Mi Technovation Berhad

Mi Technovation Berhad

MITNF
Mi Technovation BerhadUS flagOther OTC
0.57
USD
-NaN
- -
508.95MMarket Cap
Mi Technovation Berhad
MITNF
(Other OTC)

Recent

price

0.57

P/E

ratio

- -

div

yld

- -

ROIC.AI

2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.14
0.08
0.32
0.24
0.26
0.31
0.46
0.43
0.4
0.52
0.7
0.7
Revenue per Share
0.05
0.02
0.11
0.07
0.08
0.07
0.07
0.08
0.06
0.08
0.11
0.11
Basic EPS, GAAP
0.06
0.01
0.02
-0.03
-0.04
-0.02
- -
0.08
0.08
0.03
0.1
0.1
Free Cash Flow per Basic Share
- -
0.01
0.01
0.04
0.01
0.06
0.03
0.04
0.04
0.08
0.03
0.02
Dividend per Share
- -
- -
0.12
0.39
0.6
0.34
1.04
0.95
0.96
1.26
1.35
1.35
Book Value per Share
0.08
0.09
0.23
0.5
0.5
0.51
0.99
0.95
0.98
0.95
1
1
Tangible Book Value per Share
750
750
548
656
748
746
825
896
895
894
890
890
Basic Weighted Avg Shares
105
57
173
160
191
229
375
389
356
463
625
625
Sales/Revenue/Turnover
24.94
21.1
35.07
27.92
31.27
24.57
17.53
20.48
18.76
18.37
22.3
22.3
Operating Margin (%)
3
2
2
2
4
7
17
25
25
25
28
28
Depreciation Expense
41
16
59
44
59
54
62
69
55
73
94
94
Net Income, GAAP
- -
1.71
2.43
0.3
0.61
3.6
5.31
12.19
19.56
25.35
24.04
24.04
Effective Tax Rate (%)
38.91
28.16
34.22
27.65
30.96
23.58
16.47
17.68
15.48
15.66
15.01
15.01
Profit Margin (%)
61
68
102
280
264
238
566
591
611
566
572
572
Working Capital
- -
- -
- -
4
2
4
49
37
35
21
31
31
LT Debt
61
69
125
331
380
388
1,028
1,049
1,075
1,029
1,068
1,068
Total Equity
- -
16.06
61.07
19.31
16.46
13.89
8.08
6.11
4.7
5.71
9.4
9.4
Return on Invested Capital (%)
- -
148.5
174.29
27.46
16.68
15.31
10.5
7.7
6.38
7.21
7.69
7.69
Return on Capital (%)
- -
714.54
174.29
27.86
16.88
15.41
11.16
8.05
6.44
7.31
8.04
8.04
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Jun'25
Sep'25
Dec'25
ST Debt
32
37
61
LT Borrowings
10
10
6
LT Finance Leases
8
25
25
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
890
890
889
Market Capitalization
2,147
2,143
2,063

Working Capital

FRC

in mil. unless spec.
Jun'25
Sep'25
Dec'25
Total Current Assets
706
741
751
Cash, Cash Equivalents & STI
327
362
401
Accounts Receivable, Net
200
223
182
Inventories
175
152
167
Total Current Liabilities
123
142
179
Payables & Accruals
- -
- -
- -
ST Debt
32
37
61
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
44.51%
33.77%
3.8%
Free Cash Flow
4,100.54%
8,279.07%
282.4%
Net Income, GAAP
27.45%
13.36%
29.23%
Sales/Revenue/Turnover
31.35%
24.83%
34.86%
Total Cash Common Dividend
213.74%
6.04%
-62.64%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
77
84
98
97
356
2024
107
127
118
111
463
2025
120
154
197
154
625

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
0.01
0.03
0.02
0.01
0.06
2024
0.03
0.03
-0.01
0.03
0.08
2025
0.02
0.02
0.04
0.03
0.11

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
0.02
- -
0.02
- -
0.04
2024
0.02
- -
0.02
0.03
0.08
2025
- -
- -
- -
0.02
0.03
Business
Mi Technovation Berhad (KLSE:MI; OTCPINK:MITNF) is a Malaysia-based investment holding company engaged in the design, development, manufacturing, and sale of semiconductor equipment and materials. The company operates through three primary segments: Semiconductor Equipment Business Unit (SEBU), which provides wafer level chip scale packaging (WLCSP) sorting machines, vision inspection machines, laser assisted bonding equipment, final test handlers, assembly and packaging tools, power test equipment, wafer fabrication tools, and testing instruments, along with maintenance services, technical support, spare parts, and smart factory automation solutions for Industrial 4.0; Semiconductor Material Business Unit (SMBU), which manufactures solder spheres (solder balls), solder ingots, solder paste, and ESD bottles under the Accurus Scientific brand for advanced packaging applications such as ball grid array and wafer level packaging; and Semiconductor Solutions Business Unit (SSBU), which focuses on high-tech advanced packaging, development, solutions, services, and specific semiconductor manufacturing processes, including power modules and devices. Mi Technovation serves semiconductor manufacturers, including smartphone makers and chip designers, with target markets spanning Southeast Asia, Northeast Asia (Malaysia, Taiwan, South Korea, China), North America, and Europe. The company maintains manufacturing facilities and R&D centers in Penang and Batu Kawan (Malaysia), Tainan (Taiwan), Ningbo (China), and Korea; technology centers in Taiwan and China; and a relocated corporate headquarters in Singapore. Founded in 2007 through the incorporation of predecessor entities such as DPE Integration (M) Sdn. Bhd. and Mi Equipment (M) Sdn. Bhd., Mi Technovation is headquartered in Bayan Lepas, Penang, Malaysia, and listed on the Main Market of Bursa Malaysia since June 20, 2018, following its initial public offering; it changed its name from Mi Equipment Holdings Berhad in December 2018. Recent developments include the April 2021 acquisition of Accurus Scientific Co. Ltd. and subsidiaries for RM271 million via share issuance, marking entry into the materials segment and establishing one-stop solutions across equipment and materials; the October 2023 launch of SSBU with a US$30 million (RM142 million) investment by subsidiary Mi Semiconductor Pte. Ltd. in a Hangzhou, China, R&D and manufacturing facility for power modules and devices; a major SEBU restructuring under a structured succession plan with new leadership including Teo Chee Kheong as CEO; and ongoing capacity expansions with new factories and overseas production readiness. In 2025, the company reports boosted orders amid US tariff pressures and sustainable demand in Taiwan and China markets.