Siltronic AG

Siltronic AG

WAF.SW
Siltronic AGCH flagSwiss Exchange
83.60
EUR
+5.80
- -
2.51BMarket Cap
Siltronic AG
WAF.SW
(Swiss Exchange)

Recent

price

83.60

P/E

ratio

- -

div

yld

- -

ROIC.AI

2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
TTM
FRC
28.2
33.51
31.11
39.24
48.56
42.35
- -
- -
- -
- -
- -
Revenue per Share
-0.53
-0.5
0.4
6.18
12.44
7.52
- -
- -
- -
- -
- -
Basic EPS, GAAP
4.16
3.46
3.85
9.96
21.73
12.84
- -
- -
- -
- -
- -
Free Cash Flow per Basic Share
8.98
- -
- -
- -
2.5
5
- -
- -
- -
- -
- -
Dividend per Share
-14.95
-13.3
-11.17
-4.99
5.11
7.63
- -
- -
- -
- -
- -
Book Value per Share
9.4
16.82
13.3
20.46
29.78
30.25
- -
- -
- -
- -
- -
Tangible Book Value per Share
30
28
30
30
30
30
- -
- -
- -
- -
- -
Basic Weighted Avg Shares
846
931
933
1,177
1,457
1,270
1,207
1,405
1,805
1,514
1,400
Sales/Revenue/Turnover
-3.82
5.25
5.69
20.42
34.1
26.06
16.52
21.55
28.43
14.47
9.99
Operating Margin (%)
149
121
119
117
92
110
140
150
176
202
219
Depreciation Expense
-16
-14
12
185
373
226
161
253
391
184
111
Net Income, GAAP
- -
- -
45.28
15.4
17.98
13.78
1.27
9.02
10.82
12.78
15.1
Effective Tax Rate (%)
-1.89
-1.5
1.29
15.74
25.62
17.76
13.32
18.02
21.64
12.18
7.92
Profit Margin (%)
144
314
351
554
788
621
605
687
1,107
368
350
Working Capital
36
39
40
- -
- -
46
48
100
760
895
1,072
LT Debt
312
497
425
638
916
930
872
1,319
2,067
2,100
2,150
Total Equity
- -
- -
5.7
36.27
51.12
29
19.99
22.91
21.13
6.47
3.89
Return on Invested Capital (%)
- -
- -
-6.92
-82.84
2,156.05
75.91
37.11
38.57
29.19
10.19
6.55
Return on Capital (%)
- -
- -
- -
- -
- -
117.99
60.82
63.89
60.71
21.93
12.86
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Dec'23
Mar'24
Jun'24
ST Debt
10
16
14
LT Borrowings
785
839
940
LT Finance Leases
110
132
132
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
30
30
30
Market Capitalization
- -
- -
- -

Working Capital

FRC

in mil. unless spec.
Dec'23
Mar'24
Jun'24
Total Current Assets
1,006
979
876
Cash, Cash Equivalents & STI
463
378
340
Accounts Receivable, Net
162
208
145
Inventories
301
307
306
Total Current Liabilities
638
610
526
Payables & Accruals
- -
- -
- -
ST Debt
10
16
14
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
20.98%
1.58%
Free Cash Flow
- -
10.69%
-39.35%
Net Income, GAAP
- -
-1.87%
-52.79%
Sales/Revenue/Turnover
- -
2.19%
-16.15%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2022
417
442
474
472
1,805
2023
404
404
349
357
1,514
2024
344
351
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2022
- -
- -
- -
- -
- -
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2022
- -
- -
- -
- -
- -
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -
Business
Siltronic AG develops, produces and sells hyperpure silicon wafers for the semiconductor industry worldwide. The company offers an extensive portfolio of products including polished wafers, epitaxial wafers, annealed wafers, non-polished wafers, as-sawn wafers, as-lapped wafers, as-etched wafers and float zone wafers with diameters up to 300 mm, manufactured using Czochralski (CZ) and float zone (FZ) processes for applications in high-voltage components, low-resistivity devices, automotive engineering, telecommunications, integrated microprocessors and memory modules. Siltronic operates advanced production facilities in Europe (Germany sites in Munich, Burghausen and Freiberg), Asia (Singapore) and the USA (Portland, Oregon), employing around 4,400 staff and serving customers in Germany, rest of Europe, the United States, Taiwan, Mainland China, South Korea and other Asian markets. Founded in 1968 as Wacker-Chemitronic and renamed Siltronic AG in 2004, the company is headquartered in Munich, Germany, and listed on the German stock exchange under ticker WAF with shares in the SDAX and TecDAX indices. Recent developments include the inauguration of a new 300 mm wafer fabrication facility in Singapore in 2024 following first production in 2023, completion of customer qualifications for the Singapore fab and cessation of small-diameter wafer production (up to 150 mm) at the Burghausen site in the first half of 2025, alongside a 5.3% stake acquisition by Netherlands-based HAL in 2024.