Nsing Tech

Nsing Tech

2701.HK
Nsing TechHK flagHong Kong Stock Exchange
11.73
HKD
+0.50
- -
1.11BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.93
0.84
1.04
1.26
1.26
1.07
0.72
0.68
1.81
2.21
1.81
1.98
2.36
2.4
Basic EPS, GAAP
0.01
0.02
0.16
0.18
-0.88
-2.88
0.19
0.02
0.39
-0.06
-1
-0.4
-0.2
-0.26
Free Cash Flow per Basic Share
-0.02
-0.1
-0.23
-0.35
-0.45
0.26
-0.31
-0.04
0.18
-1.37
-0.56
-0.52
-0.37
-0.32
Dividend per Share
0.06
0.01
0.01
0.05
0.02
0.02
0.05
0.05
0.06
0.06
0.1
0.11
0.1
0.12
Book Value per Share
0.99
0.93
1.03
1.6
0.78
-2.12
-1.99
-1.91
-1.46
-1.57
-2.49
-2.84
-3.09
-3.19
Tangible Book Value per Share
5.35
4.92
4.74
4.81
4.17
1.23
1.67
1.6
2.37
2.69
1.75
1.3
1.08
1.34
Basic Weighted Avg Shares
469
507
538
562
553
561
547
562
561
541
572
588
577
534
Sales/Revenue/Turnover
434
426
561
706
695
602
395
380
1,018
1,195
1,037
1,168
1,360
1,285
Operating Margin (%)
-22.41
-19.84
-4.17
-1.42
-2.75
-8.86
-37.46
-11.38
10.5
-2.21
-25.7
-8.81
-2.18
-0.54
Depreciation Expense
48
47
40
32
34
53
40
47
69
93
110
99
139
- -
Net Income, GAAP
5
10
86
101
-487
-1,614
104
11
219
-32
-572
-235
-115
-138
Effective Tax Rate (%)
36.68
0.76
11.81
13.02
- -
- -
67.47
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
1.08
2.38
15.34
14.33
-70.02
-268.12
26.33
2.96
21.52
-2.72
-55.13
-20.16
-8.48
-10.76
Working Capital
2,447
2,449
2,160
2,008
1,937
-356
-53
326
629
915
717
159
-128
27
LT Debt
- -
- -
- -
- -
- -
- -
42
363
334
418
821
729
761
758
Total Equity
2,708
2,714
2,815
2,964
2,578
1,058
1,087
1,089
1,552
1,744
1,246
1,053
935
1,015
Return on Invested Capital (%)
-2.26
-3.09
-0.74
-0.3
- -
- -
-6.39
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
-7.41
-11.13
12.57
13.76
- -
- -
-21.19
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
0.98
2.17
16.82
13.92
-73.12
- -
- -
- -
- -
- -
- -
- -
- -
- -

Capital Structure

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
988
988
1,114
LT Borrowings
700
738
732
LT Finance Leases
29
28
27
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
583
583
583
Market Capitalization
- -
- -
- -

Working Capital

FRC

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
1,726
1,674
1,614
Cash, Cash Equivalents & STI
536
477
405
Accounts Receivable, Net
248
311
309
Inventories
621
645
676
Total Current Liabilities
1,567
1,498
1,587
Payables & Accruals
- -
- -
- -
ST Debt
988
988
1,114
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-6.42%
-0.09%
-11.23%
Free Cash Flow
-184.34%
-293.59%
-30.43%
Net Income, GAAP
275.69%
656.77%
-50.96%
Sales/Revenue/Turnover
17.41%
40.27%
16.51%
Total Cash Common Dividend
78.36%
20.48%
-10.07%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
231
284
306
347
1,168
2025
304
328
402
- -
1,360
2026
395
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.13
- -
- -
- -
-0.4
2025
-0.04
- -
- -
- -
-0.2
2026
-0.02
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
- -
- -
- -
0.11
2025
0.03
- -
- -
- -
0.1
2026
0.02
- -
- -
- -
- -

