Chengdu Hongming Electronics Co. Ltd. Class A
301682.SZ
Shenzhen Stock Exchange129.20
CNY
+0.50
- -
ISIN
CNE100007KS1
Return %
Stock
S&P500
1Y
0.43
20.37
3Y
0.43
73.24
5Y
0.43
73.69
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
•
in mil. unless spec.- CEO
- Zun Shu Liu
- Full Time Employees
- 3,273
- Sector
- Technology
- Industry
- Hardware, Equipment & Parts
- Address
- No. 188, Beijing Road Chengdu SI People's Republic of China 610010
- IPO Date
- Mar 25, 2026
- Website
- chinahongming.com
- Similar Companies
- Business
- Chengdu Hongming Electronics Co. Ltd. Class A (Ticker: 301682.SZ) is a Chinese electronics manufacturer and provider of advanced electronic components and related services. The company specializes in the design, development, production, and sale of electronic components, consumer and industrial electronics modules, and embedded solution systems, with a focus on power management, sensing, and control technologies. It operates through multiple product categories including integrated circuits and discrete semiconductors; modular electronics and system assemblies; embedded hardware and software solutions; and value-added services such as engineering support, testing, and bespoke design customization. The company serves a diversified customer base across automation, consumer electronics, telecommunications, automotive, and industrial segments, targeting original equipment manufacturers, contract manufacturers, and system integrators. Latest major company changes include strategic partnerships and alliances with technology suppliers and system integrators to expand product offerings and geographic reach; a series of funding rounds and potential minority or strategic investments to accelerate R&D and production capacity; launches of new product families in power conversion, sensor integration, and intelligent control modules; organizational restructuring to enhance product platform management and go-to-market efficiency; and the expansion of manufacturing and distribution footprints within China and selected international markets. These developments reflect a shift toward broader embedded solutions, higher-value modules, and expanded service offerings for customers requiring integrated hardware and software capabilities. Additional context: - Industry and business segments: electronics components manufacturing; embedded systems; power and sensing solutions - Target markets: original equipment manufacturers, contract manufacturers, and system integrators across industrial, consumer, automotive, and telecom sectors - Geographic operations: operations and customers primarily in China, with distribution and service channels in Asia-Pacific and other regions - Founding year and headquarters: established in the 2000s in Chengdu, Sichuan Province, China; headquarters located in Chengdu - Subsidiaries/parent relationships: operates as a standalone entity within its corporate group, with potential related subsidiaries or affiliated units for regional sales and manufacturing facilities