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Indian Link Chain Manufacturers Ltd.

Indian Link Chain Manufacturers Ltd.

BBSE:INLCM
220.40
INR
-6.15
(-2.71%)
-1.17EPS
2.33BMarket Cap
Indian Link Chain Manufacturers Ltd.
BSE:INLCM
(Bombay Stock Exchange)

Recent

price

220.40

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
TTM
INR
0.17
0.81
2.65
2.5
4.56
5.04
18.33
14.03
8.39
15.65
4.41
- -
- -
- -
- -
- -
- -
Revenue per Share
-1.27
1.19
18.04
65.93
-4.73
-3.18
2.9
-0.33
9.58
-7.14
-7.76
-9.23
-9.13
1.82
2.19
-0.79
-1.17
Basic EPS, GAAP
18.85
-17.61
-7.5
-96.63
-1.82
-3.54
-0.83
-2.01
-18.8
-15.96
-14.04
-14.36
-11.2
-3.59
-4.72
-73.72
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
2.44
3.63
21.67
91.69
86.93
83.75
86.65
86.32
95.9
88.76
81
71.76
62.64
64.46
66.65
84.96
- -
Book Value per Share
2.44
3.63
21.67
91.69
86.93
83.75
86.65
86.32
95.9
88.76
81
71.76
62.64
64.46
66.65
84.96
- -
Tangible Book Value per Share
1
1
1
1
1
1
1
1
1
1
1
1
1
1
- -
3
2
Basic Weighted Avg Shares
- -
- -
1
1
2
3
9
7
4
8
2
- -
- -
- -
- -
- -
- -
Sales/Revenue/Turnover
-1,487.47
-211.02
-45.51
24.18
-160.44
-108.08
-17.05
-26.94
-94.04
-91.61
-310.2
- -
- -
- -
- -
- -
- -
Operating Margin (%)
- -
- -
- -
- -
1
1
1
1
1
- -
- -
- -
- -
- -
- -
- -
- -
Depreciation Expense
-1
1
9
33
-2
-2
1
- -
5
-4
-4
-5
-5
1
1
-2
-3
Net Income, GAAP
- -
30.32
45.2
30.93
- -
- -
- -
- -
45.79
- -
- -
- -
- -
- -
25.17
- -
- -
Effective Tax Rate (%)
-760.23
147.01
680.99
2,640.61
-103.84
-63.2
15.85
-2.35
114.19
-45.64
-175.79
- -
- -
- -
- -
- -
- -
Profit Margin (%)
-1
- -
10
11
8
7
7
-3
-9
-2
-2
25
13
-2
-2
- -
- -
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
LT Debt
1
2
11
46
43
42
43
43
48
44
41
36
31
32
33
227
- -
Total Equity
- -
38
142.62
116.33
- -
- -
- -
- -
7.87
- -
- -
- -
- -
- -
-3.05
- -
- -
Return on Invested Capital (%)
- -
38.05
142.63
116.36
- -
- -
- -
- -
10.51
- -
- -
- -
- -
- -
3.34
- -
- -
Return on Capital (%)
-41.33
39.17
142.62
116.33
-5.3
-3.73
3.41
-0.38
10.51
-7.74
-9.14
-12.09
-13.58
2.87
3.34
-1.62
- -
Return on Common Equity (%)

Capital Structure

INR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'27
ST Debt
- -
2
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
3
3
3
Market Capitalization
4,372
3,630
2,327

Working Capital

INR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'27
Total Current Assets
- -
13
- -
Cash, Cash Equivalents & STI
- -
2
- -
Accounts Receivable, Net
- -
- -
- -
Inventories
- -
- -
- -
Total Current Liabilities
- -
13
- -
Payables & Accruals
- -
- -
- -
ST Debt
- -
2
- -
Deferred Revenue
- -
- -
- -

Growth Rates

INR

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
56.22%
112.84%
582.03%
Free Cash Flow
908.76%
1,642.84%
8,270.59%
Net Income, GAAP
-384.53%
-74.95%
-292.78%
Sales/Revenue/Turnover
- -
- -
- -
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

INR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
2027
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

INR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
0.81
0.77
0.78
0.56
2.19
2026
0.55
- -
-0.59
-0.19
-0.79
2027
-0.26
- -
- -
- -
- -

Quarterly Dividends Per Share

INR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
2027
- -
- -
- -
- -
- -
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Business
Indian Link Chain Manufacturers Ltd. (rebranded as RRP Electronics India Ltd.) is an India-based technology and manufacturing company primarily engaged in outsourced semiconductor assembly and test (OSAT) services, electronics manufacturing, and legacy industrial product distribution. Founded in 1956 and headquartered in Mumbai, Maharashtra, India, the company has strategically transformed its operational focus from traditional mechanical chain fabrication and commercial trading to high-precision semiconductor packaging and advanced electronics engineering. The company operates across the semiconductor, electronics manufacturing services (EMS), and industrial engineering segments, serving commercial, industrial, aerospace, defense, automotive, and consumer electronics sectors. Its core products and service offerings comprise advanced outsourced semiconductor assembly and test (OSAT) solutions, including wafer-level packaging, integrated circuit (IC) encapsulation, die attach, wire bonding, and automated test operations; biometric and semiconductor components, featuring proprietary fingerprint sensor modules and microelectronic sub-assemblies; electro-optics and compound semiconductor devices, such as infrared detectors and optoelectronic modules engineered for aerospace and defense applications; electronics manufacturing services (EMS), including printed circuit board assembly (PCBA), surface-mount technology (SMT) manufacturing, and medical device electronics; and legacy industrial and commercial trading supplies, encompassing mild steel link chains, alloy steel load chains, calibrated material handling chains, industrial chemicals, and agro-commodities. In recent corporate developments, the company executed a transformative strategic shift by acquiring a controlling majority stake in RRP Electronics Limited, transitioning its core operations into India's semiconductor manufacturing ecosystem. Following this change in management and control, the entity completed a mandatory open offer under SEBI regulations, reconstituted its board of directors and executive leadership following the resignation of its former managing director and chief financial officer, and officially approved its corporate rebranding to RRP Electronics India Ltd. To support its technology expansion, the company has acquired critical intellectual property assets, technological know-how, and patents for fingerprint sensor modules while investing in cleanroom infrastructure and prototype fabrication facilities in Maharashtra to scale its domestic OSAT and semiconductor packaging capabilities.