BE Semiconductor Industries N.V.
BESI.AS
Euronext Amsterdam258.10
EUR
-15.00
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BE Semiconductor Industries N.V.
BESI.AS
(Euronext Amsterdam)
Recent
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258.10
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ROIC.AI
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in mil. unless spec.- Similar Companies
- Business
- BE Semiconductor Industries N.V. (Besi) develops, manufactures, markets, sells and services semiconductor assembly equipment for leadframe, substrate and wafer level packaging applications serving the global semiconductor and electronics industries. The company offers die attach equipment including single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding systems and die sorting systems; packaging equipment encompassing conventional, ultra thin and wafer level molding, trim and form, and singulation systems under the Fico brand; plating equipment such as tin, copper, precious metal and solar plating systems together with related process chemicals; and services comprising tooling, conversion kits, spare parts and other support for its installed customer base. Besi operates through three segments--Die Attach, Packaging, and Plating--and supplies multinational chip manufacturers, assembly subcontractors, electronics and industrial companies with high accuracy, reliability and throughput equipment at low cost of ownership targeting end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy. Founded in 1995 and headquartered in Duiven, the Netherlands, Besi maintains a global presence with eight development and production facilities across Asia and Europe plus 13 sales and service offices in Europe, Asia and North America; approximately 66% of its 1,870 employees as of end-2023 are based in Asia. Principal brand names include Datacon, Esec, Fico and Meco. In recent developments, Besi reports sequential Q2-25 revenue growth of 2.8% to €148.1 million driven by higher die attach shipments for computing alongside increased hybrid bonding demand, completes its €100 million share repurchase program in October 2025 and initiates a new €60 million buyback, and anticipates significant Q3-25 order increases for hybrid bonding systems and die attach for AI-related 2.5D computing including shipments of its advanced TCB Next system in Q4-25 amid expanded capex by industry leaders for AI infrastructure, co-packaged optics and HBM4 memory.