Guangdong Tianyu Semiconductor Co., Ltd.

Guangdong Tianyu Semiconductor Co., Ltd.

2658.HK
Guangdong Tianyu Semiconductor Co., Ltd.HK flagHong Kong Stock Exchange
48.02
HKD
-1.88
- -
2.83BMarket Cap
2022 Y
2023 Y
2024 Y
2025 Y
Revenue per Share
1.11
2.98
1.32
- -
Basic EPS, GAAP
0.02
0.26
-1.25
- -
Free Cash Flow per Basic Share
-1.98
-2.56
-2.3
- -
Dividend per Share
- -
- -
- -
- -
Book Value per Share
0.46
0.69
-0.56
- -
Tangible Book Value per Share
4.01
4.31
3.09
- -
Basic Weighted Avg Shares
393
393
393
- -
Sales/Revenue/Turnover
437
1,171
520
709
Operating Margin (%)
3.44
9.57
-107.18
-2.28
Depreciation Expense
34
89
131
147
Net Income, GAAP
7
101
-492
-56
Effective Tax Rate (%)
24.88
13.63
- -
- -
Profit Margin (%)
1.59
8.66
-94.77
-7.84
Working Capital
852
261
-523
1,065
LT Debt
16
539
1,108
1,543
Total Equity
1,575
1,697
1,220
2,713
Return on Invested Capital (%)
- -
4.68
- -
- -
Return on Capital (%)
- -
18.5
- -
- -
Return on Common Equity (%)
- -
44.71
- -
- -

Capital Structure

FRC

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

FRC

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
122.45%
Free Cash Flow
- -
- -
9.04%
Net Income, GAAP
- -
- -
-88.71%
Sales/Revenue/Turnover
- -
- -
36.49%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
1,171
2024
- -
- -
- -
- -
520
2025
- -
- -
- -
- -
709

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
0.26
2024
- -
- -
- -
- -
-1.25
2025
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -

Company Description

APIChatGPT
CEO
Xi Guang Li
Full Time Employees
960
Sector
Technology
Industry
Semiconductors
Address
No. 5 Industrial North First Road Dongguan GD People's Republic of China 523808
IPO Date
Dec 4, 2025
Website
sicty.com
Business
Guangdong Tianyu Semiconductor Co., Ltd. engages in the design, development, manufacture, and marketing of silicon carbide (SiC) epitaxial wafers and related services, with a focus on power device applications across multiple markets; it operates through subsidiaries and serves customers in the Chinese Mainland, Hong Kong, and overseas markets. The company is headquartered in Guangdong Province, China, and was founded in 2003. Its product portfolio comprises 4-inch, 6-inch, and 8-inch SiC epitaxial wafers; SiC epitaxial foundry services; epitaxial wafer cleaning; substrate and epitaxial wafer inspection services; and value-added SiC wafer-related services. Guangdong Tianyu Semiconductor positions its offerings for use in electric vehicles, renewable energy systems, rail transportation, smart grids, industrial power supplies, and consumer electronics, with a growing emphasis on providing end-to-end SiC solutions to global customers. Latest major company changes include partnerships and strategic alliances to expand manufacturing capacity and customer base in SiC epitaxy, recent funding rounds and potential acquisitions to bolster advanced epitaxial wafer production, new product launches in higher-voltage SiC wafers and associated processing services, and organizational refinements to support international sales and after-sales support. The company highlights its capability with advanced epitaxial equipment and mass production processes, enabling N-type and P-type doped semiconductor materials suitable for high-voltage applications ranging from 650V to 20000V, and broad adoption in新能源、光伏储能、轨道交通、智能电网、工业电源等领域. The business segments include SiC epitaxial wafer sales, epitaxial foundry services, cleaning and inspection services, and related value-added services, with revenue primarily generated in the Chinese Mainland and a significant portion from overseas markets. Guangdong Tianyu Semiconductor maintains relationships with parent or affiliate entities and operates as part of a broader ecosystem of silicon carbide materials suppliers, with ongoing strategic efforts to expand capacity, diversify markets, and enhance service offerings for downstream power electronics industries.