1. Taiwan, Province of China Stocks

  2. •

    Technology

  3. •

    Semiconductors
ChipMOS TECHNOLOGIES Inc.

ChipMOS TECHNOLOGIES Inc.

CPIA.F
ChipMOS TECHNOLOGIES Inc.undefined flagFrankfurt Stock Exchange
61.50
EUR
- -
- -
2.15BMarket Cap
ChipMOS TECHNOLOGIES Inc.
CPIA.F
(Frankfurt Stock Exchange)

Recent

price

61.50

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
509.18
536.34
541.27
570.78
570.78
505.2
427.8
497.99
459.04
559.42
632.84
753.91
647.21
587.32
624.17
673.74
722.36
Revenue per Share
10.12
32.47
64.95
91.97
91.97
57.13
39.72
77.63
32.93
69
65.42
135.85
94.66
54.11
39.59
15.5
25.07
Basic EPS, GAAP
48.39
64.03
70.2
67.99
67.99
25.95
-18.23
-14.58
-0.62
14.9
54.43
39.57
107.8
97.18
23.64
4.09
53.91
Free Cash Flow per Basic Share
3.9
- -
11.78
13.48
13.48
22.53
41.7
7.13
6.38
24.01
36
44.02
86.06
46
36
24.57
- -
Dividend per Share
287.47
316.33
366
419.07
419.07
392.1
212.43
324.17
276.5
327.97
348.55
434.58
434.26
432.54
432.22
417.67
437.46
Book Value per Share
389.82
442.52
501.71
570.15
570.15
564.13
378.01
502.98
447.64
537.21
569.71
664.27
678.1
681.02
687.62
675.27
701.58
Tangible Book Value per Share
36
36
36
36
36
37
43
36
40
36
36
36
36
36
36
36
35
Basic Weighted Avg Shares
18,211
19,221
19,362
20,829
20,829
18,837
18,388
17,941
18,480
20,338
23,011
27,400
23,517
21,356
22,696
23,933
25,336
Sales/Revenue/Turnover
2.86
7.31
10.98
17.11
17.11
13.94
10.6
8.73
10.79
11.7
14.97
20.08
13.68
8.94
5.61
4.77
6.1
Operating Margin (%)
5,786
4,635
3,295
2,909
2,909
3,022
3,231
2,899
3,377
3,732
4,176
4,634
4,752
4,779
4,856
5,101
1,246
Depreciation Expense
362
1,164
2,323
3,356
3,356
2,130
1,707
2,797
1,326
2,509
2,379
4,937
3,440
1,968
1,440
551
879
Net Income, GAAP
17.95
9.67
19.36
22.03
22.03
32.88
10.42
35.92
25.62
17
19.99
18.2
14.6
13.26
12.6
6.79
18.12
Effective Tax Rate (%)
1.99
6.05
12
16.11
16.11
11.31
9.28
15.59
7.17
12.33
10.34
18.02
14.63
9.21
6.34
2.3
3.47
Profit Margin (%)
7,024
8,930
9,631
12,166
12,166
11,722
12,206
7,258
6,648
6,743
6,630
7,114
11,863
17,722
14,904
14,666
14,353
Working Capital
8,484
6,740
3,889
4,560
4,560
4,986
9,717
7,517
9,042
8,962
7,723
10,048
13,204
13,462
11,254
10,608
9,963
LT Debt
13,952
15,858
17,947
20,806
20,806
21,034
16,248
18,121
18,021
19,531
20,716
24,142
24,639
24,763
25,003
23,987
24,607
Total Equity
- -
5.19
6.74
10.07
10.07
6.01
6.2
3.57
5.17
6.8
9.26
13.62
7.22
4.08
2.73
2.64
6.22
Return on Invested Capital (%)
- -
5.65
9.02
12.52
12.52
9.84
9.66
13.82
6.65
12.44
11.69
20.95
12.4
7.05
5.38
2.68
6.51
Return on Capital (%)
- -
10.77
19.02
23.65
23.65
14.24
14.38
26.88
11.62
21.76
19.34
34.69
21.79
12.49
9.16
3.6
11.46
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
5,631
5,719
5,856
LT Borrowings
9,151
9,868
9,181
LT Finance Leases
758
740
782
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
697
700
695
Market Capitalization
662
1,008
1,216

Working Capital

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
23,067
25,147
24,339
Cash, Cash Equivalents & STI
13,089
14,978
12,485
Accounts Receivable, Net
6,100
6,043
6,643
Inventories
3,301
3,357
4,519
Total Current Liabilities
9,324
10,481
9,986
Payables & Accruals
3,590
4,647
3,916
ST Debt
5,631
5,719
5,856
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
1.87%
3.2%
-4.06%
Free Cash Flow
-233.36%
-4.71%
-83.1%
Net Income, GAAP
2.12%
-10.84%
-61.75%
Sales/Revenue/Turnover
2.88%
1.49%
5.45%
Total Cash Common Dividend
33.35%
3.22%
-33.33%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
6,068
5,400
- -
22,696
2025
5,532
203
6,144
12,053
23,933
2026
6,936
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
8.23
6.92
- -
39.59
2025
4.88
- -
9.97
20.97
15.5
2026
14.43
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
36
2025
- -
- -
- -
- -
24.57
2026
- -
- -
- -
- -
- -
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Business
ChipMOS TECHNOLOGIES Inc. specializes in outsourced semiconductor assembly and test services, offering a comprehensive range of back-end testing and packaging solutions for integrated circuits. Its core products include back-end testing for liquid crystal display (LCD) drivers, high-density memory, mixed-signal semiconductors, multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging, chip on film (COF), wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. These products and services serve diverse applications including consumer electronics, personal computers, communications equipment, automotive, wearable devices, drones, virtual reality, and assisted reality. The company also provides turnkey solutions, leadframe-based and organic substrate-based package assembly, gold bumping services, and advanced technical support including package design, failure analysis, and reliability testing. Founded in 1997 and headquartered in Hsinchu, Taiwan, ChipMOS operates primarily in Taiwan with facilities in Hsinchu Science Park and Southern Taiwan Science Park, servicing a global clientele including fabless semiconductor companies, integrated device manufacturers, and independent foundries. It extends operations and market presence across Asia and the Americas. Recent major developments include a notable strategic divestment in late 2023 with the sale of a significant equity interest in Unimos Microelectronics (Shanghai). In 2024 and 2025, ChipMOS has focused on capacity expansions and technological innovation, investing over $25 million in research and development to enhance packaging solutions for high-performance memory devices, contributing to 35% of revenue from new technologies. The company reported a 22% year-over-year increase in revenue for October 2025 and continues to achieve growth in the semiconductor testing and packaging market. Its strategic focus emphasizes advanced memory and OLED driver IC testing, reliability analysis, and continued collaboration with customers to align technology roadmaps with production readiness. Overall, ChipMOS TECHNOLOGIES maintains a strong market position as a leading provider of semiconductor testing and assembly services, leveraging advanced technology investments, global operational facilities, and a commitment to supporting the evolving needs of the semiconductor industry. This description integrates the core products, services, geographic scope, founding details, and highlights recent financial and strategic developments up to late 2025.