PieceMakers Technology, Inc.
TTPEX:7947620.00
TWD
-54.00
(-8.01%)
PieceMakers Technology, Inc.
TPEX:7947
(Taipei Exchange)
Recent
price
620.00
P/E
ratio
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div
yld
- -
ROIC.AI
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in mil. unless spec.- Similar Companies
- Business
- PieceMakers Technology, Inc. is a Taiwan-based technology and manufacturing company specializing in precision electronic components, advanced interconnect solutions, and micro-electromechanical systems (MEMS) assembly services. Founded in 2012 and headquartered in New Taipei City, Taiwan, the company operates primarily within the semiconductor packaging, high-speed electronic connectivity, and precision engineering sectors, serving clients across the consumer electronics, industrial automation, automotive electronics, and telecommunications markets. The company operates through three principal business divisions: Precision Electronic Components, Advanced Packaging and Interconnect Systems, and Custom Engineering Solutions. Its comprehensive product and service portfolio includes high-speed interconnect modules, micro-coaxial cable assemblies, and specialized flexible printed circuit (FPC) assemblies; custom semiconductor test sockets, burn-in sockets, and probe card interfaces designed for high-density integrated circuit (IC) validation; precision stamped metal terminals, shielding frames, and micro-machined tooling for electronic hardware; surface-mount technology (SMT) assembly, system-in-package (SiP) integration, and precision module encapsulation services; and comprehensive design verification, prototyping, and customized contract manufacturing services. PieceMakers Technology distributes its products domestically across Taiwan and exports to major international markets across the Asia-Pacific region, North America, and Europe. In recent developments, PieceMakers Technology has advanced its high-frequency and automotive electronics capabilities to address growing demand in artificial intelligence (AI) computing infrastructure and electric vehicle (EV) control systems. Over the past two years, the company has expanded its manufacturing capacity with the deployment of automated precision inspection lines and high-speed precision stamping equipment at its primary production facilities. Additionally, the company entered into strategic technical collaborations with domestic semiconductor testing partners to co-develop next-generation thermal management and ultra-fine pitch testing interfaces for advanced chiplet architectures, while simultaneously securing certifications under automotive quality management standards to broaden its supply chain footprint with tier-one automotive electronics suppliers.