Shenzhen Csl Vacuum Sci & Tech Co.

Shenzhen Csl Vacuum Sci & Tech Co.

688785.SS
Shenzhen Csl Vacuum Sci & Tech Co.CN flagShanghai Stock Exchange
346.48
CNY
-14.38
- -
4.41BMarket Cap
Shenzhen Csl Vacuum Sci & Tech Co.
688785.SS
(Shanghai Stock Exchange)

Recent

price

346.48

P/E

ratio

- -

div

yld

- -

ROIC.AI

2022
2023
2024
2025
TTM
FRC
- -
6.6
10.66
10.42
8.89
Revenue per Share
- -
1.62
2.79
2.24
1.71
Basic EPS, GAAP
- -
0.71
0.27
1.16
-0.43
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
Dividend per Share
3.04
10.58
13.39
15.76
32.69
Book Value per Share
3.03
10.57
13.38
15.75
32.69
Tangible Book Value per Share
- -
49
51
51
57
Basic Weighted Avg Shares
158
325
541
529
504
Sales/Revenue/Turnover
18.11
27.61
31.86
25.44
22.72
Operating Margin (%)
4
8
15
25
- -
Depreciation Expense
26
80
142
114
97
Net Income, GAAP
3.84
8.91
11.07
6.36
4.81
Effective Tax Rate (%)
16.56
24.54
26.17
21.5
19.22
Profit Margin (%)
153
528
588
694
2,078
Working Capital
3
2
12
7
13
LT Debt
154
537
680
800
2,213
Total Equity
- -
22.56
24.31
16.53
7.23
Return on Invested Capital (%)
- -
22.51
22.85
15.09
6.49
Return on Capital (%)
- -
23.1
23.26
15.38
6.54
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
10
13
15
LT Borrowings
- -
- -
- -
LT Finance Leases
7
16
13
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
51
68
68
Market Capitalization
- -
19,088
32,770

Working Capital

FRC

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
783
2,239
2,187
Cash, Cash Equivalents & STI
481
1,899
1,851
Accounts Receivable, Net
100
123
120
Inventories
148
148
155
Total Current Liabilities
89
114
109
Payables & Accruals
- -
- -
- -
ST Debt
10
13
15
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
17.69%
Free Cash Flow
- -
- -
333.42%
Net Income, GAAP
- -
- -
-19.57%
Sales/Revenue/Turnover
- -
- -
-2.09%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
134
115
- -
- -
541
2025
142
163
97
128
529
2026
124
154
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.81
- -
- -
- -
2.79
2025
0.69
- -
0.44
- -
2.24
2026
0.28
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
Business
Shenzhen CSL Vacuum Science & Technology Co., Ltd. engages in the research, development, manufacture, sale and technical servicing of core components for front-end integrated-circuit manufacturing equipment, principally in China. Its products and solutions include plasma radio-frequency power-supply systems; plasma excitation devices and sources; plasma direct-current power supplies; RF matching and related accessory products; and sourced vacuum-acquisition and fluid-control components. The Company provides integrated core-component solutions supporting plasma processes used in wafer thin-film deposition, plasma etching, lithography, photoresist stripping, ion implantation and bonding equipment. Its customers include semiconductor-equipment manufacturers and wafer-fabrication plants; product deliveries have included supplies to Chinese equipment makers such as Piotech Inc., Advanced Micro-Fabrication Equipment Inc. China, NAURA Technology Group Co., Ltd., Wuxi Lead Intelligent Equipment Co., Ltd. and ACM Research (Shanghai), Inc. The Company operates primarily in China, while also serving overseas markets. Founded in 2012, Shenzhen CSL Vacuum Science & Technology Co., Ltd. is headquartered in Shenzhen, Guangdong Province, China. The Company is a technology-focused supplier in China’s semiconductor-equipment component industry and has established volume-delivery capabilities for plasma RF power-supply systems. Its business also addresses adjacent industrial applications for vacuum and plasma equipment, including photovoltaic, display-panel and precision-optics markets. Recent strategic developments include the completion of the Company’s initial public offering and listing on the Shanghai Stock Exchange STAR Market on January 28, 2026, under the ticker 688785. The offering comprised 16.93 million new A shares at CNY92.18 per share and generated net proceeds of approximately CNY1.41 billion. The Company is deploying the proceeds toward an intelligent production and operating base for semiconductor and vacuum-equipment core components; a research and frontier-technology innovation center; semiconductor RF power-system industrialization in Shenyang; marketing and technical-support centers; and working capital. These investments are intended to expand production capacity and product development in areas including low-frequency, high-power plasma RF power supplies, physical-vapor-deposition DC sputtering power supplies and remote plasma sources, while broadening its customer reach beyond semiconductors. In November 2025, the Company also established a wholly owned subsidiary in Germany through outbound direct investment, supporting its international operating expansion.