Teinco Technology Co. Ltd.
TTPEX:787734.80
TWD
+0.50
(+1.46%)
Teinco Technology Co. Ltd.
TPEX:7877
(Taipei Exchange)
Recent
price
34.80
P/E
ratio
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div
yld
- -
ROIC.AI
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in mil. unless spec.- Similar Companies
- Business
- Teinco Technology Co. Ltd. (TPEx: 7877) is a Taiwan-based company primarily engaged in the design, development, manufacture, and distribution of precision semiconductor lead frames, electronic stamping components, and metal substrate solutions. The company operates through several core product and service categories, including semiconductor packaging lead frames, featuring quad flat no-lead (QFN), dual flat no-lead (DFN), small outline package (SOP), dual in-line package (DIP), transistor outline (TO), and small outline transistor (SOT) lead frames; precision etched and stamped metal components, consisting of lead frames for discrete devices, power management integrated circuits (PMICs), optical communications, and automotive electronic modules; thermal dissipation substrates, comprising metal heat spreaders, copper alloy heat sinks, and thermal carriers for high-power semiconductor packaging and light-emitting diode (LED) applications; and surface treatment and electroplating services, offering selective gold, silver, nickel, and matte tin plating to enhance conductivity, solderability, and corrosion resistance. The company supplies outsourced semiconductor assembly and test (OSAT) providers, integrated device manufacturers (IDMs), automotive tier-one suppliers, and electronic manufacturing services (EMS) firms across Taiwan, Mainland China, Southeast Asia, and other international markets. In recent developments, Teinco Technology listed on the Taipei Exchange Emerging Stock Board (TPEx: 7877) to broaden its capital access and fund ongoing production enhancements. The company has accelerated capital investments into ultra-fine pitch photochemical etching and high-speed precision stamping lines to capture surging demand for artificial intelligence (AI) hardware, electric vehicle (EV) power electronics, and high-frequency communication modules. Furthermore, Teinco Technology has established strategic co-development alliances with regional semiconductor assembly houses to engineer customized high-heat-dissipation lead frames, while integrating automated optical inspection (AOI) technologies and sustainable, closed-loop electroplating systems across its manufacturing facilities. Teinco Technology Co. Ltd. is headquartered in Taiwan.