SENASIC Electronics Technology Co., Ltd. Class H

SENASIC Electronics Technology Co., Ltd. Class H

HHKEX:6675
13.59
HKD
+0.69
(+5.35%)
13.72BMarket Cap
Mar 03Next Earn
SENASIC Electronics Technology Co., Ltd. Class H
HKEX:6675
(Hong Kong Exchange)

Recent

price

13.59

P/E

ratio

- -

div

yld

- -

ROIC.AI

2023
2024
2025
CNY
0.59
0.92
1.26
Revenue per Share
-0.94
-0.93
-0.87
Basic EPS, GAAP
-0.18
-0.38
-0.49
Free Cash Flow per Basic Share
- -
- -
- -
Dividend per Share
-2.22
-3.06
-3.92
Book Value per Share
-2.23
-3.07
-3.94
Tangible Book Value per Share
379
379
379
Basic Weighted Avg Shares
223
348
478
Sales/Revenue/Turnover
-47.5
-27.18
-10.11
Operating Margin (%)
12
13
13
Depreciation Expense
-356
-351
-330
Net Income, GAAP
- -
- -
- -
Effective Tax Rate (%)
-159.21
-101.09
-69.02
Profit Margin (%)
502
554
544
Working Capital
3
- -
3
LT Debt
-840
-1,160
-1,479
Total Equity
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
Return on Capital (%)
- -
- -
- -
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

CNY

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
27.54%
Free Cash Flow
- -
- -
26.44%
Net Income, GAAP
- -
- -
-6.12%
Sales/Revenue/Turnover
- -
- -
37.5%
Total Cash Common Dividend
- -
- -
- -

Semi-annual Revenue

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
348
2025
- -
- -
478
2026
- -
- -
- -

Semi-annual Earnings Per Share

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
-0.93
2025
- -
- -
-0.87
2026
- -
- -
- -

Semi-annual Dividends Per Share

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
- -
2025
- -
- -
- -
2026
- -
- -
- -
Business
SENASIC Electronics Technology Co., Ltd. engages in the design, research and development, and sale of semiconductor integrated circuits and sensor chip products, with a focus on wireless sensor System-on-Chips (SoCs) and automotive-grade sensor solutions. The company develops and manufactures intelligent tire sensing SoCs, BMS SoCs, wBMS SoCs, USI SoCs, and USS SoCs; it offers a sensor SoC platform that integrates sensing, processing, and wireless transmission capabilities, alongside wireless RF technologies and engineering capabilities to support automotive, industrial, telecommunications, energy storage, and medical electronic applications. SENASIC operates primarily in China, leveraging upstream and downstream partnerships to deliver high-performance, reliable chip solutions globally. Headquartered in Shanghai, China, the company traces its origins to 2015 and positions itself as a global leader in wireless sensor SoCs, with a strategy driven by in-house technology platforms, automotive-grade quality, and a focus on expanding in-vehicle sensing and related adjacent fields. The firm emphasizes scalable manufacturing capabilities, extensive supply chain coordination, and customer-centric development to support large-scale delivery to automotive, industrial electronics, and robotics markets. SENASIC also maintains corporate structures and relationships with subsidiaries and parent entities aligned to its SEHK listing as ticker 6675, reflecting its growth trajectory and market presence since inception.