- Business
- Nitto Denko Corporation, founded in 1918 and headquartered at the 33rd Floor of Grand Front Osaka in Kita-ku, Osaka, Japan, manufactures and sells advanced functional materials globally, operating through 89 companies across regions including the Americas, Europe, China, and Asia. The company produces a broad portfolio of core products encompassing industrial tapes such as double-sided tapes, surface protective films, sealing materials, masking tapes, and packaging tapes; materials for housing, construction, and semiconductor manufacturing processes; tapes for electrical and electronic equipment; fluoroplastic sheets and tapes under the NITOFLON brand; fluoroplastic porous films; porous sheets and breathable materials; functional thermal transfer systems; optical materials including polarizing films and transparent conductive films for displays and touch panels; circuit board materials like flexible printed circuit boards; reverse osmosis membranes for water desalination; and medical products such as transdermal therapeutic patches, surgical tapes, dressings, and hygiene products. Nitto Denko serves diverse industries including electronics, automotive, housing, infrastructure, displays, medical, packaging, consumer goods, and energy, with target customers ranging from semiconductor and display manufacturers to healthcare providers and construction firms.
In recent developments, Nitto Denko announced a strategic partnership and significant equity investment with Aqualung Carbon Capture in September 2025 to jointly develop membrane-based CO2 separation technology for carbon capture and storage, aiming for demonstration trials in fiscal 2026. The company also formed a strategic partnership and investment with Numat Technologies in July 2025 to advance metal-organic framework materials for next-generation decarbonization solutions in energy and chemicals sectors. These alliances underscore Nitto Denko's focus on sustainability and innovation in negative emission technologies, complementing its ongoing product advancements like sintering bonding films and lighter adhesive materials for CO2 emission reduction.