- Business
- Taiwan Semiconductor Manufacturing Company Limited (TSMC) manufactures, packages, tests and sells integrated circuits and other semiconductor devices as the world's largest dedicated independent semiconductor foundry. Founded in 1987 and headquartered in Hsinchu Science Park, Hsinchu City, Taiwan, TSMC provides a broad portfolio of wafer fabrication processes including complementary metal-oxide-semiconductor (CMOS) logic, mixed-signal, radio frequency, embedded memory, bipolar CMOS mixed-signal; advanced process nodes from 2 microns to 3 nanometers with leadership in 7nm, 5nm, 3nm FinFET and plans for 2nm mass production in 2025; specialty technologies such as extreme ultraviolet (EUV) lithography; advanced packaging solutions including 3DFabric, Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS); and customer support services encompassing mask manufacturing, engineering support and design for manufacturing. The company serves fabless semiconductor firms, integrated device manufacturers and system companies including Apple, AMD, Nvidia, Qualcomm, MediaTek, Broadcom and others across high-performance computing (46% of revenue), smartphones (38%), Internet of Things (6%), automotive (6%), digital consumer electronics (2%) and others; with primary operations in Taiwan supplemented by facilities in the United States (Arizona Fab 21 and Washington), Japan (JASM Kumamoto Fab 23), China (Nanjing Fab 16), Singapore (SSMC) and planned expansions in Germany (ESMC Dresden). TSMC operates globally with sales primarily to the United States (68.8%), China (11.5%), Taiwan (9.3%), Japan (5%) and Europe, Middle East, Africa (3.6%). Recent developments include a $100 billion investment commitment announced with the Trump administration in March 2025 for five additional U.S. chip facilities accelerating Arizona's gigafab cluster; early-stage discussions to lead a joint venture managing Intel's foundry operations with potential stakes from Nvidia, AMD, Broadcom and Qualcomm while capping its own at 50%; Japan Advanced Semiconductor Manufacturing (JASM) Fab 23 achieving commercial production of 12/22/28nm processes in December 2024 with phase 2 under construction for 6/12nm; establishment of the TSMC-University of Tokyo Laboratory in June 2025 for joint R&D; and investigations into trade secret theft involving 2nm process by former employees linked to competitors in August 2025.