Chengdu Hongming Electronics Co. Ltd. Class A

Chengdu Hongming Electronics Co. Ltd. Class A

301682.SZ
Chengdu Hongming Electronics Co. Ltd. Class ACN flagShenzhen Stock Exchange
129.20
CNY
+0.50
- -
3.32BMarket Cap
Chengdu Hongming Electronics Co. Ltd. Class A
301682.SZ
(Shenzhen Stock Exchange)

Recent

price

129.20

P/E

ratio

- -

div

yld

- -

ROIC.AI

2022
2023
2024
2025
TTM
FRC
34.54
29.94
27.36
28.7
29.07
Revenue per Share
5.22
4.52
2.94
3.5
3.51
Basic EPS, GAAP
0.33
5.19
3.06
0.76
-1.03
Free Cash Flow per Basic Share
1.22
1.37
1.26
0.95
0.87
Dividend per Share
23.61
26.47
28.33
31
41.16
Book Value per Share
22.79
25.48
27.35
30.01
40.43
Tangible Book Value per Share
91
91
91
91
91
Basic Weighted Avg Shares
3,146
2,727
2,494
2,617
2,650
Sales/Revenue/Turnover
28.77
28.76
20.04
23.5
22.43
Operating Margin (%)
93
114
124
140
- -
Depreciation Expense
476
412
268
319
320
Net Income, GAAP
11.68
12.73
12.63
10.98
12.31
Effective Tax Rate (%)
15.11
15.1
10.76
12.18
12.07
Profit Margin (%)
2,022
2,514
2,458
2,581
4,830
Working Capital
288
447
409
227
229
LT Debt
2,796
3,236
3,478
3,826
6,070
Total Equity
- -
19.36
11.48
13.25
- -
Return on Invested Capital (%)
- -
7.45
4.64
4.49
6.2
Return on Capital (%)
- -
18.23
10.74
11.79
24.57
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
- -
480
497
LT Borrowings
- -
189
192
LT Finance Leases
- -
38
38
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
91
91
122
Market Capitalization
- -
- -
14,123

Working Capital

FRC

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
- -
4,079
6,279
Cash, Cash Equivalents & STI
- -
739
2,747
Accounts Receivable, Net
- -
1,569
2,056
Inventories
- -
964
932
Total Current Liabilities
- -
1,498
1,449
Payables & Accruals
- -
- -
- -
ST Debt
- -
480
497
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
10.03%
Free Cash Flow
- -
- -
-75.13%
Net Income, GAAP
- -
- -
18.82%
Sales/Revenue/Turnover
- -
- -
4.93%
Total Cash Common Dividend
- -
- -
-25.09%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
411
- -
- -
- -
2,494
2025
819
709
585
503
2,617
2026
853
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2.94
2025
1.52
- -
- -
- -
3.5
2026
1.53
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1.26
2025
0.04
- -
- -
- -
0.95
2026
0.03
- -
- -
- -
- -
Business
Chengdu Hongming Electronics Co. Ltd. Class A (Ticker: 301682.SZ) is a Chinese electronics manufacturer and provider of advanced electronic components and related services. The company specializes in the design, development, production, and sale of electronic components, consumer and industrial electronics modules, and embedded solution systems, with a focus on power management, sensing, and control technologies. It operates through multiple product categories including integrated circuits and discrete semiconductors; modular electronics and system assemblies; embedded hardware and software solutions; and value-added services such as engineering support, testing, and bespoke design customization. The company serves a diversified customer base across automation, consumer electronics, telecommunications, automotive, and industrial segments, targeting original equipment manufacturers, contract manufacturers, and system integrators. Latest major company changes include strategic partnerships and alliances with technology suppliers and system integrators to expand product offerings and geographic reach; a series of funding rounds and potential minority or strategic investments to accelerate R&D and production capacity; launches of new product families in power conversion, sensor integration, and intelligent control modules; organizational restructuring to enhance product platform management and go-to-market efficiency; and the expansion of manufacturing and distribution footprints within China and selected international markets. These developments reflect a shift toward broader embedded solutions, higher-value modules, and expanded service offerings for customers requiring integrated hardware and software capabilities. Additional context: - Industry and business segments: electronics components manufacturing; embedded systems; power and sensing solutions - Target markets: original equipment manufacturers, contract manufacturers, and system integrators across industrial, consumer, automotive, and telecom sectors - Geographic operations: operations and customers primarily in China, with distribution and service channels in Asia-Pacific and other regions - Founding year and headquarters: established in the 2000s in Chengdu, Sichuan Province, China; headquarters located in Chengdu - Subsidiaries/parent relationships: operates as a standalone entity within its corporate group, with potential related subsidiaries or affiliated units for regional sales and manufacturing facilities