Soitec S.A.
Other OTCCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Laurent Rémont
- Full Time Employees
- 2,122
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Parc Technologique des Fontaines Bernin ARA France 38190
- IPO Date
- Mar 19, 2013
- Website
- soitec.com
- Similar Companies
- Business
- Soitec S.A. (SLOIY) designs, manufactures and markets innovative semiconductor materials, including silicon-on-insulator (SOI) substrates and engineered wafers that enhance performance, energy efficiency and integration in electronics applications; its core products encompass Radio Frequency SOI (RF-SOI) for 5G and Wi-Fi connectivity in smartphones and wireless devices, Fully Depleted SOI (FD-SOI) for edge AI, cloud computing, automotive radar and processors, Piezoelectric-on-Insulator (POI) for radiofrequency filters, RF Gallium Nitride (GaN) for power amplifiers in 5G base stations, SmartSiC silicon carbide substrates for electric vehicle power electronics and industrial applications, Auto Power-SOI for intelligent power ICs in automotive and industrial markets, Photonics-SOI and Imager-SOI for optical networks, datacom, near-infrared sensors, augmented reality, virtual reality and facial recognition systems, PD-SOI for high-performance computing, AI and IoT servers, as well as MEMS-SOI for micro-electro-mechanical systems. The company, founded in 1992 and headquartered in Bernin, France, operates manufacturing facilities in France and Singapore, with R&D centers and sales offices across Europe, the United States, China, South Korea, Japan, Taiwan and other regions in Asia, serving the semiconductor industry for consumer electronics, automotive, telecommunications, data centers, photonics and power management sectors. Recent developments include a strategic partnership with CEA-Leti to leverage FD-SOI technology for automotive cybersecurity and enhanced security of integrated circuits, a collaboration with PSMC on ultra-thin TLT technology for nanometer-scale 3D stacking, a framework agreement with MIT's Microsystems Technology Laboratories for new materials and photonics applications, a financing agreement with the European Investment Bank to support research and development, the appointment of a new Chief Financial Officer, and the initiation of a CEO succession process for Pierre Barnabé, alongside divestitures of Dolphin Design's ASIC business to NanoXplore and IP assets to Jolt Capital.
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