- Business
- Hana Microelectronics Public Company Limited (HANA-R.BK), founded in 1978 and headquartered in Bangkok, Thailand, manufactures and trades electronic components, sub-assemblies, and small finished products as a leading independent electronics manufacturing services (EMS) and outsourced semiconductor assembly and test (OSAT) provider in Southeast Asia. The company produces printed circuit board assemblies (PCBA), chip-on-board (COB) and chip-on-flex assembly and test, lamination, coil winding, integrated circuit (IC) assemblies and tests including IC, MEMS, sensors, TO Can, system-in-packages (SIP), and optocouplers, LED packaging and test, liquid crystal microdisplays (LCOS), radio frequency identification (RFID) devices, surface-mount technology (SMT) and labor-intensive microelectronics assemblies, and IC power management silicon and silicon carbide (SiC) wafer devices such as QFN&DFN, SC70, MSOP, SOT23/TSOT23, and SC82; it serves industries including telecommunications, automotive, computing, mobile, medical, RFID, industrial, consumer electronics, and test/measurement through seven wholly-owned manufacturing facilities in Thailand (Lamphun, Ayutthaya), China (Jiaxing), USA, Cambodia, and Korea. Hana Microelectronics operates internationally in markets including the United States, Singapore, Malaysia, China, Bulgaria, Taiwan, and others, employing over 9,300 people with manufacturing floor space exceeding 1.1 million square feet and adherence to standards such as ISO 9001, IATF 16949, ISO 13485, ISO 14001, ISO 45001, and ISO 27001. Recent developments include a 30% stake acquisition in Edelteq Ventures Sdn Bhd via Share Purchase Agreement, multiple private placements of newly issued ordinary shares under general mandate including in October 2023 with subsequent paid-up capital registration and fund utilization reports through 2025, establishment of subsidiary FT1 Corporation Limited in February 2024, capital decreases and increases for private placements approved in early 2023 and utilized ongoing, interim dividend payments through November 2024, and a change in chief accountant announced in December 2024.