Broadcom Inc.
NASDAQ Global SelectCapital Structure
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in mil. unless spec.Company Description
- CEO
- Hock E. Tan
- Full Time Employees
- 20,000
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 1320 Ridder Park Drive San Jose CA United States of America 95131-2313
- IPO Date
- Sep 25, 2019
- CIK
- 0001730168
- Website
- broadcom.com
- Similar Companies
- Business
- Broadcom Inc. designs, develops and supplies a broad portfolio of semiconductor and infrastructure software solutions that serve the data center, networking, broadband, wireless, storage and industrial markets. The company offers semiconductor products including wireless communication chips such as Wi-Fi access point system-on-chips and Bluetooth solutions; Ethernet switching and routing silicon; optical and copper physical layer transceivers; broadband access products; storage adapters and controllers; custom touch controllers; PCI Express switches; industrial fiber optic modules; motion control encoders; and LED components; as well as infrastructure software encompassing enterprise security software, mainframe solutions, DevOps tools, virtualization platforms including VMware Cloud Foundation, cybersecurity systems and application development software. Broadcom operates globally with primary sales generated in Asia Pacific markets and targets hyperscale cloud providers, telecommunications equipment makers, smartphones, data center servers, enterprise networking and financial institutions. Founded in 1991 through predecessor companies including Avago Technologies and Broadcom Corporation, which merged in 2016, the company is headquartered in Palo Alto, California. Recent major developments include the November 2023 completion of its $61 billion acquisition of VMware, followed by the February 2024 divestiture of VMware's end-user computing division to KKR for $4 billion; an expanded strategic partnership with ING in December 2025 to deploy VMware Cloud Foundation 9.0 for private cloud modernization; a multi-year collaboration with OpenAI announced in October 2025 to deliver AI accelerators and network systems totaling 10 gigawatts; shipment of Wi-Fi 8 solutions tailored for AI demands; leadership in 200G/lane DSP PHY technology and PCIe Gen 6 portfolio for AI infrastructure; and a $10 billion order for XPU-based AI racks from a fourth qualified customer, with volumes starting in fiscal 2026, alongside accelerating AI semiconductor revenue growth to $5.2 billion in Q3 fiscal 2025.
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