server modules. Chenbro markets rack-mounted edge computing server chassis, tower modular high-speed computing storage servers, high-speed storage server modules, and rack-mounted modular barebone servers worldwide. Its latest strategic initiatives include creating global localized production with lean technology capabilities and accelerating deployment in key international industrial clusters. With over 1,000 employees, Chenbro stands as a leading provider of mechanical and system solutions for the cloud industry, focusing on scalable, high-performance infrastructure products designed for data centers and AI applications.