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    Semiconductors
United Microelectronics Corporation

United Microelectronics Corporation

2303.TW
United Microelectronics CorporationTW flagTaiwan Stock Exchange
158.00
TWD
-5.00
- -
1.99TMarket Cap
United Microelectronics Corporation
2303.TW
(Taiwan Stock Exchange)

Recent

price

158.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
10.12
9.29
9.16
9.9
11.21
11.58
12.03
12.23
12.5
12.58
14.65
17.43
22.65
17.99
18.68
19.03
19.28
Revenue per Share
1.91
0.84
0.48
1.01
0.89
1.06
0.7
0.79
0.63
0.69
1.89
4.19
7.27
4.82
3.92
3.23
3.9
Basic EPS, GAAP
-0.63
-0.95
-1.04
0.61
0.03
-0.14
-3.8
0.57
2.52
3.05
3.1
3.31
5.12
-0.65
0.2
3.94
3.89
Free Cash Flow per Basic Share
0.5
1.12
0.5
0.4
0.5
0.55
0.56
0.5
0.71
0.59
0.81
1.63
3.04
3.64
3.02
2.87
- -
Dividend per Share
12.65
12.89
12.67
13.21
14.12
14.63
14.55
14.69
15.74
13.16
14.71
17.02
23.95
24.39
24.91
24.83
26.7
Book Value per Share
17.99
16.56
15.75
16.38
17.27
17.62
17.16
16.86
16.64
16.78
18.08
21.34
25.89
27.43
29.07
28.93
32.21
Tangible Book Value per Share
12,496
12,561
12,625
12,508
12,495
12,508
12,289
12,208
12,104
11,785
12,073
12,218
12,306
12,371
12,437
12,485
12,488
Basic Weighted Avg Shares
126,442
116,703
115,675
123,812
140,012
144,830
147,870
149,285
151,253
148,202
176,821
213,011
278,705
222,533
232,303
237,553
240,732
Sales/Revenue/Turnover
17.41
4.44
3.12
3.3
7.58
8.18
4.45
4.24
3.8
3.62
11.43
24.11
37.18
25.74
22.07
18.38
19.25
Operating Margin (%)
30,496
32,371
35,842
38,432
40,657
45,472
51,984
53,099
52,049
49,390
48,908
47,075
44,170
40,484
48,168
59,259
61,118
Depreciation Expense
23,899
10,610
6,094
12,609
11,109
13,254
8,621
9,677
7,678
8,155
22,861
51,246
89,479
59,689
48,779
40,360
48,755
Net Income, GAAP
6.33
9.74
34.09
15.74
23.03
7.52
11.7
12.94
- -
4.79
7.5
13.54
17.63
12.14
14.67
16.44
12.33
Effective Tax Rate (%)
18.9
9.09
5.27
10.18
7.93
9.15
5.83
6.48
5.08
5.5
12.93
24.06
32.11
26.82
21
16.99
20.25
Profit Margin (%)
48,325
40,914
39,907
40,592
47,665
45,330
37,680
50,463
91,177
80,878
84,825
125,024
139,762
114,900
112,279
115,256
136,829
Working Capital
6,799
21,095
32,155
28,415
33,401
47,524
60,729
53,319
67,083
53,349
29,798
44,340
45,077
50,115
61,316
50,748
52,519
LT Debt
225,136
209,556
201,687
209,644
220,339
224,853
214,946
209,621
204,397
202,914
223,140
264,375
322,811
343,717
365,707
365,912
406,736
Total Equity
9.13
1.96
0.99
1.43
3.24
4.04
2.01
1.87
- -
1.84
6.97
15.19
24.19
12.51
10.19
8.36
8.82
Return on Invested Capital (%)
15.17
7.04
4.2
6.77
5.82
6.25
5.67
5.67
- -
5.9
12.13
22.58
30.26
17.13
13.48
11.14
13.03
Return on Capital (%)
16.01
6.63
3.79
7.76
6.5
7.38
4.77
5.4
4.15
4.72
13.74
26.58
35.59
20.01
15.95
13.02
14.84
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
16,704
9,034
4,218
LT Borrowings
53,758
45,372
47,165
LT Finance Leases
5,449
5,376
5,354
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
12,556
12,588
12,579
Market Capitalization
568,684
614,878
705,574

Working Capital

FRC

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
192,854
204,783
216,440
Cash, Cash Equivalents & STI
119,040
128,365
134,264
Accounts Receivable, Net
31,643
30,772
34,703
Inventories
35,181
37,228
38,645
Total Current Liabilities
82,276
89,527
79,611
Payables & Accruals
41,205
50,809
45,061
ST Debt
16,704
9,034
4,218
Deferred Revenue
2,970
2,581
3,489

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
5.34%
10.7%
0.06%
Free Cash Flow
439.44%
332.47%
1,842.67%
Net Income, GAAP
27.31%
25.99%
-17.26%
Sales/Revenue/Turnover
5.95%
7.56%
2.26%
Total Cash Common Dividend
24.1%
38.17%
-4.79%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
54,632
56,799
60,485
60,386
232,303
2025
57,859
58,758
59,127
61,810
237,553
2026
61,038
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.84
1.11
1.16
- -
3.92
2025
0.62
0.71
- -
- -
3.23
2026
1.29
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
3.02
2025
- -
- -
- -
- -
2.87
2026
- -
- -
- -
- -
- -
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Business
United Microelectronics Corporation (UMC; NYSE: UMC, TWSE: 2303) operates as a leading global pure-play semiconductor foundry, providing advanced integrated circuit (IC) fabrication services focused on logic and specialty technologies including Logic/Mixed-Signal, embedded High-Voltage (eHV), embedded Non-Volatile-Memory (eNVM), RFSOI, BCD, eFlash, gallium nitride (GaN), and microwave platforms for applications in mobile and wireless communications, IoT and wearables, computing and data processing, automotive, AI, consumer electronics, 5G, and power management; the company also offers design enablement services, wafer manufacturing, IP portfolios with approximately 15,000 semiconductor patents, and packaging material management across 12 fabs (four 12-inch, seven 8-inch, one 6-inch) with combined monthly capacity exceeding 400,000 12-inch equivalent wafers, all certified to IATF 16949 automotive standards. Founded in 1980 as a spin-off from Taiwan's Industrial Technology Research Institute and headquartered in Hsinchu, Taiwan, UMC maintains core R&D and most manufacturing in Taiwan, with additional fabs in Singapore, China, and Japan, sales offices in the United States, Europe, China, Japan, Korea, and Singapore, and approximately 20,000 employees worldwide. Recent developments include the April 2025 grand opening of a new 22nm/28nm fab expansion in Singapore's Pasir Ris Wafer Fab Park, representing up to US$5 billion investment for 30,000 wafers per month initial capacity starting volume production in 2026 to support communications, IoT, automotive, and AI chips while creating 700 local jobs and enhancing supply chain resilience; a July 2025 acquisition of production software from Synopsys International Limited for NT$534 million to boost manufacturing efficiency; a September 2025 purchase of production software from Siemens Electronic Design Automation Japan for NT$347 million via subsidiary United Semiconductor Japan; an ongoing collaboration with Intel announced in 2024 on a 12nm FinFET process platform leveraging U.S. capacity for mature nodes; and plans for a new advanced packaging facility in southern Taiwan to address AI and high-performance computing demand.