Company Description

MCPAPIChat
CEO
Yingtong Sun
Full Time Employees
1,086
Sector
Technology
Industry
Semiconductors
Address
National Technology Building Shenzhen Guangdong Province People's Republic of China 518057
IPO Date
Mar 23, 2026
Business
Nsing Technologies Inc. is a China-based IC design company focused on the research, development, design, and sales of integrated circuit chips and related system solutions, with additional activities in lithium-ion battery anode materials; the firm provides security chips, wireless RF chips, and broader MCU/secure chip technologies, alongside post-sales technical support and system-level solutions. Main products and services - Integrated circuit design and sales: research, development, design, and commercialization of proprietary IC chips and secure/middleware technologies; core offerings include security chips and wireless RF chips for a range of intelligent terminals and device ecosystems; provides system solutions and post-sales technical support. - System solutions and services: end-to-end integration of ICs into customer applications, including hardware/software integration support, reference designs, and customized engineering services for deployment across multiple platforms. - Lithium-ion battery materials: production and supply of negative electrode materials for lithium-ion batteries, expanding the semiconductor business into energy storage components for digital energy and related markets. - Application domains and end-markets: products and solutions target consumer electronics, industrial control, digital energy, smart home, automotive electronics, medical electronics, and robotics, with deployments across domestic and international markets. Geographic operations and presence - Headquartered in Shenzhen, China, with multi-branch presence in Beijing, Shanghai, Wuhan, Xi’an, Chongqing, and international offices or partnerships in Hong Kong, Singapore, the United States (Austin), and Japan (Tokyo), reflecting a global reach in design, sales, and support; serves both domestic and overseas customers. Founding and corporate structure - Founded in 2000 as part of strategic national IC development initiatives; public listings and corporate evolution have occurred since 2010, with the company now operating as a platform-based IC design entity under the NSING umbrella, focusing on control chips, system solutions, and battery materials; operates as a high-tech enterprise with diversified product lines. Recent major changes and strategic updates - Strategic partnerships and alliances: expansion of collaboration with semiconductor customers and integration partners to broaden IC design capabilities, system solutions, and energy-related material offerings; ongoing alignment with national and regional innovation programs to accelerate advanced chip development and deployment. - Funding rounds and acquisitions: active capital markets activity surrounding listed status in Hong Kong and related financing rounds to support R&D expansion, manufacturing scale-up, and international expansion; any specific acquisitions or minority investments strengthen IC design capabilities and battery materials operations. - Product launches and service expansions: introduction of new security and RF chip families, expanded reference designs for automotive and industrial applications, and enhanced system-in-package solutions to support complex terminal architectures; broadened battery material offerings to support digital energy and energy storage ecosystems. - Operational and organizational changes: formalization of international business units and regional sales teams to support global customers; ongoing organizational restructuring to unify IC design, system solutions, and energy materials under integrated go-to-market strategies. - Brand and corporate evolution: continued branding around NSING Technologies as a platform-focused IC designer and energy materials provider, with clear delineation of core segments and customer-facing capabilities. Industry context and client base - Industry: integrated circuit design and semiconductor solutions; supplementary energy materials for lithium-ion batteries; technology platforms for secure control and RF applications. - Customer types: electronics manufacturers, system integrators, automotive electronics suppliers, industrial equipment makers, and technology startups seeking secure, power-efficient ICs and system solutions. - Market reach: principally Asia-Pacific with growing exposure to North American and European customers through international offices and distributors. Subsidiaries and parent relationships - Maintains a multi-entity structure aligning IC design activities, system solution offerings, and battery material operations under NSING Technologies’ umbrella; operates with regional subsidiaries and affiliates to service global customers and projects. Note: Information reflects publicly disclosed company activity and market profiles up to 2026 and may be subject to change with new filings, press releases, or regulatory updates. Please consult the latest company disclosures and financial reports for precise figures and dates.